SPD Codes Continue to Find Role News & Analysis 8/26/2016 Post a comment JEDEC's JC-45 Committee has approved the 2016 annual release of codes for the SPD for DDR4/DDR4E and for LPDDR3/LPDDR4. What does it mean for device designers?
Auto Cybersecurity Dissected: Who, Where & What News & Analysis 8/25/2016 Post a comment The automotive industry’s change in perception on cybersecurity, compared to just a year ago, is seismic. We attempt to break down the layers of automotive cybersecurity. We identify where such software will reside, its functions and likely evolution.
Power9 Opens IBM to Partners News & Analysis 8/24/2016 2 comments IBM’s Power9 processor reaches out to new OEMs and partners with multiple interconnects and variants of the chip, according to a talk at Hot Chips.
AMD Reveals Zen of X86 News & Analysis 8/24/2016 Post a comment AMD detailed Zen at Hot Chips, its next-generation x86 core aimed at head-to head competition with Intel in everything from notebooks to servers.
SiC Muscles Rohm into Auto Biz News & Analysis 8/24/2016 Post a comment Rohm, a Japanese component vendor whose business could be harmed by the steady decline in market share among leading Japanese CE vendors, has good reason to sweat its own prospects. But Rohm says it has a clear growth strategy.
Renesas Sets Sights on Intersil News & Analysis 8/23/2016 Post a comment Renesas Electronics is “in the final stages of negotiations to acquire Intersil,” reported the Japanese economic newspaper Nikkei Monday. Neither Renesas nor Intersil is confirming the report at this time.
ARM Reaches for Supercomputers News & Analysis 8/22/2016 1 comment New vector extensions for 64-bit ARM cores aim to take the company into the highest reaches of supercomputer performance with partners including Fujitsu.
Laser Slicing to Slash SiC Wafer Costs, Boost Yield News & Analysis 8/22/2016 1 comment Japanese ingot processing equipment manufacturer DISCO Corporation has unveiled a new laser-based technique to slice wafers out of a SiC ingot, producing 50% more wafers through reduced material losses while slashing production times by a factor of six.
‘Interscatter’ Tech Lets Implants Talk Wi-Fi News & Analysis 8/19/2016 Post a comment University of Washington researchers have developed what they call “interscatter communication” technology that backscatters (or reflects) existing signals like Bluetooth in the air, transforming wireless transmissions from one technology to another.
Rivals Chasing Velodyne in Lidar Race News & Analysis 8/18/2016 5 comments Velodyne unveiled a combined $150 million investment from co-investors Ford Motor Company and China’s Baidu. A growing number of startups are now chasing Velodyne, the most experienced and best funded lidar tech company.
Watson for the Masses News & Analysis 8/18/2016 1 comment The Columbus-Collaboratory has integrated IBM's Watson into the R programming language with its CognizeR.
E-Retailers Automate Fulfillment News & Analysis 8/17/2016 5 comments The co-robot company InVia Robotics Inc. has invented robots-as-a-service whereby warehouses pay a fee, per co-robot, to use its GrabIt and TransIt co-robots to pick items from the shelves and deliver them to the mailroom.
Was DOS copied from CP/M? News & Analysis 8/17/2016 5 comments For decades, a rumor has persisted that DOS was illegally copied from CP/M and that the fortune accumulated by Bill Gates rightfully belonged to Gary Kildall.
Toyota Partners with Taxi for Automated Driving News & Analysis 8/17/2016 Post a comment Toyota Motor Corp and the Japan Federation of Hire-Taxi Associations have entered into a memorandum of understanding for the development of autonomous driving technologies, aiming to introduce a new vehicle targeted at taxi operators by 2017.
Osram to Focus on Semiconductors Again News & Analysis 8/17/2016 Post a comment Newly named Ledvance (since July 2016), Osram's general lighting lamps business is to be acquired by a Chinese consortium consisting of the strategic investor IDG, the Chinese lighting company MLS and the financial investor Yiwu, for just over €400 million.
