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Content posted in March 2012
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GSA has board election, plans silicon summit
News & Analysis  
3/27/2012   Post a comment
The Global Semiconductor Alliance has filled six positions on its board of directors including five semiconductor positions and one value chain producer position.
Lattice, Intellivision announce intelligent HD video analytics for HDR-60 camera dev kit
Product News  
3/27/2012   1 comment
Video Analytics with the Lattice HDR-60 Video Camera Development Kit improve time to market for 1080p camera applications
TI announces Audio Capacitive Touch BoosterPack for ultra-low-power MSP430 MCUs
Product News  
3/27/2012   Post a comment
Add crystal clear audio to MCU-based apps; harness real-time DSP performance using easy-to-use, plug-in board for the MSP430 LaunchPad development kit
TI offers drop-in GPS capability
Product News  
3/27/2012   Post a comment
SimpleLink GPS CC4000 brings GPS capabilities to microcontroller-based designs for location, precision timing and velocity applications.
Judge upholds injunction on Kaleidescape
News & Analysis  
3/27/2012   1 comment
A court upheld an injunction banning sales of a home server from Kaleidescape, a heavy blow to the company but is largely irrelevant to the broader industry.
Group demos power-saving PON protocol
News & Analysis  
3/27/2012   1 comment
A consortium will demonstrate Bi-PON, a bit-interleaving protocol it says can slash thirty-fold power consumption of today’s passive optical networks.
Design West: LDRA offers IEC 62304 and ISO 14971 certification-readiness services for medical devices
News & Analysis  
3/27/2012   Post a comment
LDRA Certification Services (LCS) has announced a fully-compliant IEC 62304 and ISO 14971 certification solution for medical device manufacturers.
Cosmic Software tips dev tools for Freescale's S12ZVH MagniV MCUs
News & Analysis  
3/27/2012   Post a comment
Cosmic Software announced the immediate availability of development tools for Freescale Semiconductor's S12Z CPU Core and S12ZVH MagniV microcontroller family at the DESIGN West event.
Oclaro, Opnext to merge
News & Analysis  
3/26/2012   Post a comment
Oclaro, a provider of optical communications and laser products, said it agreed to merge with optical module and components vendor Opnext in an all stock deal.
Chip rankings: Intel had highest share in over 10 years
News & Analysis  
3/26/2012   3 comments
Intel accounted for 15.6 percent of the overall semiconductor market in 2011, as brisk sales of its core chips and the acquisition of Infineon AG's wireless chip business unit helped the No. 1 chip vendor achieve its highest share of the overall chip market in more than 10 years, according to market research firm IHS iSuppli.
Microchip brings cost-effective analog/digital capabilities to 8-bit PIC microcontrollers
Product News  
3/26/2012   Post a comment
New MCUs feature on-chip 12-bit ADC, 8-bit DAC, op amps, high-speed comparators, eXtreme low power technology, and 16-bit PWM for advanced control
Nvidia's Kepler to get compute cousin, says analyst
News & Analysis  
3/26/2012   1 comment
Nvidia will likely announce a follow-up to its recently launched Kepler platform to better address upcoming compute products and the HPC space later this year, according to an analyst.
TDK eSSD integrates controller and flash memory in a single package
Product News  
3/26/2012   Post a comment
3 Gbps SSDs pack up to 4 GB of NAND flash memory in a 17-mm x 17-mm form factor for industrial applications.
Cadence introduces LPDDR3 memory IP solution
Product News  
3/26/2012   1 comment
SoC designers can implement latest memory interface targeting tablets and smart phones.
Cadence supports development of the cloud
Product News  
3/26/2012   3 comments
Cloud computing depends on many parts and services, all of which conform to standards and support of those standards is imperative for cloud deployment…
Microchip simplifies C compiler line
Product News  
3/26/2012   3 comments
Provides best execution speed and code size for all PIC MCUs and dsPIC DSCs
Lattice announces MachXO2-based bridge design for Sony IMX136 image sensor
Product News  
3/26/2012   1 comment
The folks from Lattice will be demonstrating camera design solutions at the ISC West Conference
Latest Freescale wireless robot can walk, dance, and teach sensor programming
Product News  
3/26/2012   2 comments
Tower System mechatronics robot and board enable rapid sensor application development with easy-to-use programming language and expanded capabilities
Red Micro Wire encapsulates wire bonding in glass
News & Analysis  
3/26/2012   1 comment
Red Micro Wire, a Singapore-based company with roots in Israel, has developed a breakthrough technology for the semiconductor bonding wire process that the company claims provides a cost-effective, highly scalable alternative to current solutions.
