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Content posted in April 2013
Page 1 / 3   >   >>
STMicro adds new MCU to STM32F4 Series
Product News  
4/30/2013   1 comment
The STM32F401 is the entry-level MCU in STMicro’s high-performance STM32F4 series featuring the ARM Cortex-M4 32-bit/DSP core.
PhD student monitors patients with Parkinson's Disease
Product News  
4/30/2013   1 comment
I just heard about a really interesting project being undertaken by Georgia Tech PhD student Teresa Sanders.
Atmel introduces ultra-low-power single-chip touch controller for screens up to 15.6”
Product News  
4/30/2013   1 comment
Next-generation maXTouch T series brings high-performance adaptive architecture and intuitive user interface solutions including maXStylus and maXFusion.
LED company shaves 2 years off R&D
News & Analysis  
4/30/2013   2 comments
Intermolecular, Inc. snags its first LED company with its High Productivity Combinatorial (HPC) technology that accelerates R&D.
Microchip expands LIN 2.1/ SAE J2602-2 portfolio
Product News  
4/30/2013   2 comments
Flexible LIN portfolio complies with global automotive standards; combines eXtreme low power consumption, high robustness, reliability, and integration.
China became biggest PC market in 2012
News & Analysis  
4/30/2013   5 comments
Unique market conditions and massive population propelled China's PC shipments past the U.S. for the first time, according to IHS.
AMD to support shared-memory spec this year
News & Analysis  
4/30/2013   1 comment
The AMD-led HSA Foundation has described its uniform memory access technology expected to be released and supported in an AMD chip later this year.
DESIGN West Slideshow: From mustaches to Lisa the robot
News & Analysis  
4/29/2013   16 comments
Conference featured diverse gathering of products, people and demos, including wireless Java, racing cars and more than a few robots.
TSMC races up MEMS foundry ranking
News & Analysis  
4/27/2013   1 comment
ST still leads the MEMS foundry business but TSMC nearly doubled its MEMS sales in 2012, moving the world's largest logic foundry into third place as a MEMS foundry, according to Yole's annual sector ranking.
DESIGN West: Robots study for butler role
News & Analysis  
4/26/2013   1 comment
The robotic butler or surgeon is still years away, but the bots are learning faster according to an artificial intelligence researcher.
Teardown: Samsung Galaxy S4
Teardown  
4/26/2013   17 comments
TechInsights examines the innards of Samsung's latest and greatest smartphone.
Smart switch tracks mobile and cloud access
News & Analysis  
4/26/2013   Post a comment
Vitesse's Service Aware Architecture (ViSAA) for its Carrier Ethernet Switch chips provides hardware-based tracking of mobile access and cloud services usage for billing purposes.
Spreadtrum sacks CTO
News & Analysis  
4/26/2013   3 comments
The sudden firing of Qiuzhen Zou, Spreadtrum's chief technology officer, hints at internal turmoil within the Chinese fabless chip firm. What’s the story behind Spreadtrum’s sudden sack of its CTO?
DESIGN West keynoter envisions biomechatronic future
News & Analysis  
4/25/2013   3 comments
Hugh Herr, an MIT researcher and double amputee, provided attendees at DESIGN West with a vision of how synthesized biological and mechatronic systems can repair and improve the human body.
DESIGN West: Mentor Sourcery conjures virtual prototypes
News & Analysis  
4/25/2013   Post a comment
Mentor Graphics integrates support for Vista Virtual Prototypes with Veloce emulation in latest Sourcery CodeBench Virtual Edition.
Fairchild Semiconductor FAN3180 gate driver
Product News  
4/25/2013   Post a comment
Fairchild Semiconductor’s low-side gate driver incorporates a 3.3-V LDO regulator in 5-lead SOT 23 package.
Microchip brings PIC16F527 and PIC16F570 integrated op amps to 8-bit PIC MCUs
Product News  
4/25/2013   Post a comment
New MCUs feature on-chip op amps, high-speed comparators, and ADC for general-purpose, signal conditioning and sensing applications.
