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News Analysis
Content posted in May 2011
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RF switch targets high-precision broadband
Product News  
5/23/2011   1 comment
Peregrine PE42551 50-Ohm RF switch minimizes phase and IL drift after switching event
Plastic optics boosted to 25 Gbit/s
News & Analysis  
5/23/2011   1 comment
Scientists at the Georgia Institute of Technology reporting successful operation of s new vertical-cavity surface-emitting laser technology from VI Systems at 25 Gbits per second.
Intel invests $24.5 million in four startups
News & Analysis  
5/23/2011   6 comments
Intel Capital, the venture capital arm of the world's biggest chip maker, said it invested about $24.5 million in four firms.
Microchip and Digilent launch first Arduino-compatible 32-bit microcontroller development platform
Product News  
5/23/2011   3 comments
Platform includes development boards, open-source software; 32-bit performance and low cost enable hobbyists and academics of all disciplines to integrate electronics into projects.
Embedded Workbench supports TI's new ultra-low-power MSP430 FRAM MCUs
Product News  
5/23/2011   Post a comment
The software development toolsuite IAR Embedded Workbench from IAR Systems now offers complete support for the ultra-low-power MSP430FR57xx FRAM (Ferroelectric Random Access Memory) microcontroller (MCU) series from Texas Instruments (TI).
Student group blames Foxconn for blast
News & Analysis  
5/23/2011   9 comments
A workers' rights group based in Hong Kong has claimed that it had exposed problems at the Foxconn facility at Chengdu prior to the explosion of Friday March 20, which reportedly left three people dead and 15 injured.
U.S. regulators green light TI-National deal
News & Analysis  
5/23/2011   1 comment
U.S. regulators declined to request additional information to investigate the proposed acquisition by Texas Instruments of National Semiconductor.
NI to buy EDA vendor and RF design firm
News & Analysis  
5/23/2011   6 comments
National Instruments Inc. has signed a definitive agreement to acquire AWR Corp. a supplier of EDA software for designing high-frequency components and systems. The purchase price of $58 million includes $7 million in cash on the AWR balance sheet, NI said.
SpringSoft’s Protolink Probe Visualizer speeds verification of FPGA-based prototype boards
Product News  
5/23/2011   1 comment
Protolink Probe Visualizer enables real-time design visibility and RTL debug of off-the-shelf and custom boards for fast prototype verification and early SoC system validation.
Marvell to invest $200 million in Israel R&D
News & Analysis  
5/23/2011   1 comment
Communications chip company Marvell Technology Group Ltd., is reportedly planning to invest $200 million in its Israel R&D operation. The company's co-founders – Sehat Sutardja, CEO, chairman, and Weili Dai, chief operating officer – who are also husband and wife, are reportedly visiting Israel.
Three dead in Foxconn iPad factory blast
News & Analysis  
5/23/2011   22 comments
Three workers have died and 15 more are injured as a result of an explosion at a factory in Chengdu, China belonging to leading Taiwanese electronics manufacturer Foxconn.
Redpine rolls flexible Wi-Fi chip set
News & Analysis  
5/23/2011   1 comment
The Maxi-Fi Beam450 from Redpine Signals can be configured to deliver a single 450 Mbits/s link or simultaneous 150 and 300 Mbits/s links over 2.4 and 5 GHz bands.
Tiny quad-channel 14/16-bit, 100 MSPS ADC targets medical MRI, available without magnetic "personality"
Product News  
5/23/2011   Post a comment
TI ADS5263 delivers low power, small footprint with high SNR; optional non-magnetic package
PLX chip carries 10GBase-T 300 meters
News & Analysis  
5/23/2011   5 comments
PLX Technology demoed a 10 Gbit/second Ethernet link carrying both data and electrical power a distance of 300 meters over Category 6A copper cables.
On-Chip ECC: Addressing SRAM SER in a COTS World
Product News  
5/22/2011   Post a comment
GSI Technology has developed a family of 72Mb SRAMs with on-chip ECC, referred to collectively as “ECCRAMs.”
Open source protocol targets 'Internet of things'
Product News  
5/22/2011   Post a comment
NXP Semiconductors has announced it will make the IEEE 802.15.4 based wireless connectivity network layer software it inherited from the acquisition of Jennic, JenNET-IP, open source, in a bid to generate greater interest in the 'Internet of Things' concept.
NXP's GreenChip smart lighting solution opens new dimension in energy efficient lighting
Product News  
5/22/2011   1 comment
NXP Semiconductors has introduced its GreenChip smart lighting solution that makes the Internet-enabled, energy-efficient lighting network a reality – not only for businesses, but also for consumers trying to make the most of energy savings in the home.
