Melexis warns of automotive chip sales crash in Q4 News & Analysis 11/26/2008 Post a comment Automotive chip manufacturer Melexis Microelectronic Integrated Systems NV (Ieper, Belgium) has issued a warning that it expects its Q4 sales to fall 25 and 30 percent compared with the third quarter. Joint CEO Francoise Chombar said that the company would continue to streamline its cost structure, but did not indicate whether this would include job cuts.
Price erosion round the corner for PNDs News & Analysis 11/26/2008 Post a comment Fierce competition and commoditization of entry-level personal navigation devices (PND) is likely to bite into the large profits made by makers of the devices over the past few years when sales grew at exponential levels, according to market research group Berg Insights (Gothenburg, Sweden).
Industrial Automation: To date no sign of recession News & Analysis 11/26/2008 Post a comment At SPS/IPC/Drives exhibition in Nuremberg the industrial automation industry shows no sign of a recession. The industry is in a good mood, there is still growth and the ZVEI (German Electrical and Electronic Manufacturers' Association) expects further growth due to extensive bookings.
NXP, Phonak team for enhanced acoustics Product News 11/26/2008 Post a comment NXP Semiconductors and Phonak have jointly developed a single chip ultra low power radio for use in hearing systems that is being integrated into Phonak's forthcoming range of hearing aids and wireless accessories.
Strategy renewal coming for ICT research, says European Commissioner News & Analysis 11/26/2008 Post a comment Viviane Reding, European Commissioner responsible for Information Society and Media, gave a speech on Tuesday (Nov. 25) at the ICT 2008 exhibition in Lyon, France, in which she said she would outline a renewed strategy for information and communications technology research and innovation early in 2009.
EC approves proposed JV between ST, Ericsson News & Analysis 11/26/2008 Post a comment The European Commission announced Wednesday (Nov. 26) it has authorized, under the European Union merger regulation, the creation of a joint venture between EMP, the wireless platform business of Ericsson, and ST-NXP, the wireless semiconductors business of STMicroelectronics.
Cadence exec downplays Connections controversy News & Analysis 11/26/2008 Post a comment An executive from EDA vendor Cadence Design Systems downplayed a report that suggested that Cadence had removed from membership a large number of software vendors from its Connections partnership program and defended Cadence as having the "broadest partner program in the industry."
Italy plays host to MEMS 2009 Product News 11/25/2008 Post a comment The advance registration deadline of November 30th is about to expire for the 22nd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2009).
Analog Profile: Jim Solomon News & Analysis 11/25/2008 Post a comment As part of the 'Analog Profiles' series in which we dig a little deeper into the backgrounds of the people shaping the analog sector, ADLE interviews Jim Solomon, Executive Chairman at Gemini Design Technology.
Spansion warns on Q4 revenue News & Analysis 11/25/2008 Post a comment NOR flash memory specialist Spansion became the latest semiconductor supplier to issue a warning about revenue in the current quarter, saying it expects fourth quarter net sales to be down about 20 percent sequentially.
UMC validates high-k process at 45nm News & Analysis 11/25/2008 Post a comment United Microelectronics Corp. has validated its high-k metal gate process with a test SRAM design run at the 45 nm node, a step toward the company's goal of offering a high-k process at the 32 nm node in 2010.
BASF, Osram make OLEDs shine in ambient light News & Analysis 11/25/2008 Post a comment BASF AG and Siemens lighting subsidiary Osram GmbH have developed an OLED-based light source that meeting the International Energy Star SSL standards for color requirements. In addition, the researchers improved the light yield to 60 lumens per watt.
Industrial-, automotive-grade Atom processor coming, says report Product News 11/25/2008 Post a comment The world's largest chip maker Intel Corp. (Santa Clara, Calif.) is developing a variant of its Atom processor for use in harsh environments such as automotive applications, according to a Nikkei Electronics article. The industrial or automotive Atom, currently named Embedded Menlow XL, is due to ship to customers in 2009, the report said.
DiBcom enables free-to-air digital TV on LG phones Product News 11/25/2008 Post a comment As part of an ongoing collaboration with LG, mobile TV chip specialist DiBcom SA (Palaiseau, France) announced it has integrated its latest generation of mobile TV receiver so as to enable free-to-air digital TV broadcasts on LG's multimedia handset.
Ten years ago: IMEC announced MPEG4 silicon News & Analysis 11/25/2008 Post a comment It was on Nov. 25 1998 that EE Times reported that IMEC research institute (Leuven, Belgium) had working silicon of wavelet-compression-based visual texture-coding chip that was meeting part of the developing MPEG-4 video codec standard.
Swiss group buys Wilbrecht's LEDCO division News & Analysis 11/25/2008 Post a comment Custom microswitches specialist Microprecision Electronics (Vouvry, Switzerland) has acquired , for an undisclosed sum, Wilbrecht Electronics Inc's LEDCO Division, which makes a wide range of precision, U.S.-made LED assemblies, metal foil resistors, microswitches and sealed position switches.
The thinking car sees a clear road ahead News & Analysis 11/25/2008 Post a comment In automotive driver assistance systems, currently one of the most dynamic developments in the electronics realm is under way: the latest achievements in CMOS sensors enable camera-based driver assistance systems to grow into new application segments. Assistance systems will become a hub for video, radar, and lidar data streams – effectively forming the brains of the cars.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.