GE Fanuc expands VPX line Product News 9/6/2007 Post a comment GE Fanuc Embedded Systems announced the SBC310, the first 3U VPX single board computer to feature Freescale's dual-core PowerPC 8641D and provide support for a PMC/XMC site.
CellMetric debuts mobile TV test systems at IBC Product News 9/5/2007 Post a comment CellMetric, a Cambridge, England-based start up focusing on RF test and mobile video infrastructure hardware and software, is launching a DVB-H composer application to generate test transport streams at the International Broadcasting Convention in Amsterdam.
CSR raises the bar again on Bluetooth performance Product News 9/5/2007 Post a comment CSR has launched its sixth generation of BlueCore silicon for Bluetooth. The BC6-ROM chip has been specifically designed to offer better voice quality, lower power consumption, better RF performance, a smaller BOM, smaller footprint, and easy host interfacing.
Step-down regulator delivers 12 A Product News 9/5/2007 Post a comment Linear Technology has introduced the LTC3610, a high-efficiency, synchronous buck regulator that can deliver up to 12 A of continuous output current at voltages as low as 0.6 V.
Vivace launches VSP100 design tools Product News 9/4/2007 Post a comment Vivace Semiconductor has announced the availability of its VSP100 development and integration systems for the high-performance VSP100 media processing chip, aimed at consumer mobile applications.
S3, Sofia Digital team on mobile TV for O2 Product News 9/4/2007 Post a comment Silicon & Software Systems Ltd. (Dublin, Ireland), a supplier of software, circuits and design services, has teamed up with television technology supplier Sofia Digital Oy (Helsinki, Finland) and delivered some Java-based software for mobile television to O2, the mobile communications arm of Telefonica.
Inova, Fujitsu, BMW team for automotive multimedia bus Product News 9/4/2007 Post a comment Fabless chip vendor Inova Semiconductors and Fujitsu Microelectronics Europe have joined forces to establish Inova's APIX serial communications technology as a standard for graphics display interconnects. Car maker BMW has indicated it is interested in the technology.
Ex-Motorola group ships 90-nm MDTV receiver chip Product News 9/4/2007 Post a comment Abilis Systems, a subsidiary of security and digital rights management company Kudelski SA (Cheseaux-sur-Lausanne, Switzerland) originally formed by former Motorola SPS engineers, has started shipping a single-chip DVB-T mobile digital television (MDTV) receiver. The AS-102 is suitable for use in personal portable devices and is made using a 90-nm manufacturing process, the company said.
Perpetuum designs battery-less wireless sensor around TI Product News 9/4/2007 Post a comment Perpetuum Ltd., a startup company developing energy harvesting devices, has said its PMG17 electricity microgenerator can be used to power a CC2420 single-chip RF transceiver and MSP430 16-bit microcontroller, both from Texas Instruments Inc. (Dallas, Texas).
GaAs chip integrates Wi-Fi, Bluetooth RF front ends Product News 9/3/2007 Post a comment Check out ANADIGICS' front-end ICs that offer a high level of GaAs on chip integration by incorporating a power amplifier (PA), a low-noise amplifier (LNA), a Bluetooth path, and an RF antenna switch all in a single low-profile package measuring 3 mm x 3 mm x 0.55 mm.
TTTech mulls deploying FlexRay beyond automotive Product News 9/3/2007 Post a comment TTTech Computertechnik AG (Vienna) plans to widen the scope of time-triggered communications technology beyond its strongholds in automotive, aerospace, and off-highway industries. Industry automation could be another interesting field of activity, believes TTech CEO Stefan Poledna.
Applied showcases large-area solar module production line Product News 9/3/2007 Post a comment With a new integrated production line for large-area solar panels, Applied Materials claims it can reduce the costs of photovoltaic system installations by more than 20 percent. The SolarFab Thin Film Line production system is presented at the European Photovoltaic Solar Conference presently held in Milan, Italy.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.