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Content posted in May 2012
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Renesas, TSMC tout licensable MCU platform using 40-nm eFlash
News & Analysis  
5/28/2012   7 comments
Renesas and TSMC Monday outlined joint plans to develop an embedded flash-based MCU platform licensable to other chip suppliers around the world.
Renesas extends MCU work with TSMC to 40-nm
News & Analysis  
5/28/2012   1 comment
As expected Japan's Renesas and foundry TSMC have announced an increase in the collaboration between the companies on microcontrollers.
MEMS wafer maker Okmetic outsources amid SOI push
News & Analysis  
5/28/2012   1 comment
Okmetic Oyj a manufacturer of silicon wafers for sensor, semiconductor and solar applications, has begun outsourcing wafer manufacture even as it is expanding its factory at its Finland headquarters to make more silicon-on-insulator wafers.
Murata wants to build from MEMS to Internet of Things
News & Analysis  
5/27/2012   7 comments
Murata Manufacturing Co. Ltd. has been on the acquisition trail for several years and it is now fine tuning its approach as it seeks to move up in complexity and value through MEMS to the Internet of Things.
Parallax releases four exciting new products!
Product News  
5/27/2012   Post a comment
I just received jolly friendly email from Lauren Davis, who is the Marketing Manager at Parallax. Lauren was keen for me to share some news…
Intel confirms Ireland for 14-nm silicon
News & Analysis  
5/27/2012   24 comments
The Intel wafer fab complex in Leixlip Ireland is set to receive investment to allow it to manufacture 14-nm silicon and beyond, the company revealed in a presentation to analysts on May 10. The investment is expected to be more than $1 billion.
Energy Micro and Spectrum Design Solutions to offer energy-efficient wireless designs
News & Analysis  
5/27/2012   2 comments
The folks at Energy Micro develop energy-friendly MCUs and RF transceivers based on the ARM Cortex processor core.
TI announces new DSP software and development kit
Product News  
5/27/2012   Post a comment
Jump-start real-time signal processing for biometric analytics apps; Scalable dev platform features embedded analytics for apps that require fingerprint recognition and face detection.
Video: Indy 500 pit boss talks tires
News & Analysis  
5/27/2012   Post a comment
We get down and dirty in the pits at the Indy 500, where we learn how 0.5 increments of tire pressure can make or break a race, how many laps a driver can go on one set of wheels, and how far rival tire makers will go to steal another firm's secrets.
Stuff to see at DAC: Blue Pearl Software
News & Analysis  
5/26/2012   Post a comment
Blue Pearl Software Suite accelerates FPGA implementation by generating SDCs for Synopsys Synplify Pro and Xilinx Vivado.
New Xilinx Kintex-7 FPGA Embedded Kit
Product News  
5/26/2012   4 comments
Accelerate design productivity for broadcast, aerospace and defense, industrial, and medical applications using Xilinx’s Kintex-7 FPGA Embedded Kit.
Renesas cuts 14,000 jobs; fab sale to TSMC
News & Analysis  
5/26/2012   10 comments
Renesas Electronics Corp. plans to eliminate up to 14,000 jobs, while selling the company’s leading system-chip fab in Yamagata to TSMC, according to a report in Nikkei, Japan’s economic newspaper.
Magnetic sensor features discrete protection components integrated into IC package
Product News  
5/25/2012   1 comment
Ruggedized packaging obviates the need for a conventional PCB arrangement.
Advantest launches high-speed DRAM test system
Product News  
5/25/2012   Post a comment
Offering a maximum test speed of 8 Gb/s, the T5511 supports DDR4-SDRAM and GDDR5-SDRAM devices.
Former Conexant CEO tapped to lead Lantiq
News & Analysis  
5/25/2012   Post a comment
Dan Artusi, a former CEO of both Silicon Laboratories and Conexant Systems, was named to the same position at German broadband and networking chip vendor Lantiq.
Murata completes takeover of VTI with name change
News & Analysis  
5/25/2012   2 comments
The takeover of MEMS manufacturer VTI Technologies Oy here by Murata Manufacturing Co. Ltd. was completed with a name change to Murata Electronics Oy.
