Startup unveils Bluetooth multichip modules News & Analysis 5/1/2001 Post a comment Careful to state it won't pile more empty promises onto Bluetooth, the prodigal portable networking technology, fabless startup Transilica Inc. has announced what it calls the world's smallest and most cost efficient Bluetooth chip set.
Task force asks FCC to open 94-GHz band for commercial use News & Analysis 5/1/2001 Post a comment Looking to put wireless broadband access on a par with Ethernet data connectivity, a task force of the Wireless Communications Association International is working to have the 94-GHz band of spectrum allocated for commercial use. The group has proposed the allocation to the Federal Communications Commission and hopes the rules will be made public this summer.
PMC-Sierra, Broadcom expand 10-Gigabit wares News & Analysis 5/1/2001 Post a comment PMC-Sierra Inc. released chips this week aimed at the multiple facets of 10-Gbit/second transport, including packet-over-Sonet, Ethernet and asynchronous transfer mode, while Broadcom Corp. added to its 10-Gbit/s portfolio with chips targeting the extended attachment unit interface (XAUI).
AMD delays Hammer processors News & Analysis 5/1/2001 Post a comment Advanced Micro Devices Inc. will delay the release of its Hammer processor family by two to six months, which could push their release to the second half of 2002 under a worst-case scenario.
National to use Artisan design libraries for TSMC processes News & Analysis 5/1/2001 Post a comment SANTA CLARA, Calif.-- In a move to ease its ability to use outside foundry services and speed IC development, National Semiconductor Corp. here has entered into a multi-technology, multi-process licensing agreement for design libraries from nearby Artisan Components Inc.
Scan insertion News & Analysis 5/1/2001 Post a comment SLE has introduced a scan insertion tool - ScanBlaster is designed to take physical effects into account very early, and to be compatible with many standard test insertion methodologies.
M-LVDS: A New Standard for High-Speed Multipoint Data Buses News & Analysis 5/1/2001 Post a comment A new standard, M-LVDS, is emerging to solve multiple-driver, multiple-receiver, half-duplex design problems. Texas Instruments' Jim Dietz discusses the unique considerations associated with multipoint topologies, describes M-LVDS, and compares the evolving standard with existing multipoint and single-ended solutions.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.