Design Con 2015
Breaking News
News Analysis
Content posted in April 2012
<<   <   Page 3 / 8   >   >>
EE Times updates Silicon 60 list of emerging startups
News & Analysis  
4/23/2012   1 comment
EE Times has updated its list of 60 notable emerging startup companies to version 13.0 with the inclusion of 18 companies.
congatec's new COM Express Type 6 module has quad core, 3rd gen Intel Core processor
Product News  
4/23/2012   Post a comment
The conga-TM77 from congatec Inc. is a new COM Express module with a significant improvement in computing performance combined with enhanced energy efficiency.
ST-Ericsson passing processors to ST, cutting staff
News & Analysis  
4/23/2012   5 comments
ST-Ericsson NV, the loss making mobile chip joint venture between STMicroelectronics and Ericsson, has announced guidelines for a new strategic direction and plans to cut up to 1,700 staff to lower its breakeven point.
Mike Hackworth, chairman of Cirrus, dies aged 71
News & Analysis  
4/23/2012   1 comment
Mike Hackworth, chairman of fabless chip company Cirrus Logic Inc. has died aged 71 years. Hackworth was a veteran of Silicon Valley and a pioneer of the fabless chip company business model.
Semicon Europa sets out call for technical papers
News & Analysis  
4/23/2012   Post a comment
Industry association SEMI has a “Call for Papers” for technical sessions and presentations for the upcoming Semicon Europa 2012 with abstracts due April 30.
Microsemi announces 10,000th radiation-tolerant RTAX-S/SL FPGA shipment
News & Analysis  
4/23/2012   1 comment
Commemorating 55 years in space, Microsemi will present at an upcoming forum sponsored by the Aerospace Corporation, a federally-funded R&D center
Emcore wins $6M contract to design solar panels for spacecraft
News & Analysis  
4/23/2012   1 comment
Compound semiconductor vendor Emcore Corp. (Albuquerque, New Mexico) announced it has concluded a $6 million contract with Ball Aerospace & Technologies Corp. (Boulder, Colorado) to design, manufacture, test and deliver solar panels for a new spacecraft.
Wireless sensor networks evaluation kit for measurement and control applications
Product News  
4/23/2012   Post a comment
Designed to test applications at designated locations, the s-net evaluation kit “DATA“ released by the Fraunhofer IIS comprises a master and five sensor nodes, which independently set up a radio network as well as a pre-installed application template.
STATS ChipPAC re-appoints former ST boss as director
News & Analysis  
4/23/2012   Post a comment
Singaporean chip packaging company STATS ChipPAC Ltd. has re-appointed Pasquale Pistorio, former CEO of chip company STMicroelectronics NV, as a director.
Update: Ivy Bridge narrows AMD’s graphics lead
News & Analysis  
4/23/2012   13 comments
Intel will launch Ivy Bridge, its first CPUs using its 22nm tri-gate technology and aimed ultrabooks, narrowing archrival AMD’s lead in graphics performance.
Imagination licenses Ensigma IP to Qualcomm
News & Analysis  
4/23/2012   2 comments
Multimedia processor licensor Imagination has announced that is has licensed certain intellectual property from its Ensigma range of communications cores to fabless chip company Qualcomm.
Intel launches Ivy Bridge processor
News & Analysis  
4/23/2012   4 comments
Intel is formally launching its Ivy Bridge processor to the market. Ivy Bridge is the first device to officially come out on the company's 22-nm manufacturing process technology which includes FinFETs which are transistors built into a vertical fin of silicon.
IBM demos terahertz graphene photonics
News & Analysis  
4/22/2012   4 comments
IBM demonstrated a graphene/insulator superlattice that achieves a terahertz frequency notch filter and a linear polarizer, devices which could be useful in future mid- and far-infrared photonic devices including detectors, modulators and three-dimensional metamaterials.
Connected homes will give greater control over both entertainment and environment
News & Analysis  
4/22/2012   1 comment
Future World Symposium has announced the complete line up of its panel debate on the future of the connected home.
ISO/IEC wireless standard optimised for ultra-low power consumption and energy harvesting
News & Analysis  
4/22/2012   Post a comment
The International Electrotechnical Commission (IEC) has ratified a new standard — ISO/IEC 14543-3-10 — for wireless applications with ultra-low power consumption.
NXP enables mobile ticketing for smart mobile devices
News & Analysis  
4/22/2012   1 comment
NXP Semiconductors has announced MIFARE4Mobile as an embedded applet to support mobile ticketing for the sizeable MIFARE Classic installed base.
Evaluation board supports design of twisted pair building automation networks
Product News  
4/22/2012   Post a comment
ON Semiconductor and NXP jointly introduced an evaluation board and complete reference design for power efficient twisted pair (TP) networks.
2.4-GHz low-power RF transceiver claims lowest power consumption for industrial applications
Product News  
4/22/2012   Post a comment