Curtiss-Wright enhances AVDU-1626/7 6.5" VGA multi-function LCD display
Product News  
3/26/2012   Post a comment
Curtiss-Wright Controls Defense Solutions has extended the family of Skyquest rugged mission displays for helicopter and fixed-wing platforms with the introduction of an upgraded version of the Skyquest AVDU1626 6.4” display.
TI rolls low power Keystone DSPs
News & Analysis  
3/26/2012   Post a comment
TI will take its Keystone architecture into low power apps at Design West with single and dual-core DSPs that consume from 2 to 3.5W.
ST closes in on TI atop MEMS top 30 ranking
News & Analysis  
3/26/2012   6 comments
STMicroelectronics and Texas Instruments were the leading manufacturers of microelectromechanical systems components in 2011 in a market that grew 17 percent to reach $10.2 billion, according market analysis firm Yole Developpement.
Altera to showcase SoC FPGAs and advanced embedded technologies at ESC DESIGN West 2012
News & Analysis  
3/26/2012   Post a comment
SoC FPGA virtual target with FPGA-in-the-Loop extension enables device-specific embedded software development targeting SoC FPGAs
Multi-cores tackle human interface
News & Analysis  
3/26/2012   5 comments
The diverse demands of realtime process control which must nevertheless offer a touch-enabled user-interface—from smart appliances to point-of-sale terminals to medical monitors—is best addressed by heterogeneous multi-core processors, according to Freescale Semiconductor, which introduced its new Vybrid family of microcontrollers at DESIGN West 2012.
MEMS' new battleground: Hardware-agnostic sensor fusion?
News & Analysis  
3/26/2012   7 comments
As more and more MEMS sensors are showing up in mobile devices, the focus of MEMS design has begun shifting from discrete MEMS components to MEMS sensor data integration.
Eight19 readies printed plastic solar cell R&D center
News & Analysis  
3/26/2012   7 comments
Eight19 Ltd. (Cambridge, England), a spin-off from the University of Cambridge chartered with producing printed plastic solar cells, has announced it has commissioned a development and roll-to-roll printing facility at its headquarters.
Ambiq launches nanoampere RTC chips
Product News  
3/25/2012   10 comments
Fabless chip company Ambiq Micro has announced the introduction to the market of the AM08XX and AM18XX real-time clock (RTC) chips, which the company claims are the world's lowest power RTC chips. The typical active current is between 15 and 55 nanoamperes, Ambiq said.
Autofocus MEMS company selects TI as foundry
News & Analysis  
3/25/2012   2 comments
poLight AS (Horten, Norway), a vendor of optical MEMS actuated autofocus lenses, has announced that it is working with Texas Instruments Inc. to produce the optical MEMS part of its TLens assembly.
Movidius signs $25 million Chinese partnership deal
News & Analysis  
3/25/2012   2 comments
Fabless mobile multimedia chip company Movidius has signed a deal with electronics manufacturer Keen High Technologies that is expected to generate more than $25 million of equipment sales over the next three years, according to reports.
Design West: LDRA Certification Services streamlines FAA/EASA certification at a fixed price
News & Analysis  
3/25/2012   Post a comment
LDRA Certification Services (LCS), a division of LDRA, is announcing the first comprehensive and fully compliant FAA/EASA certification solution.
Design West: Express Logic's ThreadX RTOS supports both symmetric and asymmetric multiprocessing for multicores
Product News  
3/24/2012   Post a comment
Express Logic, Inc., has announced that the ThreadX RTOS now is available for multicore systems in both Symmetric Multiprocessing (SMP) or Asymmetric Multiprocessing (AMP) modes.
Lime Microsystems, Altera team for Universal Wireless Communications Toolkit
Product News  
3/24/2012   Post a comment
UK transceiver designer Lime Microsystems and Altera have teamed up to develop a Universal Wireless Communications Toolkit that allows developers to create wireless protocols of almost any complexity, including flexible M2M and white space systems.
Kontron launches industrial M2M controller
Product News  
3/24/2012   Post a comment
Kontron has developed a Machine-to-Machine (M2M) system that is easily deployable for industrial and extended temperature environments based around the COM Express format, an Intel Atom processor and Wind River's VxWorks real time operating system.
Set-top box IC family enables more value-added services for entry-level equipment
Product News  
3/24/2012   Post a comment
STMicroelectronics has revealed the company’s range of set-top box system-on-chip ICs for HD terrestrial, cable IP and satellite equipment providing platform for operators and retailers to deliver innovative Internet-based services in price-sensitive markets.
