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Holiday tablet sales expected to rise 60%
News & Analysis  
11/30/2012   7 comments
"Tablet tracker" report by investment firm predicts strong year-over-year growth for iPad and Android-based tablets.
Youth, execs meet at chip gala focused on STEM
News & Analysis  
11/30/2012   6 comments
Students from San Jose’s Lynbrook High met FIRST organizer Dean Kamen at the annual SIA dinner, where STEM education was in the spotlight.
Printed electronics pilot line starts production
News & Analysis  
11/30/2012   3 comments
A pilot line in northern England has started commercial production of printed circuits, but the company involved says it is not revealing details of the functions until 2013.
Infineon expands MCU line
Product News  
11/30/2012   Post a comment
New series offers high-resolution PWM unit for efficient digital power conversion.
ST sets date for strategy announcement
News & Analysis  
11/30/2012   Post a comment
Struggling European chip manufacturer STMicroelectronics will announce details of its strategic plan on Dec. 10.
Globalfoundries' FinFET wafers set to roll
News & Analysis  
11/30/2012   17 comments
The first multiproject wafer runs for foundry customers to begin testing the 14XM manufacturing process technology could start as soon as the first quarter of 2013.
Impulse's CoDeveloper compiles ANSI C to Altera's Quartus Qsys
Product News  
11/29/2012   Post a comment
Software developers work within a C development tool such as Visual Studio to offload the microprocessor code via parallelized optimization to FPGA.
Lattice Semiconductor to showcase liquid lens technology
Product News  
11/29/2012   Post a comment
Varioptic liquid lens technology and Helion IP featured on Lattice HDR-60 Video Camera Development Kit.
Upbeat VCs have cash for a few good chips
News & Analysis  
11/29/2012   7 comments
Despite "dismal" forecasts for chips in 2012, venture capitalists said they see lots of opportunities ahead, including some in semiconductors.
Still no takers for idled ProMOS DRAM fab
News & Analysis  
11/29/2012   1 comment
Taiwanese government-backed agency plans to reopen bidding after initial deadline passes with no offers.
Smartphones move center stage in cars, even drones
News & Analysis  
11/29/2012   4 comments
The French company Parrot developed a "universal receiver" for car phones and is now trying to expand its applications to consumer gadgets like personal drones.
GAO’s laser source detects fiber faults
Product News  
11/29/2012   Post a comment
Aiding the installation and maintenance of optical networks, the Model C0280003 handheld laser source from GAO Instruments emits a visible red light at a wavelength of 650 nm to identify the location of fiber macrobends, breaks, problem connectors, and improperly aligned mechanical splices.
University R&D spending for engineering jumps
News & Analysis  
11/29/2012   4 comments
The National Science Foundation said U.S. university spending on R&D rose again in 2011, with engineering research ranking second after life sciences.
AC safety capacitors optimized for use in AC/DC power supplies, RJ11 apps
Product News  
11/29/2012   Post a comment
Tecate Group has launched its extensive offering of AC safety capacitors for X and Y class applications.
Arasan Chip Systems extends USB leadership with UFS, UniPro, and M-PHY IP solutions
Product News  
11/29/2012   Post a comment
Arasan Chip Systems has strengthened the company’s position in the USB market by claiming to be the only IP provider offering a complete USB solution to the market; USB Digital IP, PHY, HSIC PHY, Stack, and Drivers.
Microchip’s PIC32 GUI Development Board With Projected-Capacitive Touch
Product News  
11/29/2012   Post a comment
High-performance 32-bit PIC32 microcontroller eliminates cost and complexity of external graphics controller.
MEMS variable capacitive accelerometers with eight-pin connector
Product News  
11/29/2012   Post a comment
Designed to provide high-precision shock, vibration and acceleration measurements in three orthogonal directions, the units are available in eight unique ranges from ±2 to ±400g.
PSS controller targets lower cost USB chargers for new generation smartphones
Product News  
11/29/2012   Post a comment
CamSemi's PSS controller features an integrated active Ultra High Voltage (UHV) device that allows charging to start in under 0.1 seconds.
Is Renesas Mobile's LTE gambit paying off?
News & Analysis  
11/29/2012   9 comments
It's been a tough year for mobile chip vendors like Renesas Mobile. Without a design win in Apple or Samsung smartphones, Renesas and other have no other volume sockets to go after.
'Signum' ARM digital quarterly launches
News & Analysis  
11/28/2012   Post a comment
Working with the ARM architecture? Then subscribe for free to our multiplatform digital edition, covering low-power, intelligent devices.
Android cutting deeper into iPad's market share
News & Analysis  
11/28/2012   8 comments
Apple's share of the tablet market fell to 55 percent in the third quarter, the lowest it has been since the original iPad introduction.
IBM flash interconnect aims to bust bottlenecks
News & Analysis  
11/28/2012   2 comments
Following its acquisition of Texas Memory Systems, IBM is developing a storage I/O technology geared for flash memory subsystems.
MEMS microphones go HD
News & Analysis  
11/28/2012   Post a comment
Akustica is offering a line of high-definition MEMS mics for consumer electronic devices.
HP Labs sees ARM, Atom, memristors in server future
News & Analysis  
11/28/2012   14 comments
Disruptive changes in data center technologies are upcoming, this week's Server Design Summit revealed.
Flexible electronics breakthrough claimed
News & Analysis  
11/28/2012   2 comments
Using flexible plastic substrates in place of rigid silicon wafers could open up new applications for electronics.