Atmel Corporation has introduced an RF transceiver for battery-operated wireless applications that is optimized for industrial and consumer products complying with ZigBee/IEEE 802.15.4, IPv6 over low-power wireless personal area networks and high-data-rate 2.4 GHz ISM band applications.
Small 1080P signage player support DirectX 11
Product News  
4/22/2012   Post a comment
In the rapidly expanding digital signage market, the graphics performance of the Signage Player offered by Nexcom is very important for the users, especially those looking to display vibrant, HD content.
Atmel launches low-power, secure AES-128-based transponder for car key fob apps
Product News  
4/21/2012   Post a comment
Atmel Corporation has launched a new secure, ultra-low-power micromodule transponder based on an Atmel AVR microcontroller (MCU).
Hirosi and Micro Interconnects connect for design ins
News & Analysis  
4/21/2012   Post a comment
Two interconnect companies, Hirose and Micro Interconnects, have announced a partnership that they say will simplify specifying and designing in DF36 board-to-fine coaxial cable connectors for applications in space-restricted areas, such as hand-held devices.
Monnit launches OEMSensors.com with new, brandable wireless sensors
Product News  
4/20/2012   Post a comment
OEMSensors.com, recently launched by Monnit Corporation, offers a new line of OEM-ready wireless sensors, gateways, and back-end monitoring software targeting broad lines of commercial, industrial and M2M applications.
Eeeek! Microchip Technology acquires roving networks
News & Analysis  
4/20/2012   3 comments
This acquisition expands Microchip’s wireless offerings with additional embedded WiFi capabilities and new Bluetooth connectivity options for PIC microcontrollers
As Discovery is retired, an icon mulls America's spacefaring future
News & Analysis  
4/20/2012   8 comments
He was the first American to orbit the Earth as well as a shuttle astronaut, former U.S. senator and onetime presidential candidate. Now 90, John Glenn said he came to the retirement ceremony for shuttle Discovery in hopes of inspiring the next generation of space explorers. See also our slideshow of the Discovery festivities.
Algotronix releases MACsec product to secure Ethernet links at up to 10 Gbps
Product News  
4/20/2012   Post a comment
You need cryptographic IP cores for your FPGA products? The folks from Algotronix have the solutions…
Next up for EMS providers: Expanding beyond manufacturing services
News & Analysis  
4/20/2012   Post a comment
Electronic manufacturing services providers are evolving to provide OEM partners with design and supply chain services. Those partnerships mean a new batch of EMS services will boost the sector's growth over the next decade.
AEC-Q200-qualified, dual-in-line thin-film resistor networks come in 14- or 16-pin SOIC packages
Product News  
4/20/2012   Post a comment
Devices offer ratio tolerances to ±0.05 % and long-term ratio stability of 0.05 % and use self-passivating tantalum-nitride resistor film.
No fab for Qualcomm but firm mulls business evolution
News & Analysis  
4/20/2012   3 comments
The problems acknowledged by Qualcomm Inc. in getting enough 28-nm chips out of its foundry partner Taiwan Semiconductor Manufacturing Co. Ltd. are not about to prompt the company to build or acquire its own fab, according to Steve Mollenkopf, chief operating officer of the fabless chip company. But ways of doing business are evolving and Qualcomm is big enough to shape these to its own benefit, he said.
E-Switch TL3240 tact switch
Product News  
4/20/2012   1 comment
E-Switch's latest tact switch is a surface mount device that offers LED illumination in blue, red, green and yellow.
VLSI confab brings technology, circuits to the fore
News & Analysis  
4/20/2012   1 comment
The inextricable interdependence of technology processing and circuit design is behind the decision to overlap their technical programs at the 2012 Symposia on VLSI Technology and Circuits to be held in Honolulu in June.
Cornell Dubilier expands ultracapacitor, hybrid device families
Product News  
4/20/2012   Post a comment
Cornell Dubilier's lineup of large cell cylindrical ultracapacitors spans 1200 to 3000 farads; snap-in style ultracapacitors from 100 to 600 farads; and higher energy hybrid capacitors from 220 to 1000 farads.
Arms race in app processors drives mobile chip market
News & Analysis  
4/20/2012   3 comments
The market for semiconductors in mobile handsets – including processors, RF circuits, power management and wireless connectivity – was worth more than $30 billion in 2011, according to market research firm ABI Research.
SanDisk expects big Q2 revenue decline
News & Analysis  
4/20/2012   5 comments
Flash memory maker SanDisk reported quarterly sales and profit that fell short of analysts' expectations and said it expects sales to fall significantly further in the current quarter.
AMD financials down, future looks flat
News & Analysis  
4/20/2012   4 comments
AMD reported that first quarter sales declined on both a sequential and annual basis and said it expects its second quarter revenue to be flat to slightly higher.