Micron Moves 3D NAND Into Mobile News & Analysis 8/16/2016 Post a comment Micron's first foray into mobile 3D NAND is a 32GB offering aimed at the high and mid-end smartphone segment and is the first to use the Universal Flash Storage 2.1 standard
EPA Crowdsources Pollution Sensing News & Analysis 8/11/2016 Post a comment The Environmental Protection Agency (EPA) is issuing $4.5 million in grants to six universities to deploy air pollution sensor networks and educate the public how to use them to reduce it.
Cypress New CEO to Bring ‘Outsider’ Perspective News & Analysis 8/11/2016 3 comments Cypress’ new CEO said that the key to success for a semiconductor company is to “become relevant to your customers.” Cypress hopes to become “a tech company that customers want to partner with,” he said.
DRAMs to drag ICs to -2% in 2016 News & Analysis 8/11/2016 Post a comment The latest version of The McClean Report projects a 19% decline in DRAMs due to falling PC and tablet sales, dragging total IC revenues to a 2% contraction in 2016.
Samsung Debuts 3D XPoint Killer News & Analysis 8/11/2016 5 comments Samsung announced Z-NAND, a 3D flash variant it says will have similar performance and lower cost in solid-state drives than Micron Quantx SSDs.
Will Next Tesla Speak Mandarin? News & Analysis 8/10/2016 1 comment China’s dream of creating the “next Tesla” is generating a global rush to develop and manufacture EVs in China. How much of this enthusiasm is an inflated reality created by Chinese audacity, however, remains to be seen.
IBM Lab on Chip Detects Cancer News & Analysis 8/10/2016 4 comments IBM Research has designed a microfluidic lab-on-a-chip that can separate biological particles down to sizes as small as 20-nanometers to screen for cancer markers so small that a tumor has not even started to grow.
Micron demos 3D XPoint in drives News & Analysis 8/9/2016 2 comments Micron showed prototype solid-state drives using its 3D XPoint memories with data for their performance as Toshiba talked about NAND flash advances.
OLEDs to beat LCDs in smartphones by 2020, says IHS Markit News & Analysis 8/9/2016 2 comments Although liquid-crystal display (LCD) has dominated mobile phone displays for more than 15 years, organic light-emitting diode (OLED) display technology is expected to become the leading smartphone display technology in 2020, according to IHS Markit's recent figures.
2-D PV to Rival Graphene News & Analysis 8/8/2016 1 comment Department of Energy (DoE) funded researchers have discovered that thinning out the photovoltaic (PV) material called halide perovskite could provide a high-mobility high-power material for future transistors that rivals graphene, but is easier to fabricate.
Murata’s Playbook: Smartphones, Auto, Battery News & Analysis 8/8/2016 3 comments The new hope for Japan’s electronics industry is component suppliers who started out making lowly components. We sat down with Murata’s executive vice president and asked him about its post-smartphone strategy, why it wants Sony’s lagging battery business.
Big Three Chipmakers Likely to Boost Capex News & Analysis 8/8/2016 1 comment The big three chipmakers — Intel, Samsung and TSMC — are likely to increase capital expenditures during the second half of this year while the rest of the semiconductor industry tightens the belt, according to a market research firm.
Tiny Solar Cells Could Power Personal Devices News & Analysis 8/5/2016 Post a comment Researchers at the University of Wisconsin-Madison have created high-performance, micro-scale lateral solar cells that could be used for wearable medical sensors, smartwatches, and even auto-focusing contact lenses.
Next-Gen IoT Consortium Launches News & Analysis 8/5/2016 4 comments Singapore's Institute of Microelectronics (IME) to form a consortium for microelectromechanical system (MEMS, including Delta Electronics, Inc., InvenSense Inc., Standing Egg Inc., STATS ChipPAC Limited, ULVAC, Inc.) and silicon photonics packaging breakthroughs (including Accelink Technologies Co., Ltd., Corning Incorporated, Fujikura Ltd., Fraunhofer Heinrich Hertz Institute and NTT).
GaN Power Amplifier Addresses 5G News & Analysis 8/5/2016 2 comments Researchers in Germany have developed one of the building blocks required to roll out 5G networks: An integrated circuit for power amplifier transistor implemented in gallium nitride technology.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.