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Content posted in October 2010
<<   <   Page 8 / 8
Microsemi buys Actel for $430 million
News & Analysis  
10/4/2010   48 comments
Microsemi Corp. has entered into the FPGA market.
Global chip sales rise in August, says ESIA
News & Analysis  
10/3/2010   Post a comment
The three-month average of global sales of semiconductors for August was $25.69 billion, up 1.8 percent compared with the previous month and up 32.6 percent compared with the same month a year before, according to the European Semiconductor Industry Association (ESIA).
Chemical firms merge
News & Analysis  
10/1/2010   Post a comment
Momentive Performance Materials Holdings Inc., the parent company of Momentive Performance Materials Inc., and Hexion LLC, the parent company of Hexion Specialty Chemicals Inc., have completed the previously announced merger of Hexion and Momentive.
Taiwan GaAs foundry names CEO
News & Analysis  
10/1/2010   Post a comment
Taiwan GaAs foundry vendor Win Semiconductors has named Yu-Chi Wang to the position of chief executive.
Microsoft sues Motorola over smartphone patents
News & Analysis  
10/1/2010   39 comments
Microsoft said it filed patent infringement actions against Motorola, alleging violation of nine Microsoft patents by Motorola's Android-based smartphones.
Nanowire LED developer names CEO, gains funding
News & Analysis  
10/1/2010   24 comments
Swedish nanowire semiconductor LED developer Glo AB announced the closing of a 170 million kronor ($25 million) investment round.
NASA, contractors seek to combine reliability with lower launch costs
News & Analysis  
10/1/2010   3 comments
The drive to reduce the cost of space launches is moving in parallel with efforts to increase the reliability of commercial rockets and electronics-packed payloads that will probe the Earth and the solar system.
Slow growth forecast for home energy nets
News & Analysis  
10/1/2010   4 comments
Consumers are interested in more energy-efficient homes, but utilities are moving slowly into home energy networks, opening a door for independent services, according to Parks Associates
EE Times tech writer wins Japan fellowship
News & Analysis  
10/1/2010   53 comments
R. Colin Johnson, veteran technology correspondent for EE Times, has been named a 2010 Kyoto Prize Journalism Fellow.
Microchips' Solar Micro Inverter Reference Design lowers cost and improves efficiency of solar power systems
Product News  
10/1/2010   2 comments
Microchip Technology Inc. has announced a fully digitally-controlled Grid-Connected Solar Micro Inverter Reference Design that connects to any standard solar panel and converts the panelís DC output into AC power, which can then be fed into the public power grid.
C&K Components' JS Slide series of low-profile, cost-effective miniature slide switches
Product News  
10/1/2010   Post a comment
C&K Componentsí double-pole triple-throw subminiature slide switch (DP3T) has a 3.5mm body height with a 2mm actuator height.
Schurter's MSM19 metal pushbutton switch
Product News  
10/1/2010   Post a comment
Schurter's red and green housings can be used to distinguish start/stop switching functions.
Linear Technology's LTM8042 and LTM8042-1 DC/DC uModule LED drivers
Product News  
10/1/2010   Post a comment
Capable of operating as boost, buck or buck-boost with 3V to 30V input-voltage range, each of Linearís latest devices is a complete LED driver solution in a 9mm x 15mm x 2.8mm LGA package.
Nokia gives 'green' award to ST
News & Analysis  
10/1/2010   30 comments
Europe's largest chip vendor STMicroelectronics NV has been recognized by mobile phone company Nokia for achievements in sustainability.
Huawei plans manufacturing unit in India
News & Analysis  
10/1/2010   48 comments
Chinese telecom equipment manufacturer Huawei Technologies will invest about $500 million in a telecom equipment manufacturing facility in India.
Japan develops electric motor sans rare earth metals
News & Analysis  
10/1/2010   15 comments
Access to China's rare earth elements may become a moot point if Japanese researchers will be successful in building EV motors with magnets that don't need rare earth metals.
Open-source multicore processor project begins
News & Analysis  
10/1/2010   53 comments
ORSoC AB, a Swedish design house that took over responsibility for maintaining the OpenCores website in 2007, has announced that work has begun on OpenRISC 2000 (OR2K), an upgrade to the open-source OpenRISC 1000 32-bit processor.
M/A-COM Technology Solutions' 38 GHz surface mount technology (SMT) packaged GaAs MMIC chipset
Product News  
10/1/2010   Post a comment
M/A-COM Tech has developed for the point-to-point radio market a 38 GHz surface mount technology packaged GaAs MMIC chipset that includes an integrated up converter and receiver, driver and power amplifiers, a VCO and a multiplier.
AWR adds NMDG S-function support to MWO software
Product News  
10/1/2010   Post a comment
AWR Corp. said its Microwave Office high-frequency design software now supports S-functions, which are nonlinear behavioral models developed by Belgium-based NMDG NV.
Tessera sues Sony, Renesas over stacked ICs
News & Analysis  
10/1/2010   39 comments
Tessera Technologies has said that its semiconductor packaging subsidiary has filed a law suit against Sony and Renesas Electronics alleging the Japanese companies are infringing Tessera's U.S. Patent No. 6,885,106.
Skyworks' SKY13327-365LF and SKY13369-365LF switch matrices
Product News  
10/1/2010   Post a comment
Skyworks Solutions is offering a pair of CMOS switch matrix devices that eliminate the need for external components by integrating critical functionality directly on the CMOS die.
Get on board: 20-nm MPW run for SOI scheduled
News & Analysis  
10/1/2010   Post a comment
Research institutes CEA-Leti and Circuits Multi Projets, both based in Grenoble, France, have announced that a 20-nanometer fully-depleted silicon-on-insulator (FDSOI) process will be used on a 300-mm multiproject wafer scheduled to go in September 2011.
Atmel closes sale of smartcard business
News & Analysis  
10/1/2010   17 comments
Atmel Corp. has said it has completed the previously announced sale of its Smart Card (SMS) business based in Rousset, France and East Kilbride, Scotland, to Inside Contactless SA.
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