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Content posted in May 2012
<<   <   Page 8 / 8
EASIC claims to enable 3X increase in energy efficiency for supercomputer
News & Analysis  
5/2/2012   Post a comment
Fabless ASIC house eASIC said the Tokyo Institute of Technology, in collaboration with Hitotsubashi University, has successfully demonstrated a 3X increase in energy efficiency for a green supercomputer used for performing astronomical simulations using eASIC's Nextreme-2 NEW ASIC devices.
eASIC's chips provide 3X efficiency increase for supercomputer
Product News  
5/2/2012   Post a comment
GRAPE-8 supercomputer achieves 6.5 GFLOPS/Watt efficiency for astrophysical simulations.
CEA stokes engines of innovation with free booth at CES 2013
News & Analysis  
5/2/2012   2 comments
The Consumer Electronics Association will sponsor a contest where a startup can with a free exhibit space at next year's Consumer Electronics Show.
JEOL FE-SEM enables sub-nm imaging, analysis
Product News  
5/2/2012   Post a comment
A large specimen chamber accommodates a wide variety of detectors.
Thermometers perform calibration checks
Product News  
5/2/2012   Post a comment
Battery-powered units come with a Pt100 sensor probe and 5-point calibration certificate.
Latest Android NDK fully supports MIPS architecture
Product News  
5/2/2012   Post a comment
Android app developers can directly bring native applications to millions of MIPS-based platforms.
Microchip Technology acquires SMSC
News & Analysis  
5/2/2012   1 comment
This latest acquisition will expand Microchip’s smart connectivity solutions for embedded markets.
earchers come up with possible ITO replacement
News & Analysis  
5/2/2012   1 comment
A research team from the University of Exeter has placed its stamp on its unique version of a transparent, lightweight and flexible graphene material.
Soft errors can cause headaches at smaller geometries
Product News  
5/2/2012   1 comment
IROC has been in the soft error business for a decade, developing simulation expertise and tools while also providing test and analysis services…
Yole: Sony, Silex, Dalsa shine MEMS foundry ranking
News & Analysis  
5/2/2012   3 comments
The top 20 MEMS foundries increased revenues by 5 percent in 2011 compared to 2010 to more than $600 million, according to market research firm Yole Development.
SIA: March chips sales showed sequential improvement
News & Analysis  
5/2/2012   Post a comment
The three month-rolling average of global chip sales improved to $23.3 billion in March, up 1.5 percent from February but down 7.9 percent compared with March 2011, according to the Semiconductor Industry Association trade group.
Mercury wins sensor processing subsystem contract with Raytheon
News & Analysis  
5/2/2012   1 comment
Mercury Computer Systems (Chelmsford, Massachusetts) said it has concluded a contract with Raytheon Space and Airborne Systems to deliver application-ready subsystems and integration services for Raytheon’s Advanced Distributed Aperture System.
Microchip tips gesture firm buy in profitable quarter
News & Analysis  
5/2/2012   1 comment
Microcontroller vendor Microchip has acquired Ident Technology, a German company that is developing 3-D gesture recognition technology based on electric field sensing.
Low-power accelerometer senses shock up to 400g in 3D
Product News  
5/2/2012   Post a comment
The industry’s first 3-axis high-g accelerometers with ultra-low current consumption optimized for battery-operated applications are ready to hit the shelf. The
ADI unveils converters for performance and small package advantage
Product News  
5/2/2012   Post a comment
Analog Devices introduced a series of quad 16-, 14- and 12-bit D/A converters in space-saving 16-lead surface-mount LFCSP or leaded TSSOP packages.
