MIPS licenses architecture to SandCraft News & Analysis 10/28/1999 Post a comment MIPS Technologies Inc. said that SandCraft Inc. has received a comprehensive intellectual property (IP) license to use the MIPS32 and MIPS64 processor architectures in its own processor designs.
IBM, Infineon open trench warfare over 1-Gbit design News & Analysis 10/28/1999 Post a comment IBM Microelectronics and Infineon Technologies have developed a base technology for 1-gigabit DRAMs that researchers at other DRAM makers are still scrambling to achieve. The development completes work that had been started years ago, and provides further evidence that trench-cell capacitor DRAMs will have a long lifeline, according to IBM. The work could also give the companies a key tool in their efforts to build embedded DRAM parts.
C-Cube announces sale of DiviCom subsidiary News & Analysis 10/28/1999 Post a comment C-Cube Microsystems Inc. announced a definitive agreement Thursday (Oct. 28) to sell its DiviCom subsidiary to Harmonic Inc. (Sunnyvale, Calif.), a manufacturer of digital and fiber optic systems for delivering video, voice and data over cable, satellite and wireless networks. The stock transaction is valued at $1.7 billion, based on Harmonic's current stock price.
Embedded world wary of merged RTOS giant News & Analysis 10/28/1999 Post a comment Driven by the anticipated explosion in design opportunities both in Internet appliances and from silicon-core-based technologies the acquisition by market-leading real-time software house Wind River Systems Inc. of number two vendor Integrated Systems Inc. (Sunnyvale, Calif.) has shaken up the embedded landscape.
Fujitsu, Hitachi plan second plasma display fab News & Analysis 10/28/1999 Post a comment In an effort to fire up the market for plasma display panels (PDPs), Fujitsu Hitachi Plasma Display Ltd. (FHP) will build a second PDP fab at its operations in Kyushu. The facility is intended to expand the venture's display-making capacity up to sevenfold by next autumn and bring the production of the displays to a new low cost point.
Telecom fuels Texas growth News & Analysis 10/28/1999 Post a comment Texas is now the nation's second-largest high-tech Mecca in terms of engineering employment numbers, according to the American Electronics Association.
Motorola picks up last fragments of Olicom
News & Analysis 10/28/1999 Post a comment Motorola Inc. has signed a definitive agreement to acquire a majority stake in Digianswer, the DSP specialist division of Olicom A/S with a focus on short-range wireless protocols for networks such as Bluetooth and HomeRF.
TSMC to share quake experience in white paper News & Analysis 10/28/1999 Post a comment By the end of the year, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) expects to publish an industry white paper by the end of this year that will include more details about the impact of the Sept. 21 earthquake on its five wafer fabs in Taiwan and provide an overall assessment of the precautions it has taken against powerful quakes.
MCI lands $4 billion military telecom contract News & Analysis 10/28/1999 Post a comment MCI Telecommunications Corp. (McLean, Va.) will supply the Defense Information Systems Agency with network transmission services and equipment under a five-year contract with five one-year options that could be worth as much as $4 billion, the Pentagon said Wednesday (Oct. 27).
Netopia raises profile with Covad pact, DSL options News & Analysis 10/28/1999 Post a comment Netopia Inc. increased its viability as a supplier of digital subscriber line customer-premises products by announcing a key contract with competitive carrier Covad Communications Inc., and offered new hardware options to bond DSL services and provide analog dial-up backup to DSL lines.
Powerchip plans to bring up Mitsubishi 0.18-micron process News & Analysis 10/28/1999 Post a comment Using 0.18-micron process technology licensed from Mitsubishi Electric Corp., DRAM maker Powerchip Semiconductor Corp. plans to produce 90 percent of its monthly output of 30,000 8-inch wafers in the next-generation technology by the middle of next year. The five-year-old company plans to produce its first 0.18-micron DRAMs in December, when it expects to achieve monthly production of 24,000 wafers, up from 21,000 today.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.