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Content posted in October 2000
<<   <   Page 26 / 26
DSLnetworks launches routed VPN service based on DSL, Sonet
News & Analysis  
10/2/2000   Post a comment
DSLnetworks Inc. is leveraging a close relationship with backbone interexchange carrier Level 3 Communications Inc. to launch a routed virtual private network (VPN) service that avoids Layer 2 tunneling.
Wireless LAN stretches to 5 GHz
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10/2/2000   Post a comment
Specman adds Linux support
News & Analysis  
10/2/2000   Post a comment
Verisity Design Inc.'s newest Specman Elite testbench development tool, the Specman Elite v3.3, promises improved integration with third-party HDL verification tools. It is also the company's first commercial release that supports Linux.
Home nets hot for 5-GHz wireless
News & Analysis  
10/2/2000   Post a comment
TI, AMD plan to collaborate on 3G-enabled wireless chips
News & Analysis  
10/2/2000   Post a comment
DALLAS, Tex. -- Texas Instruments Inc. and Advanced Micro Devices Inc. today announced they will team up and co-develop a line of wireless devices for use in third-generation (3G) networks. Under the plan, the companies will develop chip products that combines AMD's flash memory devices and TI's 3G-based baseband chip technology, dubbed the Open Multimedia Application Platform (OMAP).
Wind River introduces design solution for connected devices
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10/2/2000   Post a comment
Wind River Systems Inc. will unveil a design solution this week aimed at helping engineers create more flexible Internet appliances while also slashing their design time.
Philips files suit against six chip makers over IC-based bus technology
News & Analysis  
10/2/2000   Post a comment
NEW YORK -- U.S. Philips Corp., the subsidiary of Royal Philips Electronics of the Netherlands, here today filed suit against six chip makers, claiming these companies infringed upon its IC-based bus technology. The suit, filed in the U.S. District Court in New York, claims the following companies infringed upon its so-called inter-integrated circuit bus (I2C) technology: Analog Devices, Cirrus Logic, Cypress Semiconductor, Fairchild Semiconductor, Linear Technology, and Standard Microsystems
NECX at the e-commerce epicenter
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TI rolls out DSP-based audio device
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10/2/2000   Post a comment
Texas Instruments Inc. has introduced its fourth-generation chip set for Internet audio applications, featuring higher integration, greater performance and lower power consumption than earlier versions to help OEMs reduce end system costs and time-to-market, the company said.
Synopsys, Mentor spiff up design-for-test tools
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10/2/2000   Post a comment
Synopsys Inc. and Mentor Graphics Corp. will take significant strides forward in design-for-test tools this week at the International Test Conference.
Ever try catching raindrops?
News & Analysis  
10/2/2000   Post a comment
There is much talk about the shortage of engineers. Talk about shortage, have you tried calling an electrician lately?
Memory BIST follow-ups
News & Analysis  
10/2/2000   Post a comment
Last month I gushed about GeneSys Test's BISTDR, a paramaterized, synthesizable mem BIST cell that, on power-up, tests all your memory and remaps all bad addresses to working spare address spaces.
Getting 'normal'
News & Analysis  
10/2/2000   Post a comment
Kudos to the U.S. Senate for its recent vote to normalize trade relations with China. The decision scraps the annual process of approving Most Favored Nation trading status for China, a political sideshow that had little real impact. With the approval of the Permanent Normal Trade Relations bill, the United States has opened the door for China to join the World Trade Organization, a move that could mandate some real economic change in that country of 1.4 billion people.
VSIA eyes verification reuse; Altera buys Northwest Logic
News & Analysis  
10/2/2000   Post a comment
The Virtual Socket Interface Alliance's Verification Development Working Group has elected Thomas Anderson co-chairman. Anderson is vice president of applications engineering at 0-In Design Automation Inc.
TI rolls out DSP-based Internet audio device
News & Analysis  
10/2/2000   Post a comment
Texas Instruments Inc. has introduced its fourth-generation chip set for Internet audio applications, featuring higher integration, greater performance and lower power consumption than earlier versions to help OEMs reduce end system costs and time-to-market, the company said.
