Avnet, Zarlink ink distribution deal Product News 12/31/2007 Post a comment Avnet Electronics Marketing and Zarlink Semiconductor have entered into a global distribution agreement that allows the distributor to sell Zarlink's optical and telecommunications products.
Selco expands value-added services Product News 12/31/2007 Post a comment Selco Products has expanded its value-added services department to meet OEM demand for fully assembled, ready-to-install customized thermal components in a variety of configurations.
Terrestrial digital radio goes mobile Product News 12/31/2007 Post a comment At the Consumer Electronics Show in Las Vegas, HD Radio developer iBiquity will show new features for the terrestrial digital radio format, such as an iTunes "tagging" feature that makes it easier to purchase music, while touting low-power chip support and reference designs tailored to move the HD Radio platform into portable devices.
Philips gains $1.5B in TSMC stock sale News & Analysis 12/31/2007 Post a comment Royal Philips Electronics has completed the sale of 800 million common shares in foundry provider Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), in a transaction valued at approximately $1.5 billion.
Europe shows strong chip sales in November News & Analysis 12/31/2007 Post a comment The three-month average of chip sales for Europe for November was $3.67 billion, up 9.6 percent from the previous month and the best performing region in sales for the three months from September to November, according to figures from the Semiconductor Industry Association (SIA).
Semi sales up 2.3% in November, says SIA News & Analysis 12/31/2007 Post a comment November was another good month for global sales of semiconductors, with a 2.3 percent increase over the same period last year to $23.1 billion, according to the Semiconductor Industry Association (SIA).
Headers meet RoHS reflow processes Product News 12/28/2007 Post a comment Molex Inc. has introduced its Mini-Fit RTC (RoHS Temperature Capable) headers, aimed at mid-range power applications that require high-density and current-carrying capability.
Fujitsu exits plasma News & Analysis 12/28/2007 Post a comment At a Board Meeting held on December 27, 2007, the Board of Directors of Fujitsu General Limited passed a resolution to cease activity in the visual display business.
Micronas set to lay off workers in California, China News & Analysis 12/28/2007 Post a comment Consumer electronics chip company Micronas Holding GmbH (Zurich, Switzerland) has announced it plans to discontinue its activities in set top boxes for television delivered by internet protocol, affecting about 100 employees in Santa Clara, Calif., and around 20 employees in Shanghai, China.
A glimpse into the future of technology News & Analysis 12/28/2007 Post a comment The voice over suggests the pair that made this video are young and enthusiastic. As such this glimpse into the future of technology is more about the vision than the detailed engineering. But as the final scene states: "the future is in our hands."
Toshiba sues Italian DVD maker in patent dispute News & Analysis 12/28/2007 Post a comment Toshiba Corp. has filed a patent-infringement suit against Italian DVD disc replicator ACME SpA in a Milan court. The suit alleges the Italian company is manufacturing and selling DVDs without a license either from Toshiba or the DVD6C Licensing Group that acts as a one-stop shop for DVD patents from nine companies.
Chip art, 3D TV, French EMS lead story ranking News & Analysis 12/28/2007 Post a comment Here are the top five online stories for the week beginning Sunday Dec. 23, as ranked by EE Times Europe readers, up to and including Friday, Dec. 28. The ranking is based on the number of reader "views" or "hits" on a particular article.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.