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Content posted in April 1999
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PBXCTI
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4/1/1999   Post a comment
More Mainframe Moments:A look at both standalone and CT "integrated" success stories that are centered around close-architected telephony switches, aka. Private Branch eXchanges (PBXs).
Best Of Show: CT Expo's Sweet Sixteen
News & Analysis  
4/1/1999   Post a comment
Our editors and show judges name 16 vendors in categories ranging from single-line home-office products to high-density enhanced-services platforms.
CTExpoSpring99
News & Analysis  
4/1/1999   Post a comment
What we liked at the Show
Cisco Bites the Blended Bullet
News & Analysis  
4/1/1999   Post a comment
Cisco Systems is about to light off a Saturn V-sized monster that's sure to get everyone's attention.
In Pursuit of Plastic Pirates
News & Analysis  
4/1/1999   Post a comment
Using CT to catch credit-card thieves.
Taking Stock In Fax Company Tips: A Review
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4/1/1999   Post a comment
Another look at Maury's picks
Their Best Tips
News & Analysis  
4/1/1999   Post a comment
Lanny Gilbert, a Service Conceptor at BellSouth Telecommunications' Intelligent Services Division, talks about design and problem solving
The CommFusion Landscape Takes Shape
News & Analysis  
4/1/1999   Post a comment
Venture capitalists are hedging their CommFusion bets by investing in competing solutions.
In Pursuit of Plastic Pirates
News & Analysis  
4/1/1999   Post a comment
Using CT to catch credit-card thieves.
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What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

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9/25/2016
4:48:30 PM
michigan0 Sang Kim First, 28nm bulk is in volume manufacturing for several years by the major semiconductor companies but not 28nm FDSOI today yet. Why not? Simply because unlike 28nm bulk the LDD(Lightly Doped Drain) to minimize hot carrier generation can't be implemented in 28nm FDSOI. Furthermore, hot carrier reliability becomes worse with scaling, That is the major reason why 28nm FDSOI is not manufacturable today and will not be. Second, how can you suppress the leakage currents from such ultra short 7nm due to the short channel effects? How thin SOI thickness is required to prevent punch-through of un-dopped 7nm FDSOI? Possibly less than 4nm. Depositing such an ultra thin film less then 4nm filum uniformly and reliably over 12" wafers at the manufacturing line is extremely difficult or not even manufacturable. If not manufacturable, the 7nm FDSOI debate is over!Third, what happens when hot carriers are generated near the drain at normal operation of 7nm FDSOI? Electrons go to the positively biased drain with no harm but where the holes to go? The holes can't go to the substrate because of the thin BOX layer. Some holes may become trapped at the BOX layer causing Vt shift. However, the vast majority of holes drift through the the un-dopped SOI channel toward the N+Source,...
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