Power FET outputs give two-phase stepper motors a boost Product News 8/28/2003 Post a comment Combining low-power CMOS logic with high-current, high-voltage power FET outputs, the Series SLA706xM translators/drivers from Allegro Microsystems Inc. provides a complete control and drive from a two-phase unipolar stepper motor with pulse-width modulation (PWM) control of the output current in a power multichip module.
6U backplane fits tight spots Product News 8/28/2003 Post a comment Bustronic Corp.'s "classic" 6U VME64x backplane offers system designers power taps for 3.3 volts, 5 V, plus/minus 12 V and GND above and below the slots, thus letting the backplane remain in a 6U height for applications that require the restricted size.
Notebook card fits USB 2.0, Firewire Product News 8/28/2003 Post a comment Orange Micro Inc.'s OrangeCombo card for PC and Macintosh laptops has two USB 2.0 ports, a six-pin Firewire port and a four-pin Fire-wire port, all of which can run simultaneously.
LAN filter device operates over an extreme temperature range Product News 8/28/2003 Post a comment Protecting 10/100Base-TX data-handling circuitry under extreme operating temperatures from -40 degrees C to 85 degrees C, the NT805T series LAN filter module from Datatronics is said to be compatible with the industry's most popular transceiver chip sets for military networking environments.
Metal-film fuses are surface-mountable Product News 8/28/2003 Post a comment Wickmann USA's newest FCD series surface-mount chip fuses use metal film technology on a heat-resistant and nonflammable ceramic substrate to offer what the company said is greater heat and shock tolerance than other glass-substrate surface-mount fuses.
Connector handles 100 signals/inch Product News 8/28/2003 Post a comment Expanding the Very High Density Metric interconnect platform, Teradyne Inc.'s Connection Systems Division, here, and Molex Inc. (Lisle, Ill.) are offering an eight-row version of the VHDM right-angle male connector.
TI battery chip set manages multi packs Product News 8/28/2003 Post a comment Texas Instruments Inc.'s newest battery management chip set is aimed at two-, three- or four-series cell battery packs used in portable medical appliances, notebook computers, and equipment for test and measurement and industrial applications.
Choke circuits have low dc resistance Product News 8/21/2003 Post a comment Two lead-free surface-mount, common-mode choke circuits from Vishay Intertechnology Inc. are said to feature lower dc resistance (DCR), higher current-handling capability and greater stability than multilayer common-mode choke circuits, thanks to a wirewound design.
Inductor line offers EMI protection Product News 8/21/2003 Post a comment A series of surface-mount, bobbin-style inductors from C&D Technologies Inc. offers designers enhanced design flexibility with integral electromagnetic-interference (EMI) protection.
Two-phase scheme used for dc/dc Product News 8/21/2003 Post a comment Using a new two-phase spread-spectrum switching architecture to minimize harmonics, Linear Technology's LTC3252 inductorless step-down dc/dc converter can deliver up to 250 milliamps of continuous current at each output.
Single-chip MCU does energy-metering duty Product News 8/21/2003 Post a comment A line of microcontrollers from Texas Instruments Inc. combines TI's MSP430 flash MCU core and an analog front end for manufacturers developing electronic energy meters with sophisticated features such as automated meter reading, smart-card prepayment and multiple-rate billing.
Chips charge up for lithium-ion Product News 8/21/2003 Post a comment A variety of linear and switch-mode chips continues to emerge in the IC battery charger market, triggered by shrinking real estate requirements and the need for improved thermal management in charging lithium-ions, today's battery of choice.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.