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IBM's Watson Does Deep-Learning Too
News & Analysis  
3/5/2015   3 comments
IBM Corp. recently acquired AlchemyAPI for its "deep learning" capabilities, giving Watson the ability to perceive hierarchies of knowledge instead of just individual facts.
Qualcomm CTO on LTE-U, 5G Challenges
News & Analysis  
3/4/2015   6 comments
EE Times caught up with Matt Grob, Qualcomm CTO. We asked the why’s and wherefore’s of LTE-U. Further, we asked what challenges he sees for the yet to be defined 5G standard, which is said to go beyond faster speed.
Low-Power Wireless MCUs Proliferate
News & Analysis  
3/4/2015   Post a comment
Wireless device developers now have a new range of RF options that are low-power and easy to design with.
Engineers on Creating Better Technical Documentation
News & Analysis  
3/4/2015   Post a comment
Everyone benefits from good documentation. So why does so much of it suck, and how can companies do better?
2D Material Beats Graphene
News & Analysis  
3/4/2015   2 comments
Black phosphorus is a 2D material with advantages over graphene, including a variable bandgap and other photonics characteristics.
5G Researchers Seek Spectrum
News & Analysis  
3/4/2015   Post a comment
Next generation cellular communications will need to exist in current frequency bands as well as ultra-dense networks that stretch from below 6 GHz to 100 GHz in order to serve a variety of use cases and industries. For some industry officials, standardization can't come soon enough.
Parrot Takes Instant 3D Mapping to the Sky
News & Analysis  
3/4/2015   Post a comment
On Nvidia's booth at embedded world, a robot arm was swinging a stereo camera assembly, in a drone-like fashion, demonstrating Parrot’s software capabilities to turn cheap stereovision into real-time 3D mapping using nVidia’s Jetson TK1 development kit.
IBM Slumps, Cisco Gains In 2014 Server Sales
News & Analysis  
3/4/2015   Post a comment
Gartner annual report on server shipments and revenue sees Cisco, Lenovo gaining share, IBM, HP losing ground.
FCC Chief at MWC: 'No One Blocks Internet'
News & Analysis  
3/3/2015   6 comments
FCC Chairman Tom Wheeler, at the Mobile World Congress, compared the FCC's controversial Open Internet Rules to the First Amendment and said, “No one blocks the Internet.”
NXP CEO: ‘Security, IoT, Cars’ Drove Freescale Deal
News & Analysis  
3/3/2015   1 comment
NXP CEO spoke with on the overlapping businesses with Freescale, once the merger goes through. Products that don’t belong to NXP’s focus on “security and connectivity with a smarter world” are Freescale’s network processors and NXP’s standard products.
Spectrum, 5G in MWC Spotlight
News & Analysis  
3/3/2015   1 comment
To avoid a massive and unruly cellular frequency shakeup, a panel experts from the cellular, satellite, broadcasting, and networking industries discussed at the Mobile World Congress how to best use spectrum, especially for 5G cellular.
IoT Security a Prime Focus for Freescale
News & Analysis  
3/3/2015   Post a comment
Security is a major concern in the Internet of Things, and Freescale intends to provide developers with the answers.
Rohde & Schwarz Highlights 5G Tester at MWC
News & Analysis  
3/3/2015   Post a comment
To support designers and developers in research activities, Rohde & Schwarz (R&S) has developed a test setup for bandwidth-hungry applications in the millimeter wave range.
Unleash The Power of JavaScript For IoT
News & Analysis  
3/3/2015   5 comments
Marvell has open-sourced its software crown jewel, KinomaJS. Marvell, which has been using JavaScript-based Kinoma, developed by ex-Apple Team, hopes to accelerate IoT development by making it open source.
IBM, Semtech 30-Mile IoT Uses 10-Year AAs
News & Analysis  
3/3/2015   13 comments
IBM and Semtech go long into machine-to-machine (M2M) working with open standards LoRa (long-range) Alliance to put serious distance between sensors and the cloud.
Graphics API Gets Makeover
News & Analysis  
3/3/2015   Post a comment
With new proprietary graphics interfaces out from AMD, Apple and Microsoft, Khronos Group is previewing Vulkan as an open follow on to OpenGL.
Altium Updates High-Speed PCB Design Tool
News & Analysis  
3/3/2015   Post a comment
Altium next update to its flagship PCB design tool, Altium Designer 15.1, introduces new features the company says improves design productivity, documentation outputs, and high-speed design efficiency.
Chip Market Contracts in Europe, January
News & Analysis  
3/3/2015   Post a comment
The three-month average European chip market contracted in January 2015 when compared with same period in 2014, in contrast to the global market increased by 8.7 percent, according to the Semiconductor Industry Association (SIA), reporting data compiled by the World Semiconductor Trade Statistics (WSTS) organization.
Telcos Demand 'Digital Neutrality'
News & Analysis  
3/2/2015   8 comments
