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Content posted in February 2009
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Panasonic joins Japan's recession victims
News & Analysis  
2/2/2009   Post a comment
Panasonic Corp. is expected to post a consolidated net loss of about 350 billion yen ($3.89 billion) for this fiscal year ending March. The news came on the heels of a series of red ink warnings from Japan's leading electronics companies.
200 W GaN HEMT targets applications up to 1.2 GHz
News & Analysis  
2/2/2009   Post a comment
For applications up to 1.2 GHz, The NPT1007 from Nitronex comprises two power transistors, 100 W each, in an industry standard four lead Gemini package.
Toon tapped as CEO of picoChip
News & Analysis  
2/2/2009   Post a comment
Nigel Toon has been appointed President and CEO at wireless chip company picoChip (Bath, England), replacing Guillaume d'Eyssautier.
Global chip sales fell 2.8% in 2008, says SIA
News & Analysis  
2/2/2009   Post a comment
Total semiconductor sales for 2008 were $248.6 billion compared to $255.6 billion in 2007, a decrease of 2.8 percent, according to the Semiconductor Industry Association.
Sequans et Varioptic dans la Silicon 60 de EE Times
News & Analysis  
2/2/2009   Post a comment
Seules 2 sociétés françaises, Sequans communications et Varioptic ont été reprises dans le palmarès Silicon 60 alors que l'on y retrouve 10 sociétés britanniques. Est ce dû à un manque de créativité ou de capitaux?
Global 'averaged' chip sales fell 21.9% in December, says SIA
News & Analysis  
2/2/2009   Post a comment
The three-month moving average of worldwide sales of semiconductors declined by 21.9 percent in December 2008 to $17.41 billion, compared to sales of $22.28 billion in December 2007, averaged on the same basis, according to the Semiconductor Industry Association (SIA), which referenced World Semiconductor Trade Statistics as its source.
Skyworks and Ember announce the availability of a reference design for ZigBee FEMs
News & Analysis  
2/2/2009   Post a comment
Skyworks Solutions and Ember have announced a reference design for the industry's first portfolio of ZigBee front-end modules targeting applications such as smart meters in energy management, home area networks (HAN), and industrial automation.
iSuppli confirms consumerisation will drive MEMS future
Product News  
2/2/2009   Post a comment
Confirming the consumerisation trend for microelectromechanical Systems (MEMS), research company iSuppli Corp. has projected that global revenue from consumer and mobile electronics shipments of MEMS will rise to $2.6 billion in 2012, up from $1.1 billion in 2006.
Allegro : Automotive sensor offers dual operating modes
Product News  
2/2/2009   1 comment
The A1386 is a user-programmable linear Hall-effect sensor IC targeted at applications in the automotive market requiring flexibility and accuracy in absolute position sensing.
Renesas : Automotive dual-core SoC includes image recognition
Product News  
2/2/2009   Post a comment
Renesas Technology has announced the SH7776 (SH-Navi3), a dual-core system-on-chip (SoC) device with on-chip enhanced graphics functions and a high-performance image recognition processing function for the next generation high-performance car information terminals.
Tektronix : Mid-performance oscilloscopes offer serial triggering and analysis
Product News  
2/2/2009   Post a comment
The Tektronix DPO3000 series is a family of lower-cost mid-performance oscilloscopes incorporating the long record length needed for serial data analysis in embedded systems.
December chip sales fell 32.2% year-on-year, says analyst
News & Analysis  
2/2/2009   Post a comment
The three month moving average of global chip sales for December came in even worse than expected, down to $17.4 billion from the $20.9 billion achieved in November and 21.9 percent lower year-on-year, according to Bruce Diesen of brokers Carnegie ASA in Oslo, Norway. ,
Fujitsu : Fast A-D technology provides up to 56 Gsamples per second
Product News  
2/2/2009   Post a comment
Fujitsu Microelectronics has announced its ultrafast A/D converter IP based on CHArge-mode Interleaved Sampler technology (CHAIS) for use in its standard 65-nm CMOS process technology.
Xilinx lays foundation for 'targeted design platforms'
Product News  
2/2/2009   Post a comment
For the first time, Xilinx is simultaneously launching the next generations of its high-end Virtex and low-cost Spartan FPGAs, billed as the foundation for "targeted design platforms" that the company says will be supported by intellectual property cores, design environments, reference designs and scalable boards and kits offered by Xilinx and third-party partners.
EE Times updates list of emerging startups to version 8.0
News & Analysis  
2/2/2009   3 comments
The EE Times 60 Emerging Startups list, first published in April 2004, has been updated to version 8.0 to reflect the latest corporate, commercial, technology and market conditions.
Nujira readies power efficiency technology for mobiles
Product News  
2/2/2009   Post a comment
Power amplifier specialist Nujira has launched its Coolteq-I high accuracy tracking technology IP targeting handset RF front ends for 3G, LTE and WiMAX devices that are likely to hit the market in 2011.
Altera expands transceiver based FPGA range
Product News  
2/2/2009   Post a comment
Altera is expanding its transceiver based range of FPGAs, both of which will be made by TSMC in a 40-nm process and which extends the range of parts from 175Mbits/s to 11.3Gbits/s.
Freescale en pertes de $8 milliards en 2008
News & Analysis  
2/2/2009   Post a comment
Freescale Semiconductor Inc. continue de faire des pertes mais la vraie question est de savoir combien de temps cela peut durer. En 2008, Freescale a perdu près de $8 milliards (environ 6 milliards d'euros).
Analysis: What's the future of IBM Micro?
News & Analysis  
2/2/2009   Post a comment
IBM Corp.'s move last week to implement layoffs within its semiconductor unit follows a dramatic slump in sales, product setbacks and numerous false starts in the sector.
Rambus demos mobile memory interface at DesignCon
Product News  
2/2/2009   1 comment
Rambus Inc. will demonstrate at DesignCon a new memory interface geared for mobile devices that delivers 16 times the bandwidth of today's technologies at a fraction of the power they would consume.
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