CPCI backplane blade boosts processing power Product News 9/11/2003 Post a comment Communication applications are rapidly converging on packet-based architectures. The Katana3750, a CompactPCI packet-switching backplane processing blade from Artesyn Communication Products, is said to provide the performance needed for the complex, real-time tasks native to the packet paradigm.
Integrated passives roll out lead-free Product News 9/11/2003 Post a comment California Micro Devices will introduce what the company calls a pioneering complete product portfolio of lead-free (Pb-free) application-specific integrated passives (ASIP) products for wireless handsets and personal digital assistants (PDAs).
Surface-mountable LEDs erase through-hole pcbs Product News 9/11/2003 Post a comment The SMPT series of surface mount LEDs from the BivarOpto Division of Bivar Inc. has been designed to be used with the company's Flexible Light Pipes (FLP Series), thus eliminating the need for through-hole printed-circuit boards.
SAW oscillator eyes Sonet applications Product News 9/11/2003 Post a comment Connor-Winfield Corp. says its VSPLD63TE voltage-controlled SAW oscillator (VCSO) combines low cost and the lowest jitter rating for a 622.08-MHz oscillator for Sonet and SDH telecom equipment.
Connectors fit SCSI, serial ATA formats Product News 9/11/2003 Post a comment Fujitsu Components America Inc. has expanded its high-speed, differential-connector microGiGaCN line to include an I/O plug with thumbscrews, which is a standard I/O for serial-attached SCSI, serial ATA and 10-Gbit Fiber Channel.
Receiver IC replaces discretes Product News 9/11/2003 Post a comment Micrel Semiconductor's MICRF008 RF receiver IC has been designed as a low-cost alternative to discrete super-regenerative receivers and one that eliminates the need for production tuning.
Dual-gate driver sinks 5 amps or delivers 3 Product News 9/11/2003 Post a comment National Semiconductor says its LM5110 dual-gate-driver chip delivers 3 amps or sinks 5 amps peak current, the highest output yet available for n-channel power MOSFETs in switch mode and low-threshold synchronous rectifiers, solenoid and motor drivers and power level shifters.
Power, thermal management unite Product News 9/11/2003 Post a comment In yet another variation of the one-stop shop, power supply vendors are increasingly taking the first steps toward developing their own brand of standalone cooling products at the systems level.
Bulk metal foil resistor nets have low TCR tracking Product News 9/4/2003 Post a comment Vishay Intertechnology Inc. says its ultraprecision bulk metal foil resistor networks provide a tracking thermal coefficient of resistance (TCR) of 1 ppm/ degrees C and stability of 0.01 percent at 0.1 watt in a small-outline, eight-pin Jedec MS-012 package.
Protection series integrates TVS parts Product News 9/4/2003 Post a comment A family of five protection devices from ON Semiconductor integrates multiple transient-voltage-suppression (TVS) components into a single 1.6 x 1.6 x 0.6-mm SOT-553 or SOT-563 package.
Capacitor arrays tout fast decoupling Product News 9/4/2003 Post a comment With inductance values as low as 15 picohenries, AVX Corp.'s LICA capacitor arrays perform high-speed decoupling for multiple signal paths in high-frequency switching applications.
Small inductors have high energy density Product News 9/4/2003 Post a comment Pulse Engineering Inc. has high-efficiency, high-frequency shielded inductors for multiphase voltage regulator modules. Packaged in a 7 x 7 x 5-mm footprint, the PA051X series is said to offer more than twice the energy storage density (microjoules/mm3) of other inductors of comparable size, thus minimizing ac and dc losses.
Downconverter aims at satellite set-tops Product News 9/4/2003 Post a comment Intersil says its ISL6405 dual-output low-noise block (LNB) downconverter supply and control voltage regulator IC can save board space, parts count and cost for satellite set-top-box manufacturers.
Components tap WLAN chip sets Product News 9/4/2003 Post a comment Driven by suppliers of wireless-LAN chip sets, passive-component manufacturers are developing innovative devices and technologies to meet the requirements for high-performance characteristics such as quality, or "Q," factor, equivalent-series resistance (ESR) and small packaging in the WLAN.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.