NKK adds brushed chrome to YB2 Series IP65-rated pushbuttons
Product News  
4/25/2013   Post a comment
NKK Switches has updated its YB2 Series of tamperproof pushbuttons with a brushed chrome cap and bezel option for non-illuminated models.
Stackpole expands current sense chip resistor line
Product News  
4/25/2013   Post a comment
Stackpole has added 0402 and 0603 sizes to its CSRF Series of foil on ceramic carrier current sense chip resistors.
TI's chip for lead-acid battery monitoring
Product News  
4/25/2013   Post a comment
Texas Instruments introduces lead-acid battery management gas gauge integrated circuit with TI's proprietary Impedance Track capacity measurement technology.
SiC MOSFET technology improves PV inverters
Product News  
4/25/2013   1 comment
Delta Energy Systems' solar inverters use SiC power MOSFETs from Cree to enable new milestones in power density.
Memsic sale set at $88 million
News & Analysis  
4/24/2013   Post a comment
MEMS maker Memsic with origins that go back to Analog Devices has agreed to be bought out for $88.5 million.
DESIGN West: Open source hardware searching for business model
News & Analysis  
4/24/2013   9 comments
The motivations are diverse and the projects are exciting, but the long-term impact remains questionable.
Design West panel scopes out future of IoT
News & Analysis  
4/24/2013   6 comments
The Internet of things will reshape business models for embedded systems companies and raise the level of security concerns according to a new report.
IBM and Airlight boost solar energy 10X
News & Analysis  
4/24/2013   11 comments
IBM and Airlight Energy announced $2.4 million grant to build a full-sized prototype of a solar power station that produces 25 kiloWatts.
Econais rolls out Wi-Fi audio-streaming ref design
Product News  
4/24/2013   Post a comment
Based on the company’s WiSmart EC32S13 WiFi module, Econais now offers the WisAudio reference design for streaming raw uncompressed (WAV) and compressed (MP3, FLAC, AAC) audio over WiFi.
Converged Bluetooth digital radio module
Product News  
4/24/2013   Post a comment
Frontier Silicon's Tuscany module allows audio devices to operate with any combination of high-performance Bluetooth, dual Band DAB/DAB+, FM with RDS and Apple Lightning/Android docking.
Single-chip digital radio receivers support HD Radio and DAB/DAB+
Product News  
4/24/2013   Post a comment
Silicon Labs has released what it claims to be the industry's first single-die antenna-input-to-audio-output digital radio receiver solution developed for the global portable and consumer electronics markets.
Eight-channel PWM HD audio processor with dual asynchronous sample rate converters
Product News  
4/24/2013   Post a comment
Texas Instruments has introduced the industry’s first 8-channel pulse-width modulator (PWM) audio processor with dual asynchronous sample rate converters (ASRCs) integrated on a single chip.
Industrial strength PCIe/104 form factor A/V codec
Product News  
4/24/2013   Post a comment
Sensoray has introduced the ultra-low latency, high performance Model 953-ET: PCIe/104 Form Factor A/V Codec, a board that can simultaneously capture four channels of analog video and four channels of stereo/mono audio.
Acoustic adhesive vent protects openings in portable electronics
Product News  
4/24/2013   Post a comment
The GAW113 acoustic vent from W. L. Gore & Associates' Portable Electronic Vents group is designed to provide dust and splash protection for acoustic openings in portable electronic devices such as scanners, two-way radios, tablet and laptop PCs.
Ohm’s Law iPhone app helps back-solve electrical power calculations
Product News  
4/24/2013   Post a comment
Cressall Resistors is usually associated with heavy engineering but the company also has software engineering expertise in-house, the first fruit of which is an iPhone app for solving Ohm's Law.
Wolfson to become primary Samsung audio partner for the Galaxy range
News & Analysis  
4/24/2013   Post a comment
Wolfson Microelectronics and Samsung Electronics have agreed a multi-year IP License and a Component Supply Agreement which establishes Wolfson as a primary Samsung audio partner, which will turn Wolfson as a major audio component supplier for the company's Galaxy range of smartphones and tablets, including the Galaxy S4, in 2013.
