ASICs added to MEMS wafers News & Analysis 11/1/2007 Post a comment A new technique called "chip-on-MEMS" bonds ASIC dice atop an entire MEMS wafer before dicing, according to developer VTI Technologies Oy.
Eureka targets small firms with billion-dollar program News & Analysis 11/1/2007 Post a comment The pan-European Eureka program of research funding has launched an 800 million euro (about $1.14 billion) effort specifically aimed at funding R&D in SMEs small- and medium-sized enterprises the European Union jargon for companies with less than 250 employees.
NXP passes German passport security tests News & Analysis 11/1/2007 Post a comment NXP Semiconductors is supplying enhanced versions of its ePassport chips to the German authorities who are readying a swith-over to passports that incorporate more and more secure biometric data than exiting documents.
GPS on steep ramp in cellphones News & Analysis 11/1/2007 2 comments The number of cellphones with global positioning satellite capabilities will more than quadruple between 2006 and 2011, driven by the U.S. government's mandate for Emergency 911 services and the rollout by carriers of new location-based services are driving the growth, according to a report released by iSuppli Corp.
RFID firm gains funding News & Analysis 11/1/2007 Post a comment Tego Inc., a Waltham, Mass.-based developer of passive RFID tag solutions, has closed a $6 million Series A investment round.
IMEC has a brain wave: feed EEG emotion back into games News & Analysis 11/1/2007 Post a comment Research organization IMEC (Leuven, Belgium) could extend its investigations into wireless electroencephalography (EEG) to enable measures of emotion to be fed back into computer games, according to Bert Gyselinckx, program director for wireless autonomous transducer solutions at IMEC's Dutch outpost at the Holst Center (Eindhoven, Netherlands).
UbiquiSys gets Google boost News & Analysis 11/1/2007 Post a comment Since femtocell startup UbiquiSys Ltd. announced in July that Google was a strategic investor, the startup has prepared a manufacturing facility for mass production of its 3G home base station and will start friendly user trials at European operators in December.
ST teams with ACS for automotive safety initiative News & Analysis 11/1/2007 Post a comment STMicroelectronics has teamed with Automotive Communications Systems (ACS, Ann Arbor, MI) to develop silicon for the Vehicle and Infrastructure Integration (VII) initiative that is investigating the potential safety benefits of car-to-car and car-to-roadside communications.
Elastic electronics stretch to twice their length Product News 11/1/2007 Post a comment An IMEC laboratory at the University of Ghent in Belgium has realized interconnections for elastic electronic wires that can be stretched to twice their original length while maintaining electrical conductivity. The technology could be significant in such applications as foldable displays, biomedical applications and textiles that incorporate electronics, according to research organization IMEC (Leuven, Belgium).
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.