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Content posted in December 2011
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Thin-film solar startup raises $130 million
News & Analysis  
12/20/2011   4 comments
Stion Corp., a startup formed to manufacture thin-film solar modules, has announced a $130 million equity investment led by AVACO and a number of Korean private equity funds. Existing investors Khosla Ventures, TSMC (through its VentureTech Alliance), Lightspeed Venture Partners, Braemar Energy Ventures, and General Catalyst Partners all participated in the round.
Broadcom rolls 40G PHY chips
News & Analysis  
12/20/2011   3 comments
Broadcom announced availability of an optical transceiver capable of handling long haul optical transmissions at 40 Gbit/second while consuming about 2.3 W.
Seagate completes purchase of Samsung HDD business
News & Analysis  
12/20/2011   2 comments
Technology plc has completed the acquisition of the hard disk drive business of Samsung Electronics Co. Ltd.
Apple wins narrow victory against HTC
News & Analysis  
12/20/2011   24 comments
Apple won a narrow victory in a patent infringement suit against HTC, British Telecom joined the mobile patent wars, alleging Google violates six of its patents.
Xilinx cuts sales target
News & Analysis  
12/19/2011   1 comment
Xilinx cut its sales target for the December quarter, citing primarily a decline in larger customer business in the communications end market.
Mosaid bought by finance firm for $570 million
News & Analysis  
12/19/2011   1 comment
Canadian IP licensor Mosaid Technologies Inc. has said that shareholders have approved a plan for Sterling Fund Management LLC, a private equity company, to acquire the company for a cash payment of $46 Canadian a share or about $590 million (Canadian or about US$570 million).
Broadcom claims legal vicotry over Emulex
News & Analysis  
12/19/2011   1 comment
A U.S. federal court found that network chip vendor Emulex infringed on two patents held by rival chip vendor Broadcom, according to Broadcom.
Five announce flash memory security initiative
News & Analysis  
12/19/2011   3 comments
Panasonic, Samsung, SanDisk, Sony and Toshiba have reached an agreement in principle to collaborate on a content protection technology for flash memory cards such as SD Cards and for other flash-based storage options.
Chip executives confidence in decline, says KPMG
News & Analysis  
12/19/2011   2 comments
The Semiconductor Business Confidence Index, a metric based on survey data gathered by audit and consultancy company KPMG LLC, has fallen to 46 in 2011, compared with 60 in 2010 and 61 in 2009, the firm said.
Xilinx Ships First Zynq-7000 Devices
Product News  
12/18/2011   1 comment
Xilinx, Inc. has launched its first Zynq-7000 Extensible Processing Platform (EPP).
Skyworks unveils PIN diode for switching applications
Product News  
12/18/2011   Post a comment
Skyworks Solutions has introduced a PIN diode for transmit and receive switching applications.
MMIC band pass filter tunes 19 to 38 GHz
Product News  
12/18/2011   Post a comment
Hittite introduced a filter for applications in wideband test and measurement equipment, communication systems and electronic warfare (EW) subsystems
SandForce SSD processor targets cloud computing
Product News  
12/18/2011   Post a comment
The SF-2481 SSD increases the endurance of SSDs built with standard MLC flash by incorporating nearly twice the normal error correction strength.
Rare earths rising for next five years
News & Analysis  
12/16/2011   6 comments
Despite China's virtual corner on the market of rare earths, demand is skyrocketing along with investments in new mines worldwide that has some pundits talking of a "rare earth bubble."
First 3-D IC spec set for release
News & Analysis  
12/16/2011   13 comments
JEDEC which announced a broad set of 3-D IC standards development earlier in 2011 is set to release what is touted as the first 3-D IC interface standard which will releases as early as late December.
Self-diagnosing sensor to detect telecom equipment failure
News & Analysis  
12/16/2011   1 comment
Researchers at Rochester Institute of Technology and PPC have developed a “Smart Connector” sensor to automatically detect equipment damage and pinpoint its exact location using self-diagnostics.
