Scaling methods apply to EUV, says IMEC litho chief News & Analysis 2/27/2009 Post a comment Techniques being used to extend the life of 193-nm lithography appear equally applicable to next-generation extreme ultraviolet lithography, which could greatly increase the extendibility of the technology, according to Kurt Ronse, director of the advanced lithography program at nanoelectronics research center IMEC.
Stringer assumes Sony presidency in major reorg News & Analysis 2/27/2009 Post a comment Sony Chairman and CEO Howard Stringer will also assume the title of president of the Japanese electronics giant as part of a major restructuring that includes management changes and the formation of two new business groups. The changes will go into effect April 1.
January chip sales seen down 30% year-on-year News & Analysis 2/27/2009 Post a comment The three-month moving average of global chip sales is expected to come in at $15.1 billion for January, down from the $17.7 billion achieved in December 2008, according to analysts at Carnegie Group (Oslo, Norway).
TSMC tips litho roadmap, backs maskless News & Analysis 2/27/2009 2 comments At the SPIE Advanced Lithography conference here, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) disclosed its lithography roadmap and said it is still backing maskless technology.
Analyst weighs benefits of Nokia/Qualcomm link News & Analysis 2/27/2009 Post a comment Qualcomm is likely to see its position as the leading supplier of baseband chips for next generation mobile handsets enhanced following its recent deal with Nokia, but the jury is still very much out on just what market share gains it woud enjoy, according to market research group iSuppli.
German industry calls for microelectronics aid News & Analysis 2/27/2009 Post a comment The VDE, umbrella group for the German electrotechnical and electronics industry, has raised its voice in favor of state aid for the ailing chip industry. At the EC level, the industry might find this a hard nut to crack.
Tokyo Electron, Oerlikon cooperate on PV sales News & Analysis 2/27/2009 Post a comment Semiconductor equipment providers Tokyo Electron (Japan) and Oerlikon Solar (Switzerland) have announced a sales cooperation for photovoltaic equipment. The move aims at improving Oerlikon's market position in the Far East.
Mixed prospects seen for memories markets News & Analysis 2/27/2009 Post a comment The DRAM market will show significant quarterly growth throughout the rest of 2009, after touching a revenue low point in the first quarter, according to market research group IC Insights (Scottsdale, AZ.).
What is source-mask optimization? News & Analysis 2/27/2009 1 comment A war of words of sorts emerged at the SPIE Advanced Lithography conference among vendors developing source-mask optimization tools in hopes of extending 193-nm immersion lithography to the 22-nm node.
Comment: Android beyond the phone News & Analysis 2/26/2009 Post a comment Look out, Redmond, I'm seeing signs that Google's Android could wind up in netbooks, digital picture frames and a host of embedded devices as a friendly, app-rich face for Linux.
Mentor posts profit, but will cut jobs News & Analysis 2/26/2009 Post a comment EDA vendor Mentor Graphics posted a profit of $31.5 million on revenue of $242.6 million for the quarter ended Jan. 31, in line with a revenue warning the company issued earlier this month. The company said it plans to cut an unspecified number of jobs as it trims costs amid the economic downturn.
250mA LDO withstands 80V input Product News 2/26/2009 Post a comment Linear Technology has announced a high reliability (MP) grade, wider temperature range version of the LT3013, a micropower LDO with input voltage capability up to 80V.
Audio network chip start-up nabs $6 million News & Analysis 2/26/2009 Post a comment BridgeCo Inc., the provider of processor IC and software platforms for home networking and Internet radio, has raised a further $6 million from its existing backers, bringing the total raised to $59 million.
NEC miniaturizes DPAK form factor Product News 2/26/2009 Post a comment After the introduction of its HSON-8 power transistor package, NEC Europe again rolls a new package form factor and design aiming at power devices in particular for automotive applications.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.