Test issues are also a part of EDA
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10/2/2000   Post a comment
TI rolls fourth-generation DSP-based Internet audio device
News & Analysis  
10/2/2000   Post a comment
DALLAS, Tex. -- Texas Instruments Inc. here today introduced its fourth-generation chip set for Internet audio applications, featuring higher integration, greater performance and lower power consumption than earlier versions to help OEMs reduce end system costs and time-to-market, the company said. The programmable DSP-based TMS320DA250 chip features TI's patented power management circuitry, and can enable up to 70 hours of audio playtime on on a digital audio player powered by two AA batteries
TI rolls fourth-generation DSP-based Internet audio device
News & Analysis  
10/2/2000   Post a comment
DALLAS, Tex. -- Texas Instruments Inc. here today introduced its fourth-generation chip set for Internet audio applications, featuring higher integration, greater performance and lower power consumption than earlier versions to help OEMs reduce end system costs and time-to-market, the company said. The programmable DSP-based TMS320DA250 chip features TI's patented power management circuitry, and can enable up to 70 hours of audio playtime on on a digital audio player powered by two AA batteries
SST settles dispute with Winbond
News & Analysis  
10/2/2000   Post a comment
SUNNYVALE, Calif.-- Silicon Storage Technology Inc. (SST) here has reached an out-of-court settlement in its two-year-old suit against Taiwan's Winbond Electronics Corp. over a flash-memory licensing dispute. In 1998, SST filed a suit against Winbond in the U.S. District Court in San Jose, claiming that the Taiwanese chip maker had violated its contract in developing flash-memory chips based on SST's technology. SST terminated its licensing agreement with Winbond as well.
TI rolls fourth-generation DSP-based Internet audio device
News & Analysis  
10/2/2000   Post a comment
Texas Instruments Inc. has introduced its fourth-generation chip set for Internet audio applications, featuring higher integration, greater performance and lower power consumption than earlier versions to help OEMs reduce end system costs and time-to-market, the company said.
Technology Focus: Systems On A Chip
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10/2/2000   Post a comment
Technology Focus: Systems On A Chip
Executive Comment: Companies need to define the bASICs of SoC
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10/2/2000   Post a comment
Technology Focus: Systems On A Chip
Infineon acquires switch-chip maker Ardent for $42 million
News & Analysis  
10/2/2000   Post a comment
MUNICH, Germany - Infineon Technologies AG here today announced that it has entered into a definitive agreement to acquire Ardent Technologies Inc., a supplier of chips for local-area networking applications, for $42 million. With the acquisition of Ardent, based in Sunnyvale, Calif., Infineon gains an entry in the switch-chip market. Ardent, a two-year-old company started by former executives of I-Cube Inc., last summer rolled out its first product-a line of switching silicon for Layer 2 appl
Executive Comment: Bluetooth connector window is open now
News & Analysis  
10/2/2000   Post a comment
Buying Strategies: Connectors
Analytical Angle: Finding best price entails right connection
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10/2/2000   Post a comment
Buyinf Strategies: Connectors
Buying Strategies: Connectors
News & Analysis  
10/2/2000   Post a comment
Buying Strategies: Connectors
Mosaid rolls out tester for fast prototype memories
News & Analysis  
10/2/2000   Post a comment
SANTA CLARA, Calif. -- The Systems Division of Mosaid Technologies Inc. today announced a new low-cost engineering test system for prototype high-speed memory devices. The MS4205 system is designed for testing fast DRAMs, SRAMs, flash memories, embedded ICs, and related devices, said John Bateson, vice president of marketing and business development for Mosaid's Systems Division here.
MKS acquires ASTeX for $300 million
News & Analysis  
10/2/2000   Post a comment
ANDOVER, Mass. -- MKS Instruments Inc. here today announced that it has entered into a definitive agreement to acquire Applied Science and Technology Inc. (ASTeX), a supplier of sputtering equipment and other products, for $300 million in stock. With the acquisition of ASTeX, based in Wilmington, Mass., MKS will gain a quick entry into the sputtering equipment, gas generator, RF and microwave power source, and other gas-reactive systems markets.
LTX takes equity stake in StepTech
News & Analysis  
10/2/2000   Post a comment
WESTWOOD, Mass.-- LTX Corp. here today announced that it has made an equity investment in StepTech, Inc., a supplier of semiconductor test equipment, instrumentation, and other products, for an undisclosed amount. The deal also gives LTX exclusive rights to certain technologies from StepTech. The Hopkinson, Mass.,-based company specializes in developing test instruments and software for wireless and mixed-signal testing applications.
Micrel adds dual, triple op amps to high-speed series
News & Analysis  
10/2/2000   Post a comment
SAN JOSE--Micrel Semiconductor here has introduced a new series of dual and triple operational amplifiers with the capability of driving unlimited capacitance loads and handling speeds up to 135 MHz.
Yaskawa expands robotic R&D with Silicon Valley center
News & Analysis  
10/2/2000   Post a comment
FREMONT, Calif. -- Yaskawa Electric Corp. of Japan today formally opened its Silicon Valley development and support center here with an initial group of 30 researchers working on software, robotics, and motion control systems for semiconductor plants.
Toshiba sees annealed wafers replacing epi silicon in logic fabs
News & Analysis  
10/2/2000   Post a comment
TOKYO -- Toshiba Ceramics Co. Ltd. here believes it has made significant progress in moving hydrogen-annealed wafers from mainly being used in memory fabs to chip plants making high-performance logic. The Tokyo-based company said its hydrogen-annealed Hi-Wafer substrates have been certified for use with 0.18-micron CMOS processes by an unidentified "major" supplier of digital signal processors (DSPs).
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