NXP launches LNAs for GPS
Product News  
12/16/2011   Post a comment
New GPS LNAs from NXP dynamically suppress strong transmit signals
Qualcomm's Gobi to provide HP with 3G laptop connectivity
News & Analysis  
12/15/2011   3 comments
Qualcomm has announced that its Gobi 3000 embedded wireless product will be powering a new form of pay-as-you-go mobile broadband data service in HP laptops.
ST’s smallest MEMS modules
Product News  
12/15/2011   1 comment
The LSM330D iNEMO multi-sensor module from STMicroelectronics is a new inertial module that integrates three-axis sensing of linear and angular motion in a miniature 3 x 5.5 x 1mm package.
AMD hires former Freescale executive Lisa Su
News & Analysis  
12/15/2011   9 comments
AMD has hired former Freescale Semiconductor executive Lisa Su (shown) as senior vice president and general manager of its global business units with the aim of improving the firm’s execution.
AMD hires former Freescale executive Lisa Su
News & Analysis  
12/15/2011   9 comments
AMD has hired former Freescale Semiconductor executive Lisa Su (shown) as senior vice president and general manager of its global business units with the aim of improving the firm’s execution.
Molex Brad HarshIO IP67 modules
Product News  
12/15/2011   Post a comment
Molex's Brad HarshIO Ethernet I/O modules employ QuickConnect and Fast Start-Up technologies, enabling them to start and operate in less than 500ms for industrial applications.
ST creates early-stage VC fund
News & Analysis  
12/15/2011   7 comments
STMicroelectronics NV, Europe's leading chip company, has announced the launch of ST New Ventures, a corporate venture capital fund. However, the announcement did not indicate how much money the organization will have at its disposal.
CAST introduced UDP hardware IP block
Product News  
12/15/2011   2 comments
UDP is a protocol used for video and audio streaming. CAST has released a hardware IP implementation of this for ASIC and FPGA
Analysts sees weaker chip sales in November
News & Analysis  
12/15/2011   2 comments
The three-month average of global chip sales for November is going to be $25.6 billion flat compared to $25.74 billion reported for October by World Semiconductor Trade Statistics organization, according to Bruce Diesen, an analyst at Carnegie Group (Oslo, Norway).
Renesas develops 40-nm embedded automotive flash memory
Product News  
12/15/2011   1 comment
Renesas Electronics has said it has developed a 40-nm embedded flash memory intellectual property for implementation at 40-nm and use in automotive applications.
ST claims world first contactless wafer test
News & Analysis  
12/15/2011   9 comments
European chip company STMicroelectronics NV has said it has produced the first wafer on which the die were fully tested wirelessly and without the use of contact probes.
Report: Apple ups ante with Israel R&D center
News & Analysis  
12/15/2011   4 comments
Apple has employed a veteran technologist to help it set up an R&D center in Israel, according to a Globes report.
Rambus, ITRI to collaborate on 3-D packaging
News & Analysis  
12/15/2011   Post a comment
Rambus said it is engaging Taiwan's Industrial Technology Research Institute on the development of interconnect and 3-D packaging technologies.
Lam to buy Novellus in $3.3B, all-stock deal
News & Analysis  
12/15/2011   Post a comment
Lam Research signed an agreement to acquire rival semiconductor capital equipment maker Novellus Systems in an all-stock deal valued at about $3.3 billion.
Intel announces mobile and wireless reorganization
News & Analysis  
12/15/2011   13 comments
In a bid to tighten and hone its mobile technology focus, Intel Corp. has confirmed it has reorganized several business units to form a new mobile and communications group which will be responsible for all the firm’s smartphone, tablet and wireless communication efforts.
CAN transceiver isolates signals to 5 kVrms, handles 125°C
Product News  
12/14/2011   Post a comment
ADM3054 from Analog Devices tackles industrial, automotive digital interface problems
Globalfoundries announces 20-nm chip tape out
News & Analysis  
12/14/2011   4 comments
ARM and Globalfoundries have announced the tape out of a 20nm chip and have demoed a Cortex-A9 SoC operating at more than 2.5GHz on 28nm technology.
Flexible substrates harness carbon
News & Analysis  
12/14/2011   1 comment
Carbon nanotube ink outperforms organic alternatives for future flexible electronics printed with ink jets, according to the U.S. Department of Energy's Lawrence Berkeley National Laboratory.