Update: Dragon docked to space station
News & Analysis  
5/25/2012   30 comments
Astronauts aboard the International Space Station reached out and grabbed a U.S. commercial spacecraft in darkness over Australia on Friday (May 25).
Sharp to transfer LCD technology to Hon Hai’s China plant
News & Analysis  
5/25/2012   11 comments
Terry Gou, founder of Taiwan’s contract manufacturer Hon Hai (known as Foxconn), has been consistent in its one naked ambition: To build technology prowess at Foxconn that surpasses Korean giant Samsung Electronics.
ST's priorities: Sustain analog, expand into digital
News & Analysis  
5/25/2012   3 comments
The loss a key customer Nokia resulted in a $1 billion loss for STMicroelectronics. ST executives explained this week how they plan to make up for the setback. If it wasn’t for the pesky $1 billion loss of business from a “significant customer” recently ST Microelectronics might be a much better financial and strategic shape.
SIA holds yearly council and drafts global chip tariff policy
News & Analysis  
5/25/2012   Post a comment
Executives from leading companies in the semiconductor industry laid the groundwork for lobbying governments to completely eliminate tariffs on chips.
Intel to spend $40 million on international university research
News & Analysis  
5/24/2012   4 comments
Intel CTO Justin Rattner announced that the company plans to plow more than $40 million into a worldwide network of university research centers over the next five years in an international counterpart to the Intel's U.S.-based university research program.
Renesas still struggling with restructuring plan
News & Analysis  
5/24/2012   6 comments
Japanese chip maker Renesas again finds itself at a crossroads as it struggles to come up with a restructuring plan that would ensure its survival.
High-G MEMS help detect concussions
News & Analysis  
5/24/2012   8 comments
Analog Devices has crafted a MEMS sensor that is says can help detect concussion symptoms when they happen, giving doctors time to administer preventative therapies.
Inertial measurement unit integrates accelerometer, gyro
News & Analysis  
5/24/2012   10 comments
Bosch Sensortec said it has integrated an inertial measurement unit with a three-axis accelerometer and a three-axis gyroscope into the smallest package yet available for consumer-grade applications such as mobile phones, tablets and digital cameras.
Dragon cargo ship, space station fly in formation
News & Analysis  
5/24/2012   8 comments
SpaceX's Dragon cargo ship has completed a series of rendezvous maneuvers that have placed it within sight of the International Space Station. An historic docking is planned for Friday (May 25).
SRC clears path to 14-nm with directed self-assembly litho
News & Analysis  
5/24/2012   13 comments
Researchers at Stanford University claim to have perfected a novel self-assembly lithography technique for creating the irregular patterns necessary to build semiconductors with 14-nm linewidths.
IP being made more accessible
Product News  
5/24/2012   1 comment
For people who wish to try before buying, the whole notion of reference designs and the implementation of them is a great idea…
TI equips ADS8028 SAR A/D converter with SPICE model
Product News  
5/24/2012   Post a comment
Model enables designers to quickly simulate, model and test the full analog signal chain.
Analog Devices ADXL377 analog 3-axis, high-g MEMS accelerometer
Product News  
5/24/2012   Post a comment
ADI's MEMS accelerometer accurately measures concussive forces in contact sports and high impact events in industrial equipment.
High Voltage CMOS process tackles power
News & Analysis  
5/24/2012   Post a comment
The new process provides low specific On-resistance 700V power devices and the lowest mask count in the foundry industry…
ARM CTO looks at architecture scaling for 2020 solutions
News & Analysis  
5/24/2012   11 comments
Anticipating the propagation of the Internet of things, Mike Muller, chief technology officer at ARM Ltd., discussed the needs for architecture scaling at the annual IMEC Technology Forum this week at the Square meeting center in Brussels, Belgium.
Renesas to tie up with TSMC, cut jobs, say report
News & Analysis  
5/24/2012   2 comments
Renesas Electronics Corp., Japan's largest maker of logic chips, is expected to announce a business partnership with foundry Taiwan Semiconductor Manufacturing Co. Ltd. for the production of chips on Monday (May 28), according to reports.
Slideshow: Sun shines on UMC's new fab
News & Analysis  
5/24/2012   6 comments
It was a warm, sunny day in Tainan as UMC officially broke ground on its latest and largest fab to date, but there were distant clouds on the horizon for the foundry.