Wireless-based, solar-powered sensor module offers continuous monitoring of carbon monoxide levels
Product News  
5/22/2011   Post a comment
Unitronic is planning to present a wireless-based, solar-powered sensor module for continuous monitoring of the carbon monoxide concentration in various buildings and in industrial applications at SENSOR+TEST 2011 in Nuremberg (Germany) from 7 to 9 June 2011.
EEPROM features AES-CCM Authentication
Product News  
5/22/2011   Post a comment
An extension to Atmel’s CryptoAuthentication family, the ATAES132 devices, offer secure data storage using the AES authentication for industrial, consumer, computing and embedded applications with flexible key management features and secure counters.
NXP demos car-to-x communications platform
News & Analysis  
5/22/2011   Post a comment
As part of the Automotive Week 2011 which took place this week in Eindhoven (The Netherlands), chipmaker NXP demoed a car-to-x communications platform based on the company's software-defined multi-standard digital radio platform.
Rambus to acquire Cryptography Research for USD 342.5 million
News & Analysis  
5/22/2011   Post a comment
This acquisition will expand the breadth of Rambus' technologies available for licensing with complementary technologies from CRI that include innovations and solutions for content protection, network security, anti-counterfeiting and financial services.
Up from the patent mine, Rambus sees the light
News & Analysis  
5/20/2011   7 comments
Rambus came to Lightfair in Philadelphia this week to pitch the company’s patented lighting solutions, branded as Pentelic.
Carbon Design Systems adds ARM Cortex-A15 models
Product News  
5/20/2011   1 comment
Carbon is the first model provider to offer support for the ARM Cortex-A15 core, thereby enabling architectural exploration and application software development for next-generation devices.
Algae powers hydrogen economy
News & Analysis  
5/20/2011   16 comments
Algae can produce hydrogen fuel from water and sunlight, with a little boost from man-made nanoparticle catalysts, according to engineers at the U.S.Department of Energy's Argonne National Laboratory.
AGC develops 0.1-mm thin glass for displays
News & Analysis  
5/20/2011   3 comments
AGC has developed 0.1 mm-thin sheet glass manufactured using a float process for use in next-generation displays, lighting, and touch panel screens. AGC claims it to be the world’s thinnest.
Chips see 25% surge in solar, wind
News & Analysis  
5/20/2011   9 comments
The market for chips used renewable energy systems will grow 26.5 percent in 2011, after expanding 25.4 percent in 2010 to reach revenues of $1.4 billion.
Verific unveils Perl interface for its SystemVerilog and VHDL front-end solutions
Product News  
5/20/2011   2 comments
Verific will demonstrate the SystemVerilog and VHDL Perl APIs, along with the rest of its product line in Booth #2733 at DAC 2011.
ST’s new ARM-based DTV platform leverages ST-Ericsson
News & Analysis  
5/20/2011   11 comments
Philippe Lambinet, ST’s senior executive vice president, sees ST-Ericsson’s pioneering work critical, as his team switches its core from ST40 to ARM in its upcoming DTV SoC platform.
Renesas targets October for full recovery
News & Analysis  
5/20/2011   1 comment
Renesas Electronics—which lost an estimated 40 percent of its chip production capacity in the immediate aftermath of the March 11 earthquake in northeastern Japan—said this week that its IC shipments won't return to pre-earthquake levels until October.
ST keeps faith in wireless ‘big-chip-in-the-middle’
News & Analysis  
5/20/2011   8 comments
STMicroelectronics’ turnaround remains only half done, as long as ST-Ericsson is yet to reach the break-even point. ST’s CEO Carlo Bezotti, however, evinced strong support for its wireless business.
Fab tool book-to-bill ratio grew in April
News & Analysis  
5/20/2011   1 comment
The three-month rolling average for April semiconductor equipment orders from vendors based in North America rose to nearly $1.6 billion and the book-to-bill ratio for North American suppliers improved to 0.98 from 0.95 in March, according to the fab tool trade group SEMI.
Stantum enhances multi-touch panel IC design
News & Analysis  
5/19/2011   3 comments
Stantum has debut its dual-chip high-resolution architecture for its patented Interpolated Voltage Sensing Matrix (IVSM) touch-and-write technology for use in multi-touch panels.
SMSC buys audio networking SoC firm
News & Analysis  
5/19/2011   1 comment
SMSC acquired networked audio technology provider BridgeCo in a cash deal worth up to $67.5 million.
