Oclaro, Opnext to merge News & Analysis 3/26/2012 Post a comment Oclaro, a provider of optical communications and laser products, said it agreed to merge with optical module and components vendor Opnext in an all stock deal.
Chip rankings: Intel had highest share in over 10 years News & Analysis 3/26/2012 3 comments Intel accounted for 15.6 percent of the overall semiconductor market in 2011, as brisk sales of its core chips and the acquisition of Infineon AG's wireless chip business unit helped the No. 1 chip vendor achieve its highest share of the overall chip market in more than 10 years, according to market research firm IHS iSuppli.
Red Micro Wire encapsulates wire bonding in glass News & Analysis 3/26/2012 1 comment Red Micro Wire, a Singapore-based company with roots in Israel, has developed a breakthrough technology for the semiconductor bonding wire process that the company claims provides a cost-effective, highly scalable alternative to current solutions.
ST closes in on TI atop MEMS top 30 ranking News & Analysis 3/26/2012 6 comments STMicroelectronics and Texas Instruments were the leading manufacturers of microelectromechanical systems components in 2011 in a market that grew 17 percent to reach $10.2 billion, according market analysis firm Yole Developpement.
Multi-cores tackle human interface News & Analysis 3/26/2012 5 comments The diverse demands of realtime process control which must nevertheless offer a touch-enabled user-interface—from smart appliances to point-of-sale terminals to medical monitors—is best addressed by heterogeneous multi-core processors, according to Freescale Semiconductor, which introduced its new Vybrid family of microcontrollers at DESIGN West 2012.
Eight19 readies printed plastic solar cell R&D center News & Analysis 3/26/2012 7 comments Eight19 Ltd. (Cambridge, England), a spin-off from the University of Cambridge chartered with producing printed plastic solar cells, has announced it has commissioned a development and roll-to-roll printing facility at its headquarters.
Ambiq launches nanoampere RTC chips Product News 3/25/2012 10 comments Fabless chip company Ambiq Micro has announced the introduction to the market of the AM08XX and AM18XX real-time clock (RTC) chips, which the company claims are the world's lowest power RTC chips. The typical active current is between 15 and 55 nanoamperes, Ambiq said.
Autofocus MEMS company selects TI as foundry News & Analysis 3/25/2012 2 comments poLight AS (Horten, Norway), a vendor of optical MEMS actuated autofocus lenses, has announced that it is working with Texas Instruments Inc. to produce the optical MEMS part of its TLens assembly.
Movidius signs $25 million Chinese partnership deal News & Analysis 3/25/2012 2 comments Fabless mobile multimedia chip company Movidius has signed a deal with electronics manufacturer Keen High Technologies that is expected to generate more than $25 million of equipment sales over the next three years, according to reports.
Kontron launches industrial M2M controller Product News 3/24/2012 Post a comment Kontron has developed a Machine-to-Machine (M2M) system that is easily deployable for industrial and extended temperature environments based around the COM Express format, an Intel Atom processor and Wind River's VxWorks real time operating system.
RIM announces BlackBerry 10 for developers in May News & Analysis 3/23/2012 3 comments BlackBerry smartphone maker Research In Motion said it will launch BlackBerry 10 developer tools in beta and will distribute a limited edition developer prototype device at its BlackBerry 10 Jam event in Orlando, Fla., in May.
Fab tool book-to-bill above parity for first time in 16 months News & Analysis 3/23/2012 Post a comment North America-based manufacturers of semiconductor capital equipment posted a book-to-bill ratio of 1.01 on a three-month average basis for February, the first time the industry has achieved a book-to-bill above parity since September of 2010, according to the fab tool vendor trade group SEMI.
Hynix name change reflects SK investment News & Analysis 3/23/2012 Post a comment Memory chip manufacturer Hynix Semiconductor Inc. is changing its name to SK Hynix Inc. as mobile network operator SK Telecom Co. Ltd. completes the acquisition of a 21 percent stake in Hynix for 3.34 trillion won (about $3 billion).
Siemens extends lead in European patent ranking News & Analysis 3/23/2012 Post a comment Siemens AG was the leader in European patent applications in 2011, according to the Patent Applicant Ranking of the European Patent Office. Electronics giant Samsung overtook German chemical and materials company BASF to claimed third spot behind Philips.
Panel sees MEMS market boom, silicon to win more slots News & Analysis 3/23/2012 2 comments The consumer electronics industry is going to continue as the driver for rapid expansion in MEMS volume shipments with established equipment being loaded with more sensors and actuators even as sales expand and new equipment comes on to the scene. That's according to the final panel discussion at the MEMS Executive Congress Europe held in Zurich, Switzerland, on Tuesday March 20.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.