HomeGrid-Gruppe treibt Heimvernetzung voran News & Analysis 4/30/2008 Post a comment Elf Unternehmen haben sich vorgenommen, die technische Fragmentierung des Markts für Heimvernetzung zu beenden. Gemeinsam wollen sie einen ITU-Standard erarbeiten, der als Grundlage für die Entwicklung von Chips für Datenraten bis in den Gigabit-Bereich dienen soll. Mit von der Partie sind unter anderem Infineon, Intel, Panasonic und Texas Instruments.
National Semi cuts 130 jobs News & Analysis 4/29/2008 Post a comment In its second major layoff this year, National Semiconductor Corp. said it would eliminate approximately 130 positions, primarily in product line and support functions.
Broadcom switch paves road to 40G News & Analysis 4/29/2008 Post a comment Companies driving to 40 Gbit/s Ethernet could settle on a single proposal as early as their next meeting, thanks in part to a recent switch from Broadcom which unveiling a range of new 65nm Ethernet chips at Interop.
PA powers EGSM WCDMA networks Product News 4/29/2008 Post a comment Engineered specifically for use in advanced 3G handsets for EGSM (Band 8) UMTS wireless networks, Anadigics' WCDMA linear power amplifier (PA) reduces average current consumption by 75 percent compared to competing devices.
Agilent EEsof enhances ADS Product News 4/29/2008 Post a comment In this version, the company reports a 10x speedup in its 3D planar electromagnetic (EM) simulator (known as Momentum), and a 10X speedup in its non-linear harmonic balance circuit simulation with an advanced matrix preconditioner.
ST's outsourced production to reach 20% by 2009 News & Analysis 4/29/2008 Post a comment STMicroelectronics' fab utilization rate amounted to 84 percent in the first quarter and is likely to increase slightly in the second quarter of 2008, according to Alain Dutheil, ST's chief operating officer and vice chairman of the corporate executive committee.
Suss puts new twist in nano-imprint News & Analysis 4/29/2008 Post a comment Germany's Suss MicroTec AG has entered into a license agreement with Philips Research of the Netherlands for a new technology called substrate conformal imprint lithography (SCIL).
Cadence boosts analog verification performance News & Analysis 4/29/2008 Post a comment Against the background of ever-increasing complexity in integrated circuit design, Cadence on its house fair Cadence Live EMEA 2008 introduced a major upgrade to its Virtuoso design platform. The enhancement aim at typical European user environments, centering on performance improvement in the verification of large analog designs.
Teridian launches third generation power meter ICs Product News 4/29/2008 Post a comment Teridian Semiconductor has launched its third generation of electricity metering chips that includes residential single phase, commercial and industrial three phase ICs, offering up to 256K bytes of storage with 10 MIPS processing power, advanced power management, LCD contrast adjust, and 0.5 second/day hardware RTC which consumes only 0.5µA.
RF transceiver targets WiMAX Product News 4/29/2008 Post a comment Maxim Integrated Products reports it has the industry's first production-ready, single-chip, 2.3GHz to 2.7GHz, WiMAX MIMO RF transceiver that improves receiver SNR by 10dB
Mezzanine card design makes FPGA integration easy Product News 4/29/2008 Post a comment VMETRO announced its first FPGA Mezzanine Card (FMC/VITA 57) module dubbed the ADC510, which is available in air-cooled and conduction-cooled rugged versions, integrates two 12-bit 500MHz A/D chips for use in DSP applications such as Signal Intelligence (SIGINT), Electronic Counter Measures (ECM), and Radar.
SMIC exits DRAMs, posts loss News & Analysis 4/29/2008 Post a comment Amid another loss for the quarter, China's Semiconductor Manufacturing International Corp. (SMIC) has reached an agreement with customers to exit the commodity DRAM business.
Group drives Gbit home network effort Product News 4/29/2008 Post a comment Eleven companies have officially launched the HomeGrid Forum, a new consortium to accelerate work on a way to unify the fragmented world of home networking and aiming to speed up work on an ITU standard to define chips that can carry data at rates up to a gigabit per second across coax, phone or power lines.
NXP to acquire Conexant's set-top box business Product News 4/29/2008 Post a comment NXP Semiconductors announced it is acquiring the Broadband Media Processing (BMP) business of Conexant Systems, Inc. for $110 million in cash with an additional payment of up to $35 million based on financial performances over the period from closing through 2009.
MIPS forges link with Portuguese University News & Analysis 4/29/2008 Post a comment MIPS Technologies announced that it is to partner with the Faculdade de Engenharia da Universidade do Porto (FEUP), a leading school of engineering in Portugal, to further innovation and technical advancement in microelectronics.
MIPS, Porto university boost semiconductor design News & Analysis 4/29/2008 Post a comment MIPS Technologies Inc. and the Faculdade de Engenharia da Universidade do Porto (FEUP), a school of engineering in Portugal, have concluded a multi-year agreement to help prepare engineering students for careers in semiconductor design.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.