GE supports Nvidia for mil-aero markets Product News 9/20/2010 3 comments A unit of electronics giant GE has released hardware and software products supporting Nvidia graphics chips for general-purpose computing in military and aerospace markets.
Open frame, slim panel computers from Axiomtek fit any space Product News 9/19/2010 Post a comment The new FDK series open frame panel computer from Axiomtek, comprising the FDK150-830, FDK170-830 and FDK190-830, is designed for quick and easy integration with indoor kiosk and HMI automation applications. Designed for configuration flexibility, its slim ID fits into any space and can be encased in any chassis.
SmartFusion A2F500 dev kit available from Actel Product News 9/16/2010 5 comments The folks at Actel have just announced the availability of their A2F500 Development Kit for customers wanting to take immediate advantage of the highest density member of their SmartFusion intelligent mixed-signal FPGA family.
TZ1090 XENIF SoC integrates broadcast receiver, Wi-Fi and apps processor Product News 9/15/2010 Post a comment The TZ1090 XENIF from Toumaz is an advanced 32-bit processor based System-on-Chip (SoC) with integrated broadcast and connectivity. The XENIF is designed to be a highly competitive, cost-effective solution for advanced cost engineered digital radios, Wi-Fi-connected photo frames and Internet-connected consumer devices.
ADLINK launches PXI-2022/2020 PXI DAQ modules Product News 9/15/2010 Post a comment ADLINK Technology, Inc., has released its PXI-2022/2020 high-density simultaneous sampling PXI DAQ (data acquisition) boards. As the latest addition to ADLINK’s extensive lineup of DAQ boards, the PXI-2022 and PXI-2020 provide 16-bit simultaneous sampling of devices at sample rates of 250 kS/s per channel across sixteen and eight channels, respectively. The new boards are designed for applications that require simultaneous sampling over multiple channels, such as advanced physical research, rada
MathWorks upgrades system design tool Product News 9/15/2010 Post a comment MathWorks has announced major new capabilities for MATLAB and Simulink, claiming that the SimRF product lets system architects use Simulink to design and verify complete wireless communication systems with true-to-form RF subsystem models and advanced circuit-envelope and harmonic-balance methods.
Aurora SBC features Intel Atom and conduction cooling in tiny package Product News 9/14/2010 Post a comment Diamond Systems Corp. is touting their Aurora single board computer (SBC) a much-needed technological breakthrough in small form factor (SFF) embedded computing. Featuring the 1.6GHz AtomTM Z530 processor from Intel, Aurora boasts a tiny 3.6x3.8" PC/104 form factor and conduction cooling, making it half the size, weight, power and cost compared to legacy VME and PC/104 SBCs.
congatec's Ultra-Mobile Module features Intel Atom E6xx Product News 9/14/2010 Post a comment congatec AG has announced conga-QA6, an extended temperature range small form factor module. The conga-QA6 is based on the Qseven mobile standard and is equipped with the new Intel Atom processor E6xx Series as well as the Intel Platform Controller Hub EG20T.
Peregrine Semiconductor's PE42662 SP6T RF switch Product News 9/14/2010 1 comment This RF switch from Peregrine brings design flexibility to 3G front-end module manufacturers by incorporating six fully symmetric transmit ports that allow designers to configure any combination of transmit/receive ports for GSM, EDGE and WCDMA.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.