IXYS introduces highest power density bipolar TO240 module
Product News  
5/2/2012   1 comment
IXYS Corporation announced the highest power density bipolar module in the industry standard TO240 outline
CS Series LED linear luminaire cuts energy consumption 40-50%
Product News  
5/2/2012   Post a comment
Cree unveiled a high-efficacy suspended linear luminaire that uses 40-50% less energy
Photomask market to grow 7% in 2012, SEMI says
News & Analysis  
5/1/2012   3 comments
The worldwide semiconductor photomask market is expected to be worth $3.35 billion in 2012, up 7 percent from 2011, according to the fab tool vendor trade group SEMI.
Broadcom tops Q1 estimates as profit tumbles
News & Analysis  
5/1/2012   2 comments
Fabless semiconductor provider Broadcom reported sales and profit that exceeded analysts' expectations, even as its net income in accordance with generally accepted accounting principles tumbled compared with the previous and year-ago quarters.
Fairchild asserts new patents against Power Integrations
News & Analysis  
5/1/2012   1 comment
Fairchild Semiconductor said it filed new patent infringement claims in U.S. federal court against Power Integration' LinkSwitch-PH LED power conversion products.
HGST, LSI, PMC-Sierra demo 12G SAS
News & Analysis  
5/1/2012   Post a comment
The HGST division of Western Digital demonstrated a solid-state disk drive with a 12 Gbit/second Serial Attached SCSI interface working with chips from LSI and PMC-Sierra.
Fujitsu to transfer Iwate fab to Denso
News & Analysis  
5/1/2012   Post a comment
Fujitsu Semiconductor will transfer ownership of an older fab that produces microcontrollers to Japanese automotive parts supplier Denso under the terms of an agreement announced last week.
TriQuint wins $12.3 million DARPA contract
News & Analysis  
5/1/2012   Post a comment
RF chip supplier TriQuint Semiconductor said it was selected by the the U.S. Defense Advanced Research Projects Agency to lead a $12.3 million development program focused on ultra-fast gallium nitride switch technology for DARPA's Microscale Power Conversion program.
che updates Redhawk for sub 20-nm and 3-D designs
News & Analysis  
5/1/2012   Post a comment
Ansys subsidiary Apache Design has developed its fourth-generation power sign-off EDA software package which addresses sub-20-nm designs that operate at 3 GHz. The RedHawk-3DX package also supports simulation of multi-die 3-D ICs.
DVGAs promise convenience for 3G 4G communications
Product News  
5/1/2012   Post a comment
TriQuint Semiconductor, Inc has released two digitally-controlled variable gain amplifiers (DVGAs) that are designed to integrate functionality and reduce bill of material
Portable video RF link enhances HD/SDI capable cameras
Product News  
5/1/2012   Post a comment
Integrated Microwave Technologies, LLC now offers its RF Central microLite HD Elite  System.
GlobalFoundries, Infineon, IBM, ST linked to Indian fab plan
News & Analysis  
5/1/2012   20 comments
More companies are being linked to the Indian government's plan to get one or more semiconductor wafer fabs constructed on the sub-continent. At least five chip companies have expressed an interest in supporting the project, according to a Hindu Business Line report.
congatec's entry-level COM Express Type 2 module sports Intel Atom dual-cores
Product News  
5/1/2012   Post a comment
The conga-CCA from congatec Inc. is an entry-level model of the company's Type 2 Pin-out COM Express module range.
Libelium lists 50 Internet of Things (IoT) applications
News & Analysis  
5/1/2012   1 comment
Libelium, a supplier of wireless sensor nodes, has produced a list of more than 50 sensor applications that will help drive the Internet of Things and wireless sensor networks.
Financial reports point to better Q2 for semis
News & Analysis  
5/1/2012   Post a comment
Semiconductor vendors and related companies have largely continued in recent days to forecast sequential quarterly growth in providing sales targets for the current quarter.
LDK Solar has cut more than 5,000 jobs this year
News & Analysis  
5/1/2012   6 comments
In another sign of trouble for the solar industry, an executive for LDK Solar that the photovoltaic panel manufacturer has cut more than 5,000 jobs so far this year.
<<   <   Page 8 / 8


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