MIL-compliant, ruggedized COTS computing subsystems target military ground vehicles
Product News  
12/14/2011   Post a comment
Open-standard, high-reliability platforms meet EMI and harsh-environment standards.
Gartner sees 20% drop in IC capex in 2012
News & Analysis  
12/14/2011   Post a comment
Market research firm Gartner said it expects global semiconductor capital spending to decline by 19.5 percent from this year's projected total, largely due to the slowing macroeconomic environment.
Qualcomm becomes Imagination Technologies licensee
News & Analysis  
12/14/2011   2 comments
Qualcomm has become a new Imagination Technologies licensee, along with MStar, Ricoh and Rockchip, joining existing partners like Sony, Intel, Mediatek, Renesas, Samsung, Sigma and Realtek.
Microsemi announces Libero SoC v10.0 IDE
Product News  
12/14/2011   1 comment
Next-generation solution streamlines customizable SoC design efforts
Broadcom raises fourth quarter revenue guidance
News & Analysis  
12/14/2011   1 comment
Wireless and broadband fabless chip company Broadcom Corp. has raised its financial guidance for the fourth quarter of 2011. The company has increased it net revenue guidance to high-end of the previous range to approximately $1.8 billion.
All members of Lattice’s MachX02 “Do-It-All” PLD family now in production
Product News  
12/14/2011   3 comments
New $29.99 evaluation kit enables easy access to production-qualified PLD technology…
CES: USB wall outlets power up consumer devices
News & Analysis  
12/14/2011   14 comments
International CES is always chuck full of goodies for the consumer and this year’s event in Las Vegas is no exception, as far as the TechZones are concerned.
Report: TSMC reserves land for 450-mm fab
News & Analysis  
12/14/2011   3 comments
A 50-hectare (about 120 acres) plot of land is being appropriated by the Central Taiwan Science Park in Taichung, Taiwan, on which foundry Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) could build a 450-mm wafer fab, according a local report.
Redpine tips Gbit/s Wi-Fi design
News & Analysis  
12/14/2011   Post a comment
Redpine Signals completed the design of Quali-Fi, a low power Wi-Fi block based on the 802.11ac standard that supports up to a Gbit/second of throughput over 5 GHz..
STEC claims highest-endurance SSD
Product News  
12/14/2011   Post a comment
The company extends Its ZeusIOPS® SSD family and lays claim to the industry’s highest endurance MLC flash-based SSD for the data center
Intel weakness not just about HDDs, says Nomura
News & Analysis  
12/14/2011   10 comments
Investment broker Nomura Equity Research reckons the $1 billion that Intel shaved off its forecast for 4Q11 sales revenue is about more than just a shortage of hard disk drives hurting PC sales.
Intel, Inside make NFC deal
News & Analysis  
12/14/2011   9 comments
Inside Secure SA, a fabless supplier of near field communications (NFC) chips, has signed a technology transfer agreement to provide Intel Corp. with NFC designs and technologies.
Nvidia releases CUDA compiler source code
News & Analysis  
12/14/2011   4 comments
Nvidia siad it would provide the source code for its CUDA low-level virtual machine-based compiler to academic researchers and software-tool vendors, a move the chip firm said would more easily add GPU support for more programming languages and support CUDA applications on alternative processor architectures.
FormFactor, Sequans cut Q4 outlooks
News & Analysis  
12/14/2011   1 comment
Wafer probe card maker FormFactor and chip vendor Sequans Communications became the latest chip industry players to lower their sales targets for the fourth quarter, citing difficult market conditions.
TI releases tiny power management ICs
News & Analysis  
12/13/2011   2 comments
Texas Instruments has unveiled what it claims to be the smallest power management ICs (PMICs) for solid state drives (SSDs), hybrid drives and other Flash memory applications.
TI introduces industry’s smallest power management ICs for solid state drives
Product News  
12/13/2011   Post a comment
The LM10504, LM10503 and LM10506 power management ICs (PMICs) from Texas Instruments Incorporated (TI) are a family of tiny, single-chip, power management integrated circuits (PMICs) for powering all the supply rails in solid state drives (SSDs), hybrid drives, and other Flash memory management applications.
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