DAC delivers high quality audio performance in a small package size
Product News  
11/28/2012   Post a comment
Wolfson Microelectronics plc has introduced the company's stereo digital-to-analog converter (DAC), the WM8533, which claims to provide outstanding audio performance in a small package size for a wide range of consumer electronic applications.
5x5x2mm audio transducer delivers 80dBA of sound pressure level
Product News  
11/28/2012   Post a comment
Model TRSTE-5025 from Transducer USA is a surface mount audio transducer producing a very high sound pressure level of 80dBA minimum in a miniscule 5x5x2mm package.
Pre-configured DSP system for hearing aids
Product News  
11/28/2012   Post a comment
ON Semiconductor has introduced Rhythm R3710, a pre-configured digital signal processing system designed specifically for invisible-in-canal (IIC) hearing aid devices.
AMD to sell Austin campus
News & Analysis  
11/27/2012   6 comments
Chip vendor's plan to sell Lone Star campus to raise cash contingent on a multi-year leaseback deal.
Microchip expands mTouch sensing portfolio
Product News  
11/27/2012   Post a comment
Turnkey controllers for Multitouch, Proximity Detection, and Haptic Feedback.
Nuclear space engine demo'd by Los Alamos
News & Analysis  
11/27/2012   6 comments
U.S. researchers have demonstrated the first use of a heat pipe to cool a small nuclear reactor used to power a Stirling engine. The concept could be used to power spacecraft.
NXP rolls wireless MCUs for Internet of Things
Product News  
11/27/2012   5 comments
JN516x MCU family features embedded flash memory for ZigBee, JenNet-IP, and other 802.15.4 applications.
Ericsson sues Samsung for patent infringement
News & Analysis  
11/27/2012   Post a comment
Samsung licensed Ericsson's patents in 2001, renewing in 2007, but its license has now expired. Talks between the two mobile giants have broken down.
Swissbit extends SSD product line
Product News  
11/27/2012   Post a comment
The SATA II device supports up to 260 MB/s data rate.
Chip market to fall in 2012, rise in 2013
News & Analysis  
11/27/2012   6 comments
The WSTS industry organization has revised its previous forecasts down and now predicts a weak end to the year for the global chip market.
CMOS power amplifiers penetrating 3G handsets
Teardown  
11/27/2012   2 comments
A teardown analysis of the Samsung Galaxy Appeal found it is one of the first 3G smartphones to use a CMOS power amplifier instead of gallium arsenide.
How Kickstarter created a community for Adapteva
News & Analysis  
11/27/2012   4 comments
In the process of raising $750,000 through Kickstarter, Adapteva seeded a developer community of nearly 5,000 potential customers.
MediaTek reportedly has eight-core apps processor
News & Analysis  
11/27/2012   19 comments
MediaTek is developing an ARM-based eight-cored processor for use in a smartphone by Chinese telecommunications equipment and network provider ZTE, according to reports in Taiwan.
China fabless exec looks West as mobile slumps
News & Analysis  
11/26/2012   5 comments
Union Semiconductor, one of China's biggest fabless chip companies, is seeking new sockets in the West as China’s mobile business sags.
Smartphones to pass feature phones in flash memory consumption
News & Analysis  
11/26/2012   Post a comment
Smartphones will consume more flash memory units than feature phones for the first time in 2013, according to IHS iSuppli.
Google buys Wi-Fi hotspot provider
News & Analysis  
11/26/2012   Post a comment
Internet search giant to pay $400 million to acquire ICOA in move to diversify portfolio.
Xilinx' Zynq All Programmable SoCs accelerate productivity in industrial automation
Product News  
11/26/2012   Post a comment
Xilinx demonstrates new design platform that enables industrial designers to deliver high performance and increased safety for motion control and industrial networking solutions.
Why the ARM architecture is shaped the way it is
News & Analysis  
11/26/2012   35 comments
To understand why the ARM architecture and culture is shaped the way it is, you need to go back to the1970s, in the early days of EE Times.
Tower asked to expand Indian fab project
News & Analysis  
11/26/2012   Post a comment
Consortium asked to resubmit wafer fab pitch with "increased scope" to Indian government. Reckons it is going head-to-head against one other group.
TSMC breaks ground for FinFET fab
News & Analysis  
11/26/2012   7 comments
Foundry breaks ground for fab set to mass produce 20-nm planar CMOS and 16-nm FinFET circuits in 2014.
Report: Rising GDP set to boost chip markets
News & Analysis  
11/23/2012   Post a comment
The IC market will grow 6 percent in 2013 on the back of an improving global gross domestic product, according to market analysis firm.
Silicon wafer shipments fell in Q3, says SEMI
News & Analysis  
11/23/2012   Post a comment
Worldwid silicon wafer area shipments decreased sequentially during the third quarter of 2012, according to the SEMI industry body, which analyses wafer area shipments on a quarterly basis.
Calxeda hires former Cisco exec as COO
News & Analysis  
11/23/2012   Post a comment
A startup pioneering the development of ARM-based processor chips and technology for server computers, has announced that Gopal Hegde has joined the company as chief operating officer. Hegde was previously senior director of engineering at Cisco.
Intel buys U.K. graphics chip team
News & Analysis  
11/22/2012   3 comments
Intel is buying a graphics chip design subsidiary from Creative Technology of Singapore in a move that could result in Intel scaling back its use of graphics cores licensed from Imagination.
ARM CEO Warren East on IoT, Nokia, platforms, Europe's future
News & Analysis  
11/21/2012   Post a comment
ARM CEO sees growth in embedded and servers while leveraging existing community, technology and infrastructure.
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