UMC breaks ground for $8-billion fab expansion
News & Analysis  
5/24/2012   1 comment
Foundry chip company United Microelectronics Corp. has held a groundbreaking ceremony for Phases 5 and 6 of its Fab 12A 300-mm wafer fab complex at Tainan, Taiwan.
Spansion sampling single-level cell NAND for embedded apps
News & Analysis  
5/24/2012   3 comments
Flash memory vendor Spansion said it began sampling the first single-level cell NAND flash memory devices to emerge from a deal with SK Hynix announced last month.
Intersil to cut 11% of workforce
News & Analysis  
5/23/2012   4 comments
Analog chip vendor Intersil said it would cut about 11 percent of its workforce as part of a plan to reduce operating expenses by about $40 million per year.
Synopsys names co-CEO to join de Geus
News & Analysis  
5/23/2012   3 comments
EDA and IP vendor Synopsys announced the promotion of longtime chief operating officer Chi-Foon Chan to the position of co-CEO, effective immediately.
Teardown slideshow: The anatomy of the LED light bulb
News & Analysis  
5/23/2012   72 comments
Tech analysis firm MuAnalysis provides a detailed look inside an LED light bulb from LG.
TI rolls high data rate CAN transceivers
Product News  
5/23/2012   4 comments
Texas Instruments introduced a pair of turbo CAN transceivers designed for data rates in excess of 1 Mbps, meeting the growing demand for more nodes and greater data transmission length in today's industrial CAN networks.
IndyCar safety harnesses MEMS
News & Analysis  
5/23/2012   9 comments
IndyCar designers are improving safety using MEMS sensors fitted in a driver's ear piece to record crash data. The resulting analytics could help reduce injuries like concussions for astronauts as well as race drivers.
NI tips LabVIEW Electrical Power Suite for power monitoring
Product News  
5/23/2012   Post a comment
National Instruments announced the LabVIEW Electrical Power Suite, a new toolkit specific to the power industry that enables engineers to combine an NI CompactRIO system for power measurement with more than 50 signal and sensor modules, according to the company.
Dell's results seen as bad news for Intel
News & Analysis  
5/23/2012   10 comments
Disappointing first quarter results and a lower-than-expected second quarter sales target by PC supplier Dell is bad news for Intel, which has forecast growth above the seasonal average for the rest of the year, according to a Wall Street analyst.
Extech introduces 2-in-1 insulation tester and multimeter
Product News  
5/23/2012   Post a comment
The instrument’s wireless data streaming provides added safety to users.
Dataforth unveils modular acquisition and control system
Product News  
5/23/2012   Post a comment
As many as 384 channels fit within a 19-in. instrumentation rack.
EMI receiver reduces test time from hours to seconds
Product News  
5/23/2012   Post a comment
External modules extend the instrument's frequency range to 18 GHz.
TCL to launch motion-controlled Android TV first in China
News & Analysis  
5/23/2012   5 comments
Among the most common misconceptions about China's CE market is that the role of local vendors is to build cut-rate TV sets sold at lower prices that Chinese consumers can afford.
Report reveals fake chips in U.S. military hardware
News & Analysis  
5/23/2012   28 comments
More than a million suspect counterfeit electronic components have been used in 1,800 separate cases of bogus parts affecting U.S. military hardware, according to a report produced by the Senate Armed Services Committee.
TI says copper wire bonding momentum growing
News & Analysis  
5/23/2012   3 comments
Texas Instruments said it has shipped nearly 6.5 billion analog, embedded processing and wireless chips using copper wire bonding technology, a milestone that the firm says underscores the semiconductor industry's growing confidence in copper packaging technology as a viable replacement for gold.
Plessey launches EPIC sensor for automotive detections applications
Product News  
5/22/2012   Post a comment
Car manufacturers have been taking note of Plessey’s EPIC sensor technology for low cost, reliable detection systems.
Integrated power modules shrink PCB size up to 70% and simplify class-D amplifier design
Product News  
5/22/2012   Post a comment
International Rectifier has introduced the PowIraudio family of integrated power modules for high performance home theater systems and car audio amplifiers.
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