Intel reportedly places ATE order with Advantest News & Analysis 6/28/2002 Post a comment SAN JOSE -- Rumors are running rampant that Intel Corp. has placed a new and large order for automatic test equipment (ATE) from Japan's Advantest Corp., according to several sources and analysts in the industry.
Sources believe that Advantest is building a new line of "structural testers" for Intel. The Santa Clara, Calif.-based chip giant is reportedly using these testers for next-generation chip products, possibly even microprocessors, according to sources.
What happen to the upturn? News & Analysis 6/28/2002 Post a comment SAN JOSE -- What happened to the anticipated recovery in the semiconductor industry?
While it's a bit early to write off the year, there are more signs that the chip industry will remain in the tank in 2002. Just this week alone, the IC and telecommunications markets were rocked by a plethora of bad news from Alcatel, Motorola, WorldCom, and others.
Silicon Engineering News & Analysis 6/28/2002 Post a comment In the 30 years and 1,225 issues since EE Times first appeared, perhaps no human pursuit has changed as profoundly and fundamentally as the practice of electronics engineering. That's the motivating force behind one of the most fundamental changes EE Times has ever undertaken.
Nu Horizons reports break-even quarter News & Analysis 6/28/2002 Post a comment Nu Horizons Electronics Corp., Melville, N.Y., said net sales from continuing operations for the first quarter of fiscal 2003, ended May 31, were $75 million as compared to $89.7 million for the prior year's fiscal period.
Engineers hit hard, as Motorola lays off 7,000 News & Analysis 6/28/2002 Post a comment Motorola Inc. pushed ahead with its "asset-light" strategy last week, announcing thousands of engineering and other layoffs and widening its embrace of Taiwan Semiconductor Manufacturing Co. (TSMC) for additional foundry capacity.
eConnections failure will test rivals News & Analysis 6/28/2002 Post a comment The stunning demise of eConnections has sent shock waves through the broader supply chain services market, where more casualties may be imminent.
The same factors forcing eConnections to throw in the towel-the slumping electronics industry and slower-than-expected adoption of its services by high-tech users-are likely to hit other providers, analysts said.
Justice probe of Sun could spur new look at H-1B visas News & Analysis 6/28/2002 Post a comment A Justice Department preliminary investigation to determine whether Sun Microsystems Inc. might have discriminated against U.S. citizens and favored foreign workers could spur a congressional reexamination of the H-1B visa program, legal experts say.
Sun counters Intel with low-cost UltraSPARCs News & Analysis 6/28/2002 Post a comment Even as Intel Corp. invades Sun Microsystems Inc.'s Unix-based enterprise server territory, Sun is staging a flanking maneuver to attack the low-end and Web-based server markets that Intel has come to dominate.
Midtier distributors edge into China News & Analysis 6/28/2002 Post a comment Distribution's midtier is feeling a tug from OEM and EMS customers to enter China's budding electronics market, but a survey of companies in the sector indicates that smaller channel players will not move to the mainland en masse.
Unlike most of the industry's top-tier distributors, which began forging a sales and engineering presence and building warehouses in China in the early '90s, few midrange distributors have yet committed substantial resources to prime mainland manufacturing locations s
NeoMagic lands Toshiba as SOC customer News & Analysis 6/28/2002 Post a comment After exiting the notebook graphics-IC market in 2000 and then introducing an a system-on-a-chip (SoC) for handheld Internet appliances last year, NeoMagic Corp. this week said Toshiba Corp. is using NeoMagic's MiMagic 3 (NMS7210) processor for its MOBILPHILE portable digital audio player.
IC makers, OEMs define new multimedia standard News & Analysis 6/28/2002 Post a comment SUNNYVALE, Calif. -- A consortium of chip makers and OEMs here today announced the first specifications for a new and emerging high-definition multimedia interface standard. The technology is geared for a new class of consumer electronic devices and other products.
The recently-formed consortium, dubbed the High Definition Multimedia Interface (HDMI) Founders, include Hitachi, Matsushita Electric (Panasonic), Philips, Silicon Image, Sony, Thomson, and Toshiba.
Nanophase clarifies slurry deal with Rodel News & Analysis 6/28/2002 Post a comment ROMEOVILLE, Ill. -- In an attempt to clarify the apparent confusion in the marketplace, Nanophase Technologies Corp. here today elaborated on its deal with Rodel Inc. in the slurry materials arena.
Under the terms, announced on Wednesday, Rodel will combine its patented chemistries with Nanophase's new nanoparticle technology to develop and market new chemical mechanical polishing (CMP) slurries for the semiconductor industry.
More jobs to go at Alcatel News & Analysis 6/28/2002 Post a comment French telecomms equipment maker Alcatel is set to cut a further 10 000 jobs worldwide. The company also admitted it would not make a profit this year, as it forecast just two months ago.
DDi gets new loan agreement News & Analysis 6/28/2002 Post a comment DDi Corp., Anaheim, Calif., today announced that its principal operating subsidiary, Dynamic Details Inc., has
successfully reached an agreement to amend its senior credit facility, effective June 28.
Via backs HyperTransport for future chip set designs News & Analysis 6/28/2002 Post a comment TAIPEI, Taiwan -- Taiwan's Via Technologies Inc. here announced plans to support HyperTransport, the next-
Generation, I/O chip-to-chip interconnect technology.
The Taipei-based chip set specialist is also joining the HyperTransport Technology Consortium. Developed by Advanced Micro Devices Inc., HyperTransport is a high-speed interconnect technology that is suitable for a range of applications, such as PCs, game consoles, and mobile devices.
SQI offers backgrinding wafer service News & Analysis 6/28/2002 Post a comment SANTA CLARA, Calif. -- Silicon Quest International (SQI) Inc. here announced that it has begun offering a backgrinding and wafer thinning service for semiconductor device manufacturers.
SQI's high-volume backgrinding service is focused on the production of 3- to 8-inch wafer sizes. The company's service also includes solder and gold bumped wafer thinning, and tight tolerance silicon-on-insulator (SOI) wafer thinning.
TSMC shrinks CMOS transistors News & Analysis 6/28/2002 Post a comment TSMC, the world's largest dedicated semiconductor foundry, has demonstrated a working device which uses CMOS transistors that are about 10 times smaller than those made with today's most advanced production technology.
Partners can access SuperH tools for SoC News & Analysis 6/28/2002 Post a comment Microprocessor cores developer SuperH has developed a partnership programme that will give licensees access to the tools and complementary intellectual property (IP) necessary for integrating its cores in to system-on-chip (SoC) products.
The programme includes IP libraries, silicon design, modelling, verification and testing.
IEEE 802.11g to benefit WLANs News & Analysis 6/28/2002 Post a comment Jim Zyren, director of strategic marketing for wireless networking
at Intersil explains the draft standard and explains how its adoption
is an important step for the introduction of dual band radios.
Varian raises forecast amid sudden demand News & Analysis 6/28/2002 Post a comment GLOUCESTER, Mass. -- Varian Semiconductor Equipment Associates Inc. here today raised its forecast for the third quarter of fiscal 2002, ending June 28.
Due to a late-quarter acceleration in customer demand, Varian now expects revenue for the quarter to range from $91-to-$96 million, up from previously anticipated revenue of $75-to-$90 million, and diluted earnings per share to rise from a previously anticipated breakeven level to between $0.06 and $0.09.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.