Telco operators at Mobile World Congress called for a “level playing field” with apps/service providers such as Google, Facebook and Amazon.
Spansion Adds RAM to HyperBus
News & Analysis  
3/2/2015   Post a comment
Combination of new HyperRAM and HyperFlash connected to a common HyperBus interface reduces pin counts and means smaller packages for use in automotive and Internet of Things devices
Embedded Job Market Expands, But Boomers Feel the Squeeze
News & Analysis  
3/2/2015   10 comments
By almost any measure, the job market appears to be looking very good right now for embedded engineers. But not for everyone.
NXP, Freescale: Bigger Not Better
News & Analysis  
3/2/2015   13 comments
The proposed merger of NXP and Freescale creates a embedded chip vendor that is significantly bigger than most, but not all, its rivals and not substantially different.
Intel Tablet SoCs Pack LTE
News & Analysis  
3/2/2015   12 comments
Intel announced a new family of SoCs and modems for mobile devices under its Atom brand, targeting low to premium markets. The chip giant hopes to win a large share of the mobile space with highly integrated processors and excellent graphics.
Asian Share of Global Fab Capacity May Top 69% by 2019
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3/2/2015   Post a comment
Asia is expected to account for a new record, nearly 70% of the world's fab capacity, by 2019, according to a new report from IC Insights.
Base Stations Go Virtual, Flexible
News & Analysis  
3/2/2015   Post a comment
Several major players in the base station market have are trying to solve the problem of increasing data rates and the need for speed with a variety of configurable small and macro cells. Alcatel-Lucent, Aquantia, and Qualcomm each announced chip sets and software that harness new cellular bands and spectrum.
Imagination Dons Wearable GPU
News & Analysis  
3/2/2015   1 comment
Imagination Technologies announced a suite of video IP cores for the next generation of graphic displays at Mobile World Congress. Alongside a set of video encoder cores, the UK company also announced a new PowerVR GPU for mobile and wearables.
Freescale Unveils Vision SoC for Accident-Free Cars
News & Analysis  
3/2/2015   Post a comment
Freescale has unveiled an automotive vision system-on-chip. Besides advanced vision algorithms and sensor data fusion features, the new SoC provides protection against external wireless attacks, a much needed feature in the era of “Connected Cars.”
NXP, Freescale Plan Mega Merger
News & Analysis  
3/1/2015   19 comments
NXP bid to acquire Freescale to create a $10 billion embedded chip giant that would be a world leader in automotive chips and microcontrollers.
Porsche Rainmaker Advocates Platooning
News & Analysis  
3/1/2015   2 comments
By driving in a platoon -- or platooning -- drivers can help maximize throughput of motorways without high investments into traffic infrastructure, says a Porsche executive.
Samsung Phones Pack 14nm SoC
News & Analysis  
3/1/2015   3 comments
Samsung will pack a handful of new technologies -- including a 14nm Exynos applications processor -- into its new Galaxy S6 and S6 Edge smartphones announced here. The handsets also sport a new fast-charging battery, novel memory stack, simplified user interface, and advanced camera features.
Freescale, Cisco, Ciena Give Nod to FD-SOI
News & Analysis  
3/1/2015   1 comment
Freescale, Cisco and Ciena have defied the general skepticism of fully-depleted silicon-on-insulator by revealing their own experience with the process technology, creating expectations that more companies might follow.
MediaTek Sails Uncharted Waters With CrossMount
News & Analysis  
3/1/2015   Post a comment
MediaTek has revealed a new cross-device sharing technology called “CrossMount.” With the proposal of a new industry standard that’s royalty-free and open to all comers, MediaTek sails uncharted waters.
3D Printing Everywhere from Lab to Factory
News & Analysis  
3/1/2015   Post a comment
3D printers have moved out of the toy store and onto the factory floor, at Local Motors, and into the physic lab, at Princeton University.
MediaTek Wrestles ARM A72 into Tablets
News & Analysis  
3/1/2015   Post a comment
Taiwanese chipmaker MediaTek announced a new tablet SoC based on ARM’s new Cortex-A72 processor. The chipset is designed to be a "workhorse" for media and enterprise.
Graphene Polymer Speeds Electron Transport
News & Analysis  
2/27/2015   Post a comment
Depositing conducting polymers on graphene gives then highly desirable electrical properties, flexibility and strength for future flexible electronics, organic solar cells, protective coatings and other practical applications.
Web Giants Drive Road Maps
News & Analysis  
2/27/2015   1 comment
Big data centers such as Amazon, Google and Facebook are having outsized influence on everything from optical interconnects to the future of hard disk drives and solid-state memory.