SMIC stays in profit as sales, utilization slip
News & Analysis  
5/19/2011   Post a comment
First quarter revenue slipped at Chinese foundry Semiconductor Manufacturing International Corp. coming in below the guidance range given by the company on Feb. 17. The company remained in profit but manufacturing capacity utilization collapsed to 72.2 percent from 96.8 percent in 4Q10.
Zytronic bets on ITO to tap industrial apps
News & Analysis  
5/19/2011   Post a comment
Zytronic has launched a range of sensors that use deposited tracks of transparent indium tin oxide suitable for small, ruggedized touch devices. The new sensors complement Zytronic sensors that use copper strand electrodes.
Mosaid seeks U.S. ban on Cisco products
News & Analysis  
5/19/2011   8 comments
Canadian company Mosaid Technologies Inc. has filed a complaint against Cisco Systems Inc. with the United States International Trade Commission (ITC) in Washington, D.C. alleging patent infringement. If Mosaid is successful in its complaint Cisco may be prevented from selling and importing a wide range of equipment types in the United States.
Curtiss-Wright rolls 12-slot 3U OpenVPX forced air conduction-cooled chassis
Product News  
5/19/2011   Post a comment
Curtiss-Wright Controls Electronic Systems (CWCES) has launched the RME9CC, a 12-slot 3U OpenVPX forced air conduction-cooled chassis for the development of military embedded systems.
Nujira takes $16 million more in funding
News & Analysis  
5/19/2011   1 comment
Nujira Ltd., a pioneer of "envelope-tracking" technology as a power saver in cellular telephone power amplifiers, has announced it has secured £10 million (about $16.2 million) in a round of funding led by new investor, Climate Change Capital Private Equity.
CSR co-founders form M2M wireless startup
News & Analysis  
5/19/2011   3 comments
Several co-founders of Cambridge Silicon Radio, now CSR plc, have combined with others to form Neul Ltd. with the aim of creating a global wireless network business for machine-to-machine communications.
Nextreme harvester to power turbine WSN
News & Analysis  
5/19/2011   2 comments
Nextreme Thermal Solutions Inc., a maker of thermal management products, has teamed up with Arkansas Power Electronics International Inc. to develop a thermal energy harvesting system for a wireless sensor network. In particular the WSN is designed to monitor the health of bearings in turbine engines.
Intel grows lead in Q1 chip sales rankings
News & Analysis  
5/19/2011   3 comments
Intel lengthened its lead in chip sales over No. 2 player Samsung in the first quarter after several consecutive quarters of giving ground, according to a ranking of chip vendor sales compiled by IC Insights.
FCI beefs up terminal block portfolio
Product News  
5/19/2011   1 comment
FCI has added PCB fixed configurations, power pluggable and spring-contact products to its terminal blocks product portfolio.
AVX 9176 series wire-to-board IDC connector series
Product News  
5/19/2011   1 comment
AVX expanded its wire-to-board connector family to offer design engineers more options when connecting discrete wires to a PCB in harsh environment applications.
EDA vendor rolls hierarchical 3-D extractor
News & Analysis  
5/18/2011   Post a comment
Silicon Frontline Technology announced what it claims is the industry's first commercial hierarchical 3-D extractor for post-layout verification.
Spansion NOR flash targets automotive apps
Product News  
5/18/2011   Post a comment
Spansion Inc. announced it has entered production of its 1Gb and 512Mb GL NOR Flash memory that is optimized for performance, high reliability and high density support.
ITRI researchers get SID award for seminal work
News & Analysis  
5/18/2011   Post a comment
The Industrial Technology Research Institute has received the Society for Information Display’s Silver Display Component of the Year Award for its technology that enables the mass production and development of flexible and transparent displays
Analog Devices ADM2682E and ADM2687E are single-chip 5-kVrms signal- and power-isolated RS-485 data transceivers
Product News  
5/18/2011   2 comments
A pair of 5-kVrms signal- and power-isolated RS-485 data transceivers from ADI meets the safety isolation requirements of high voltage systems in motor, power and energy control systems.
EVE’s ZeBu line expanded with new vertical solutions
Product News  
5/18/2011   Post a comment
ZeBu line offers improved support for the computer/peripherals, embedded processors, networking, and video markets.
EVE’s ZeBu integrated with ARM’s VSTREAM Virtual Debug Interface
Product News  
5/18/2011   Post a comment
ZeBu fast emulators linked with ARM’s software debuggers to improve the debugging of embedded software.
Synopsys' profit doubles on IRS settlement
News & Analysis  
5/18/2011   2 comments
EDA and IP vendor said its profit for the quarter ended April 30 more than doubled year-over-year thanks in part to a one-time tax benefit from a settlement with the U.S. Internal Revenue Service.
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