Watermarks need privacy controls, group says News & Analysis 5/29/2008 Post a comment Digital watermarks can compromise consumer privacy if not designed and deployed correctly, according to a new white paper from The Center for Democracy & Technology that lays out best practices for creating and using watermarks.
Vincotech showcases multipurpose power modules Product News 5/29/2008 Post a comment At the PCIM trade fair in Nuremberg, Vincotech introduced new products. The company which emerged from the former Tyco Electronics Power Systems through a buyout from investment company Gores Group introduced several power modules for solar, motor control and UPS applications.
High-temp superconductors pave way for 'supermagnets' News & Analysis 5/29/2008 Post a comment New iron-based superconductors show a strong affinity for magnetism, unlike low-temperature materials, whose superconducting is quelled by magnetism, promising a new era for super electric motors, electrical transmission lines and magnetic-resonance imaging (MRI).
e2v wins ESA's ADC contract News & Analysis 5/29/2008 Post a comment The European Space Agency (ESA) has commissioned e2v, a specialist in designing and manufacturing electronic components for the space industry, to develop an analog to digital converter (ADC) for next-generation broadband satellite payloads.
CIT Relay : Automotive relay has weatherproof shroud News & Analysis 5/29/2008 Post a comment With a switching capacity to 40 A, the automotive A2S series shrouded relays offer contact arrangement options of SPST N.O., SPST N.C. Coil voltage options are 6, 12 and 24 Vdc with coil power choices of 1.6 and 1.9 W to maximize battery life.
Power MOSFETS offered in PowerPAK SC-70 package Product News 5/29/2008 Post a comment Vishay Intertechnology has released 15 power MOSFETS in a PowerPAK SC-70 package. This offering is said to include the industry's first 12-V devices in this package type, together with the industry's lowest on-resistance for voltage rating and package size.
Fab utilization hovers at 90% News & Analysis 5/28/2008 Post a comment Worldwide fab-capacity utilization hit 89.7 percent in the first quarter of 2008, with leading-edge processes hovering around the 96.7 percent range, according to the Semiconductor International Capacity Statistics (SICAS) organization.
Computer models how nanoparticles harm cells News & Analysis 5/28/2008 Post a comment Named for Buckminster Fuller, buckyballs--tiny nanoparticles composed of just 60 carbon atoms (carbon-60)--can enter cells and accumulate to cause damage, according to research scientists at two universities.
Fab spending to fall by 17% in '08 News & Analysis 5/28/2008 Post a comment Worldwide equipment spending on fabs is expected to show a decline of about 17 percent in 2008, ''as more companies are forced to postpone fab projects due to global economic uncertainties,'' according to the World Fab Forecast from SEMI.
Next up for LSI: Ethernet? News & Analysis 5/28/2008 Post a comment For a company now focused exclusively on storage and networking markets, LSI Corp. has a glaring lack of standard Ethernet products, and chief executive Abhi Talwalkar is exploring the options for the venerable Silicon Valley icon.
DAC targets 45-nm design News & Analysis 5/28/2008 Post a comment A special Management Day session during the upcoming Design Automation Conference will again tackle the toughest chip design issues using 45-nm process technology.
Memory prices fall despite fab outage News & Analysis 5/28/2008 Post a comment Despite the power outage at Hynix Semiconductor Inc.'s fab last week, prices are expected to be down for DRAM and NAND flash memory, according to Avi Cohen, head of research at Avian Securities LLC.
ST's Crolles2 fab to get $500 million for volume ramp News & Analysis 5/28/2008 Post a comment STMicroelectronics NV has earmarked $500 million in capital expenditure to take its Crolles2 wafer fab manufacturing capacity up to between 4,500 and 5,000 wafers per week. "We want to fulfill the capacity of the building," said Carlo Bozotti, president and CEO of ST.
Soitec names COO News & Analysis 5/28/2008 Post a comment French SOI wafer supplier Soitec SA announced it has appointed Paul Boudre as chief operating officer (COO). This comes three months after the company dismissed Pascal Mauberger citing short-term "fluctuations in demand from its main customers," as the reason.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.