Altera's sales slump on inventory glut, comms weakness
News & Analysis  
4/20/2012   3 comments
Programmable logic vendor Altera said first quarter sales came up well short of analysts' expectations and the company's own revised guidance amid continued inventory reductions, weakness in the communications end market and tight foundry capacity at the leading edge.
Freescale's Q1 points to upswing, says CEO
News & Analysis  
4/20/2012   1 comment
Freescale Semiconductor reported first quarter sales that were down on both a sequential and annual basis, but said it expects growth in the second quarter.
Analog Devices ADP2370 and ADP2371 synchronous step down regulators
Product News  
4/20/2012   Post a comment
Analog Devices’ low quiescent current synchronous step down regulators offer a wide input range and 100 percent duty cycle operation to increase battery life for portable consumer, industrial, and medical electronics.
Fujitsu Semiconductor Europe launched Easy DesignSim
Product News  
4/20/2012   1 comment
Marketed under the brand name Easy DesignSim, Fujitus's new online design simulation tool helps engineers save time and money when developing power management ICs.
Touchstone Semiconductor TS3001 timer IC
Product News  
4/19/2012   Post a comment
Touchstone Semiconductor released its latest timer IC that can be set with just one resistor compared with its predecessor, which needed both a resistor and capacitor.
austriamicrosystems TSL4531 ambient light sensor family
Product News  
4/19/2012   Post a comment
austriamicrosystems' ambient light sensor family enables sophisticated daylight harvesting for intelligent lighting systems and luminaires.
Texas Instruments UCC27511 and UCC27517 gate drivers
Product News  
4/19/2012   Post a comment
TI's latest gate drivers replace discrete gate driver circuits that use bipolar junction transistors, improving efficiency, reliability and power-density in many applications.
Analog Devices ADP1046 digital power controller
Product News  
4/19/2012   Post a comment
Analog Devices' latest device is a flexible controller with seven PWM logic outputs that can be easily programmed using an easy-to-use graphic user interface with I2C interface.
Freescale CEO Beyer to retire
News & Analysis  
4/19/2012   7 comments
Freescale Semiconductor Chairman and CEO Rich Beyer plans to step down after the conclusion of a search for a new CEO, Freescale said.
International Rectifier AUIRGDC0250 IGBT
Product News  
4/19/2012   Post a comment
International Rectifier has released an automotive-qualified IGBT optimized for soft switching applications such as PTC heater applications used in electric and hybrid vehicles.
Texas Instruments DRV8834, DRV8835 and DRV8836 motor drivers
Product News  
4/19/2012   Post a comment
TI's latest stepper, brushed DC motor drivers reduce power consumption up to 80 percent and board space up to 95 percent.
Intel smartphone launched in India
News & Analysis  
4/19/2012   18 comments
The first smartphone with Intel’s Atom inside has launched in India
ASML: Push is on for 20-nm chip production in 2013
News & Analysis  
4/19/2012   1 comment
Competition within the ARM ecosystem aimed at mobile devices is driving a faster pace of process development and will likely prompt foundry production on the 22-nm/20-nm process node in 2013, according to Eric Meurice, CEO of lithography vendor ASML.
Intel grabs 15% of cellular baseband market
News & Analysis  
4/19/2012   7 comments
Qualcomm and Intel were the two market leaders in the 2011 cellular baseband market according to market researcher Strategy Analytics.
Axiomtek’s new network appliance platform supports up to 8 Gigabit LANs
Product News  
4/19/2012   Post a comment
The NA-560 network appliance platform from Axiomtek supports 2nd and 3rd generation Intel Core processors in LGA1155 socket with Intel H61/B65/Q67 Express chipset.
Microchip buys wireless module maker
News & Analysis  
4/19/2012   2 comments
Microcontroller vendor Microchip Technology Inc. has acquired Roving Networks Inc., a supplier of WiFi and Bluetooth wireless modules, for an undisclosed sum of money.
<<   <   Page 3 / 8   >   >>


Flash Poll
Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

Want to Present a Paper at ESC Boston 2015?
Max Maxfield
8 comments
I tell you, I need more hours in each day. If I was having any more fun, there would have to be two of me to handle it all. For example, I just heard that I'm going to be both a speaker ...

Martin Rowe

No 2014 Punkin Chunkin, What Will You Do?
Martin Rowe
Post a comment
American Thanksgiving is next week, and while some people watch (American) football all day, the real competition on TV has become Punkin Chunkin. But there will be no Punkin Chunkin on TV ...

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
12 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Martin Rowe

Book Review: Controlling Radiated Emissions by Design
Martin Rowe
1 Comment
Controlling Radiated Emissions by Design, Third Edition, by Michel Mardiguian. Contributions by Donald L. Sweeney and Roger Swanberg. List price: $89.99 (e-book), $119 (hardcover).