Mil/aero group foresees shift to optical in 2012 News & Analysis 2/24/2010 1 comment The VITA Standards Organization, a leading standards group for military and aerospace markets, will announce as early as next week a call for participation in a group to explore the feasibility of deploying in 2012 products with optical backplanes and system interconnects.
0.7mm-high slide switch targets mobile devices Product News 2/24/2010 Post a comment Alps Electric Europe announced the development of the SSAJ series, a 0.7mm-high slide switch that enables the design of more compact electronic devices including mobile phones, digital cameras and compact music players
Directed self-assembly grabs the spotlight at SPIE News & Analysis 2/24/2010 Post a comment If there is a darling of this year's SPIE Advanced Lithography conference, it just might be directed self-assembly, a technology that emerged in recent years to land on the International Technology Roadmap for Semiconductors and is considered a potential candidate to extend optical lithography.
IR rolls GaN devices Product News 2/24/2010 Post a comment International Rectifier Inc. has introduced the industry's first family of commercial integrated power stage products utilizing IR's gallium nitride (GaN)-based power device technology platform.
APEC: Tesla Roadster, solar-panel dangers kickstart power fest News & Analysis 2/24/2010 Post a comment The 25th APEC kicked off with a dynamic plenary session that discussed the past and future of power, exposed the latest improvements to the Tesla Sports Roadster, uncovered the hidden dangers and inefficiencies of solar panels and showed how close-coupling cooling can achieve a 31 percent improvement in cooling efficiency for data centers.
GlobalFoundries, Samsung join e-beam group News & Analysis 2/23/2010 Post a comment The eBeam Initiative--a forum dedicated to the education and promotion of a new design-to-manufacturing approach known as design for e-beam (DFEB)--has announced that six additional companies have joined the group.
Verigy posts loss amid sales gain News & Analysis 2/23/2010 Post a comment ATE supplier Verigy Ltd. said revenue for the first quarter was $106 million, an increase of 9 percent from the prior quarter, and an increase of 56 percent from the prior year period.
IBM says litho chemical better for environment News & Analysis 2/23/2010 Post a comment IBM said researchers from its Semiconductor Research and Development Center have developed a fluorine-free photo-acid generator for use in 193-nm lithography, billed as a more environmentally friendly alternative than the fluorine-based perfluorooctane sulfonate and perfluorooctanoic acid currently in use.
Intel-led alliance pledges $3.5B in venture funds News & Analysis 2/23/2010 Post a comment The Invest in America Alliance, a group of 25 venture capital and 17 high tech companies led by Intel Corp., pledged to invest $3.5 billion in U.S. technology startups over the next two years and hire as many as 10,500 college students in 2010.
DAC 2010 to award Richard Newton graduate scholarships News & Analysis 2/23/2010 Post a comment The 47th Design Automation Conference, to be held from June 13 to 18, 2010, in Anaheim, Calif., intends to award scholarships to promote graduate research and study in EDA and circuit design. These $24.000 scholarships are in honor of the memory of Dr. A. Richard Newton.
DNA sequencing startup pulls in $7 million News & Analysis 2/23/2010 Post a comment Nabsys Inc. (Providence R.I.), a developer of electronic, solid-state DNA sequencing, has announced it has received a $7 million investment as part of a Series B equity round led by Stata Venture Partners.
Mid-year slump to limit chip market growth, says analyst News & Analysis 2/23/2010 Post a comment A mid-year slump in the western economy is likely to inhibit consumer electronics spending and hold annual semiconductor revenue growth back at 11.2 percent in 2010, according to Robert Castellano of market research company The Information Network (New Tripoli, Pennsylvania).
TSMC, Dialog team on process for power management ICs News & Analysis 2/23/2010 Post a comment Power management chip vendor Dialog Semiconductor plc (Kirchheim-unter-Teck, Germany) has announced it is working with foundry partner Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan) on a bipolar-CMOS-DMOS (BCD) manufacturing process technology tailored to power management ICs for portable devices.
GateRocket rolls new version of FPGA debug tool Product News 2/23/2010 Post a comment FPGA verification and debug software vendor GateRocket Inc. Tuesday (Feb. 23) announced the newest version of its RocketVision debugging software, introducing new capabilities that allow designers to select individual design blocks to run in their simulator or GateRocket's RocketDrive hardware verification system.
X-FAB opens UK branch office News & Analysis 2/23/2010 Post a comment Following the recent sale of its Plymouth silicon fabrication facility to Plessey Semiconductors, X-FAB has established a UK office supporting research and development, customer hotline support and sales
EUV delayed again. Now what? News & Analysis 2/23/2010 2 comments This is not a surprise to most lithographers, but extreme ultraviolet (EUV) lithography is delayed. EUV is now targeted for chip production at the 16-nm half-pitch node.
Xilinx banks on power efficiency for 28-nm Product News 2/22/2010 Post a comment By the end of this year, Xilinx Inc. will begin sampling 28-nm FPGAs that consume half the power of its current devices while offering twice the capacity as previously possible, the company said Monday (Feb. 22).
Mentor Graphics to address variant diversity Product News 2/22/2010 Post a comment With the acquisition of Freescale's Virtual Garage software product line, EDA software vendor Mentor Graphics plans to address two aspect that increasingly complicate automotive electronic designer's work: First, the conflict between added value and costs associated with the complexity of multiple electronics options in cars. The second aspect is the availability of vehicle-specific design data to service workshops for instance dynamic circuit diagrams.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.