MOST Forum sheds light on the future of automotive optical data communications
News & Analysis  
4/24/2013   Post a comment
After twelve years of serial production, the MOST bus technology for automotive infotainment environments is more vital than ever. At the MOST Forum which will take place on April 23, in Esslingen (Germany), industrial and academic stakeholder will discuss future developments.
TI's profit up despite declining sales
News & Analysis  
4/23/2013   Post a comment
First quarter performance in line with analysts' expectations even as customers continue to operate with very low levels of inventory.
Slideshow: DESIGN West gets virtual Mars rover tour
News & Analysis  
4/23/2013   4 comments
A NASA engineer provided a design review of the guts of the Mars Rover and the systems that safely set it down on the red planet.
Energy harvesting pioneer named top ACE innovator
News & Analysis  
4/23/2013   1 comment
Yogesh Ramadass was named Innovator of the Year in the ACE Awards for his pioneering work in energy harvesting circuits at MIT and Texas Instruments.
Add radio on-a-chip to any design
News & Analysis  
4/23/2013   7 comments
Designers can add FM radio to any of their consumer gadgets with a $5 software-defined radio-on-a-chip, an antenna-to-audio solution from mixed signal semiconductor maker, Silicon Labs (Austin, Texas).
ARM continues to outperform market
News & Analysis  
4/23/2013   Post a comment
Leading processor IP licensor continues to rack up better-than-market sales growth and profits and continues to sign more licenses for advanced processors.
DESIGN West: Agile-for-embedded improves code quality
News & Analysis  
4/23/2013   1 comment
Agile software development methods produce higher quality code more quickly than traditional techniques, but needs to be specifically adapted to embedded system design.
DESIGN West: 'Boring' MCUs need shake up says entrepreneur
News & Analysis  
4/23/2013   1 comment
In an interview at Design West, the new CMO of Energy Micro shares his ideas for injecting innovation into microcontroller market.
ST's losses continue, outlook brightens
News & Analysis  
4/23/2013   Post a comment
ST has posted yet another quarterly loss driven by its involvement with the ST-Ericsson mobile chip joint venture.
DESIGN West: Nordic to demo low-power RF chip
News & Analysis  
4/22/2013   Post a comment
Low-power RF specialist highlights chip and module designs using ANT+, Bluetooth and proprietary 2.4-GHz wireless communications and "appcessories" from third parties.
SP/Silicon Power unveils two new SSDs
Product News  
4/22/2013   Post a comment
The SATA III 6 Gb/s devices feature read/write speeds of up to 550 MB/s and 440 MB/s.
Slideshow: Is Europe Stealth Semiconductor Research Leader?
News & Analysis  
4/22/2013   3 comments
From energy harvesting to efficient lighting, Europe continues to live up to its tradition of excellence in academic and collaborative research.
Microchip expands embedded wireless portfolio with new Bluetooth, Wi-Fi, and ZigBee offerings
Product News  
4/22/2013   Post a comment
Expansion includes PIC32 Bluetooth Digital Audio Kit, feature-rich Wi-Fi modules, IEEE 802.15.4 and proprietary radio, and XBee-compatible Bluetooth and Wi-Fi modules.
Applied Materials back on top in chip equipment
News & Analysis  
4/22/2013   Post a comment
Displaced by ASML in 2011 after nearly 20 years as No. 1, chip gear giant regained leadership last year on strength in deposition.
Altera announces new Cyclone V SoC development kit
Product News  
4/22/2013   3 comments
Available for ordering now, new kit Includes Altera SoC EDS featuring ARM DS-5 Altera Edition toolkit.
IBM invests $1 billion in flash development
News & Analysis  
4/19/2013   2 comments
Big Blue to demonstrate the technology with competency centers and a line of all-flash storage appliances.
3-D interposers stack chips
News & Analysis  
4/19/2013   2 comments
A silicon interposer technology jointly developed by Silex and BroadPak may bring 3-D chip integration to mass market.
Page 1 / 3   >   >>


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