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Content posted in January 2010
<<   <   Page 13 / 13
November's averaged global chip sales beat expectations
News & Analysis  
1/4/2010   Post a comment
The three-month average of global sales of semiconductors rose to $22.645 billion in November, ahead of expectations, and up 8.5 percent on the same figure in November 2008, according to the European Semiconductor Industry Association.
Enel Green Power, Sharp and STMicroelectronics sign Italian triple-junction thin-film photovoltaic panel deal
News & Analysis  
1/4/2010   Post a comment
Enel Green Power, Sharp and STMicroelectronics have signed an agreement for the manufacture of triple-junction thin-film photovoltaic panels in Italy.
Bus access cable for the boundary scan plattform Scanflex
Product News  
1/4/2010   Post a comment
Goepel electronic announced the BAC 9305-RS422/485, another bus access cables (BAC) to complete its JTAG/boundary scan hardware platform Scanflex.
ST, Sharp, Enel partner to produce thin-film PV panels
Product News  
1/4/2010   Post a comment
STMicroelectronics NV, Sharp Corp. and Enel Green Power SpA have joined forces to manufacture triple-junction thin-film photovoltaic panels at ST's M6 facility in Catania, Italy.
Measuring contact pressure variations across flip chip dies
Product News  
1/4/2010   Post a comment
Sensor Products highlights the benefits of its Pressurex pressure-indicating sensor film as a convenient and repeatable, low cost control means for both bonding and coplanarity.
UV-cured temporary adhesive, removed without surface contamination
Product News  
1/4/2010   Post a comment
Master Bond’s UV14-3 is a temporary bonding adhesive that has a fast UV cure ideal for automated, non-permanent adhesive assemblies.
Top 25 predictions for semis in 2010
News & Analysis  
1/4/2010   9 comments
Looking into my crystal ball, I have released my own chip forecasts--and other predictions--for 2010. These are my top 25 predictions, which are strictly my opinions.
Video: What to expect at CES 2010
News & Analysis  
1/4/2010   Post a comment
In a video preview of the Consumer Electronics Show, editor-at-large Rick Merritt shares his thoughts about what to look for at CES this week including analysis of 3DTV, e-books, smartbooks and wireless video.
Spansion embroiled in $1B dispute with Japan unit
News & Analysis  
1/2/2010   Post a comment
Spansion is embroiled in a $1 billion foundry dispute with its estranged Japanese unit, according to a new filing with the U.S. Securities and Exchange Commission (SEC).
SOFTWARE TOOLS - TTE-Protocol Layer enables integration of non-critical and critical data traffic
News & Analysis  
1/2/2010   Post a comment
TTE-Protocol Layer enables integration of non-critical and critical data traffic, and provides a software-based node for TTEthernet.
MCUs - 18-pin PIC MCUs feature Enhanced 8-bit Core, low power consumption
Product News  
1/2/2010   Post a comment
Microchip's 18-pin PIC MCUs feature Enhanced 8-bit Core, low power consumption, and provide higher speeds and lower cost than legacy PIC MCUs.
<<   <   Page 13 / 13


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