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Content posted in May 2001
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Jemcore added to roster of Java cores for mobile devices
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5/1/2001   Post a comment
Ajile Systems Inc. now offers a soft version of its low-power Java processor core, a move that adds another competitor to the growing roster of Java coprocessor providers eyeing PDAs and next-generation mobile phones.
Mitsubishi packs TV video processor, MCU on single chip for American market
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SUNNYVALE, Calif.--Mitsubishi Electric Corp.'s U.S. subsidiary here today claimed that the company has developed the first IC to integrate a color TV image signal processor and 8-bit microcontroller for North American television sets.
Startup unveils Bluetooth multichip modules
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5/1/2001   Post a comment
Careful to state it won't pile more empty promises onto Bluetooth, the prodigal portable networking technology, fabless startup Transilica Inc. has announced what it calls the world's smallest and most cost efficient Bluetooth chip set.
RTOS supports Hitachi processors
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Mid- to low-end VoIP cores
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Internet DSP
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Emulators for ARC cores
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CAN "calculator"
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Infineon acquisition yields framer-mapper chip
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Infineon Technologies AG announced Monday (April 30) that is has agreed to buy Catamaran Communications Inc., which will give Infineon access to framer and mapper technology for speeds as high as 10 Gbits/second.
Task force asks FCC to open 94-GHz band for commercial use
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Looking to put wireless broadband access on a par with Ethernet data connectivity, a task force of the Wireless Communications Association International is working to have the 94-GHz band of spectrum allocated for commercial use. The group has proposed the allocation to the Federal Communications Commission and hopes the rules will be made public this summer.
Bluetooth chip and kit
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Alpha Industries to use Kopin HBT wafers for wireless, broadband products
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TAUNTON, Mass.-- Kopin Corp. here today announced a multi-year agreement to supply Alpha Industries Inc. with wafers for indium gallium phosphide (InGaP) heterojunction bipolar transistors (HBTs).
PMC-Sierra, Broadcom expand 10-Gigabit wares
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PMC-Sierra Inc. released chips this week aimed at the multiple facets of 10-Gbit/second transport, including packet-over-Sonet, Ethernet and asynchronous transfer mode, while Broadcom Corp. added to its 10-Gbit/s portfolio with chips targeting the extended attachment unit interface (XAUI).
Purchasing execs expect only 1% growth this year
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ociation of Purchasing Management, Inc's semiannual Economic Forecast shows that purchasing executives in the manufacturing sector expect their 2001 revenues to grow only 1% in 2001.
AMD delays Hammer processors
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Advanced Micro Devices Inc. will delay the release of its Hammer processor family by two to six months, which could push their release to the second half of 2002 under a worst-case scenario.
TRW spin-off to produce indium phosphide devices for wireless
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A spin-off launched Tuesday (May 1) by TRW Inc. will develop ultrafast indium phosphide and gallium arsenide components for fiber optics and wireless telecommunications networks.
IBM exec: automation alone won't cure procurement woes
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ORLANDO, Fl.--A top IBM executive said Monday that too many companies rely on automating procurement practices without changing their inefficient business processes.
Power-efficient DSP
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EMS providers see $10 billion windfall from cell phones
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Cell phone makers will ring up more than $10 billion worth of additional business for EMS providers within the next six months as a pipeline of new opportunity begins to take shape.
FSI to supply rinse/drying technology to Korean wet bench supplier
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MINNEAPOLIS--FSI International Inc. today announced an agreement to supply wafer-drying technology and integrated modules to Digital Neo-tech System Korea Co. Ltd. (KDNS), which will use the systems in automated wet bench equipment.
Diodes Inc. reports decline in revenues and profits
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Diodes Inc. today reported revenues for the first quarter of ended March 31 were $25.7 million, a decrease of 6.2% as compared to $27.4 million for the comparable quarter in 2000.
Micron Electronics strikes deal with buyout firm to take PC business
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NAMPA, Idaho--Following through with its plans to exit the PC business, Micron Electronics Inc. here today announced an agreement to sell its personal computer operations to Gores Technology Group, a buyout firm based in Los Angeles.
National to use Artisan design libraries for TSMC processes
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SANTA CLARA, Calif.-- In a move to ease its ability to use outside foundry services and speed IC development, National Semiconductor Corp. here has entered into a multi-technology, multi-process licensing agreement for design libraries from nearby Artisan Components Inc.
Bluetooth software development kit
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Extended Systems' v1.2.3 of XTNDConnect Blue SDK for Windows has been placed on the Bluetooth Qualified Product List (BQPL).
Scan insertion
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SLE has introduced a scan insertion tool - ScanBlaster is designed to take physical effects into account very early, and to be compatible with many standard test insertion methodologies.
Micron completes purchase of DRAM joint venture in Japan
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BOISE, Idaho--Micron Technology Inc. today announced it has completed the purchase of all shares in KMT Semiconductor Ltd. from Kobe Steel Ltd. in Japan, and the former joint-venture DRAM operation is now a wholly-owned subsidiary of Micron.
Virtual Silicon, Hynix to develop nonvolatile memory for SoC logic processes
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SUNNYVALE, Calif.--South Korea's Hynix Semiconductor Inc.--formerly called Hyundai Electronics Industries--today announced a joint-development partnership with Virtual Silicon Technology Inc. here to create advanced nonvolatile memory for embedded use in system-on-chip designs.
Micron adds 16-Mbit page-mode flash for new wireless handset designs
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BOISE, Idaho--In a move to expand its product offering for wireless systems, Micron Technology Inc. here introduced a new 16-megabit flash memory architecture that offers read-while-write capabilities in a page-mode format. A comparable 16-Mbit burst-mode flash chip was introduced last year.
Fab contracting boosts Hungary's restructured industry
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LONDON -- Hungary, reduced to a dependent satellite state within the European communist bloc during the second half of the 20th century, is now showing fellow central European nations how to prosper by manufacturing electronics.
Sony HDTV feels the force
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Pioneer to ship DVD/CD recorder
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Pace and NDS in IP link-up
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Bookham to build single-chip nodes
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M-LVDS: A New Standard for High-Speed Multipoint Data Buses
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A new standard, M-LVDS, is emerging to solve multiple-driver, multiple-receiver, half-duplex design problems. Texas Instruments' Jim Dietz discusses the unique considerations associated with multipoint topologies, describes M-LVDS, and compares the evolving standard with existing multipoint and single-ended solutions.
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