Micrium, TI launch TCP/IP book with robotics examples
News & Analysis  
3/24/2012   4 comments
Real time operating system vendor Micrium has teamed up with Texas Instruments Incorporated to produce a new book based on the uC/TCP-IP network stack and TI's Stellaris EVALBOT robotic evaluation platform.
RIM announces BlackBerry 10 for developers in May
News & Analysis  
3/23/2012   3 comments
BlackBerry smartphone maker Research In Motion said it will launch BlackBerry 10 developer tools in beta and will distribute a limited edition developer prototype device at its BlackBerry 10 Jam event in Orlando, Fla., in May.
STMicroelectronics’ advanced wireless MCU to serve smart grid benefits to energy-conscious users
Product News  
3/23/2012   1 comment
True single-chip microcontroller with industry-standard radio taps into STM32 DNA and latest protocols to speed-up arrival of better energy-saving products
Microsemi to share expertise and demo solutions at DESIGN West
News & Analysis  
3/23/2012   Post a comment
The March 27-29 event in San Jose, California, will highlight the latest developments in electronic design
Is 'vision' the next-gen must-have user interface?
News & Analysis  
3/23/2012   21 comments
Earlier this month, IMS Research issued a press release questioning if Apple and the iPad are falling behind competitors in user interface technologies.
Inside Secure to show anti-counterfeiting chip at DESIGN West
News & Analysis  
3/23/2012   2 comments
Inside Secure, the French based security chip vendor, will demonstrate its latest near field communications-based anti-counterfeiting chip next week at the DESIGN West conference in San Jose, Calif.
Fab tool book-to-bill above parity for first time in 16 months
News & Analysis  
3/23/2012   Post a comment
North America-based manufacturers of semiconductor capital equipment posted a book-to-bill ratio of 1.01 on a three-month average basis for February, the first time the industry has achieved a book-to-bill above parity since September of 2010, according to the fab tool vendor trade group SEMI.
Hynix name change reflects SK investment
News & Analysis  
3/23/2012   Post a comment
Memory chip manufacturer Hynix Semiconductor Inc. is changing its name to SK Hynix Inc. as mobile network operator SK Telecom Co. Ltd. completes the acquisition of a 21 percent stake in Hynix for 3.34 trillion won (about $3 billion).
Stion begins PV shipments from Hattiesburg factory
News & Analysis  
3/23/2012   2 comments
Stion, a startup formed to manufacture thin-film solar modules, has announced it has received UL and IEC certifications to ship modules from its Hattiesburg, Missouri factory.
Micron broadening support for memory cube
News & Analysis  
3/23/2012   5 comments
At next week’s Design West, Micron will discuss plans to broaden support around its Hybrid Memory Cube, a high profile initiative in a growing wave of 3-D chip stacks.
Siemens extends lead in European patent ranking
News & Analysis  
3/23/2012   Post a comment
Siemens AG was the leader in European patent applications in 2011, according to the Patent Applicant Ranking of the European Patent Office. Electronics giant Samsung overtook German chemical and materials company BASF to claimed third spot behind Philips.
Panel sees MEMS market boom, silicon to win more slots
News & Analysis  
3/23/2012   2 comments
The consumer electronics industry is going to continue as the driver for rapid expansion in MEMS volume shipments with established equipment being loaded with more sensors and actuators even as sales expand and new equipment comes on to the scene. That's according to the final panel discussion at the MEMS Executive Congress Europe held in Zurich, Switzerland, on Tuesday March 20.
Analog Devices Inc. ADE7816 single-chip energy measurement AFE (analog front end)
Product News  
3/23/2012   1 comment
Analog Devices' latest single-chip energy measurement AFE is capable of monitoring the energy consumption and power quality of up to six electrical circuits.
ST's advanced wireless MCU supports SEP 2.0, reduces power outages and carbon emissions
Product News  
3/22/2012   2 comments
STMicroelectronics has begun advanced sampling of the STM32W, its newest single-chip wireless microcontroller for the next generation of smart grid standards.
Micron posts third straight quarterly loss
News & Analysis  
3/22/2012   9 comments
U.S. based memory chip maker Micron Technology reported its third straight quarterly loss as increased sales volumes were offset by declines in average selling prices.
TI tips IC portfolio for Thunderbolt interconnect
News & Analysis  
3/22/2012   5 comments
Texas Instruments claimed to offer the semiconductor industry's first IC portfolio optimized for the Thunderbolt high-speed interface standard.
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