IoT Terrain Still Shifting
News & Analysis  
2/27/2015   3 comments
The Internet of Things continues to fragment with competing networks and frameworks from 6LoWPAN to Zigbee, Apple Homekit and Google’s Thread.
Infineon: CAN FD Success Goes at Expense of FlexRay
News & Analysis  
2/27/2015   Post a comment
The faster version of the venerable CAN bus, CAN FD is currently taking off at several carmakers. Infineon's Thomas Böhm, Head of Body / Automotive, believes this could well go at the expense of FlexRay.
Apple's March 9 Event: Is It Time For The Apple Watch?
News & Analysis  
2/26/2015   Post a comment
Apple fans and non-fans alike are waiting to "watch" what happens. Let the speculation begin.
Tessera Buys Smart Sensors for Iris Recognition
News & Analysis  
2/26/2015   Post a comment
FotoNation Limited, a wholly owned subsidiary of chip packaging company Tessera Technologies Inc. (San Jose, Calif.) has acquired Smart Sensors Ltd. (Bath, England), a developer of iris recognition biometric technology.
Hi-Speed Transistors from Liquid Processing
News & Analysis  
2/26/2015   10 comments
A University of Chicago lab has invented a new kind of solder that can electronically join disparate semiconductors that were impossible to solder before plus print crystalline-like high-speed transistors as well as revolutionize 3-D printing.
Radar Can't Spot Mystery Drones over Paris
News & Analysis  
2/26/2015   4 comments
Unidentified drones were spotted in the skies above Paris two nights in a row this week. The French authorities don’t know who is controlling them, the number of drones involved, or even if they were all coordinated.
IoT Starter Kit Connects Developer to Cloud in Moments
News & Analysis  
2/26/2015   1 comment
Seeking to simplify the prospect of creating an IoT prototype that is web connected, ARM has partnered with IBM to provide an end-to-end, out of the box dev kit.
Benchmark Stresses Big Chips
News & Analysis  
2/26/2015   6 comments
The EEMBC consortium rolled out CoreMark-Pro, a benchmark suite for 32- and 64-bit chips, an extension of its six-year old test for MCUs and CPUs.
Mesh Comes to Bluetooth
News & Analysis  
2/25/2015   6 comments
Expect Bluetooth to add mesh networking technology later this year. The Bluetooth SIG’s fast-track effort is a testament to the groundswell of interest in the technology. But it can also be viewed as a pre-emptive strike against the Thread Group.
5G Horizon Seen at ISSCC
News & Analysis  
2/25/2015   3 comments
Research on 5G is coming to a head as companies prepare to make proposals next year that will shape the next-generation cellular standards, said experts at an ISSCC panel.
Flex Logix Introduces FPGA IP Cores for SoC Designs
News & Analysis  
2/25/2015   1 comment
The EFLX FPGA fabric allows things like I/O protocols, encryption algorithms, radio filters, and other "fixed" functions to be upgraded on-the-fly.
Flash for Even Commodity Servers
News & Analysis  
2/25/2015   Post a comment
SolidFire claims to be the leading vendor of flash hardware systems for high-performance systems and servers, but now its marketing its software-only to marry your own hardware to your own flash making it affordable even by the smallest-servers.
LTE IoT Specs Anticipated in Chips
News & Analysis  
2/25/2015   1 comment
Altair Semiconductor hopes to drive the machine to machine market toward 4G LTE with two chip sets based on early 3GPP standards. Whether the Internet of Things needs cellular remains to be seen.
5 Trends to Watch at Mobile World Congress
News & Analysis  
2/25/2015   4 comments
Anything and everything in the world that demands wireless connectivity – cars, phones, homes, retail transactions, factories, buildings, wearables, public transportation systems, you name it – is descending upon the Mobile World Congress next week in Barcelona.
Page 1 / 2   >   >>


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Max Maxfield

Musings With Regard To Being a One-Armed Engineer
Max Maxfield
7 comments
I had a bit of a scare recently. It gave me pause for thought, and the thought at the forefront of my mind was: "If I were to lose my left arm, how would this impact my ability to create ...

Martin Rowe

Leonard Nimoy, We'll Miss you
Martin Rowe
5 comments
Like many of you, I was saddened to hear the news of Leonard Nimoy's death. His Star Trek character Mr. Spock was an inspiration to many of us who entered technical fields.

Rajaram Regupathy, Cypress Semiconductor

Add USB Battery Charging Protocols to an Android-Based Design
Rajaram Regupathy, Cypress Semiconductor
Post a comment
Editorial Note: Excerpted from Unboxing Android: A hands on approach with real world examples, by Rajaram Regupathy, the author takes you through the process incorporating effective power ...

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
16 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

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