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Content posted in June 2002
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Viking Telecom omstrukturerar
News & Analysis  
6/4/2002   Post a comment
Som ett led i anpassningen till de förändrade förhållandena på telekommarknaden har Viking Telecom inlett MBL-förhandlingar om uppsägning av ca 15 personer i Viking Telecom-koncernen. En stor del av omstruktureringen görs genom ett utökat samarbete med företagets partners i Asien.
Bayerischer Rundfunk köper nätlösning från Net Insight
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6/4/2002   Post a comment
Bayerischer Rundfunk, som ingår i ARD, den tyska motsvarigheten till svenska SVT, har beställt Net Insights plattform för att koppla ihop lokala TV-stationer i södra Tyskland.
Sematech, JSR to offer test wafers to enable ICs with low-k dielectrics
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6/4/2002   Post a comment
AUSTIN, Tex. -- International Sematech and Japan's JSR Corp. today announced plans to offer test wafers for use in developing new, advanced chips with low-k dielectric technologies. The test wafers, which will help chip makers to develop ICs with low-k properties, will be offered to semiconductor companies on a limited basis under a supplier agreement between Sematech and JSR.
IBM restructures chip business, to lay off 1,500 workers
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6/4/2002   Post a comment
IBM Corp. today reorganized its Microelectronics unit into three businesses and laid off 1,500 employees. The new business units include a high-end foundry business, ASIC designs, and standard products, such as Power PC devices.
Force shows Gigabit Ethernet backplane, DSP boards
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6/4/2002   Post a comment
Force Computers Inc. unveiled a Gigabit Ethernet packet-switched backplane for its Centellis CO backplane family at Supercomm this week, and announced its entry into the communication DSP board market.
AMD demos new graphics technology for Hammer line of 64-bit processors
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6/4/2002   Post a comment
TAIPEI, Taiwan -- At the Computex trade show here today, Advanced Micro Devices Inc. demonstrated a new graphics technology for its upcoming 32/64-bit microprocessor lines, code-named Hammer. AMD's graphics technology, dubbed AGP-8x, enables PCs to support low memory latency, increased throughput, and larger cache sizes for the company's next-generation, 64-bit processor line.
Intel's Barrett urges comm industry to 'reinvent itself' to restore growth
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6/4/2002   Post a comment
ATLANTA -- During the Supercomm trade show here today, Intel Corp. CEO Craig Barrett said that the communications industry must "reinvent itself" and provide new capabilities to restore growth amid the current and severe downturn in the sector. Barrett also outlined the importance of silicon innovation and standards-based architectures for the reinvention of the communications industry. He said that Intel itself is poised to leverage its upcoming 90-nm (0.09-micron) process technologies for its
Former Siemens executive takes helm at wireless-IC startup Atsana
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6/4/2002   Post a comment
OTTAWA -- Atsana Semiconductor Corp., a developer of programmable processors for multimedia wireless devices, today announced Alex M. Leupp as its chief executive and president. Leupp was formerly the president and chief executive of Siemens Microelectronics Inc., now called Infineon Technologies AG. Most recently, he was president and chief executive of 3dfx Interactive.
Intel exec predicts leading edge 'capacity famine'
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6/4/2002   Post a comment
NEW YORK -- Intel CEO Craig Barrett will pay homage to "convergence" in his keynote address at the Supercomm trade show in Atlanta on Tuesday, but it will be the chip giant's upcoming 90-nm (0.09-micron) CMOS process technology that will enable the company to dominate the communications semiconductor market, according to an executive at the Santa Clara, Calif.-based firm.
Ruling highlights weak DSL market in U.S.
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6/4/2002   Post a comment
A recent U.S. appeals court ruling has underscored how rival broadband technologies and a weak infrastructure are causing the rollout of DSL services in the United States to lag behind much of the rest of the world.
X-Fab expands mixed-signal foundry portfolio with 0.35-micron process
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6/4/2002   Post a comment
GERFURT, Germany -- Germany's X-Fab Semiconductor Foundries AG here today expanded its silicon foundry portfolio, announcing a new, 0.35-micron CMOS process technology for digital and mixed-signal applications. The process, dubbed XC035, is a fully qualified and characterized technology that comes with a comprehensive line of design kits. Electronic design automation (EDA) tool support comes from Cadence, Verilog, Vital, Synopsys, according to the Erfurt-based company.
Liten burk kartlägger stora 3G-nät
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6/4/2002   Post a comment
För inte så länge sedan behövde man skrymmande mätsystem för att kartlägga täckningen från UMTS-basstationer. Den senaste utrustningen får plats i vilken bil som helst.
Liten burk kartlägger stora 3G-nät
News & Analysis  
6/4/2002   Post a comment
För inte så länge sedan behövde man skrymmande mätsystem för att kartlägga täckningen från UMTS-basstationer. Den senaste utrustningen får plats i vilken bil som helst.
MEMS Overview
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6/4/2002   Post a comment
In the "smaller is better" world of microelectromechanical systems (MEMS), device processing is king. This overview from Sandia National Laboratories describes the intricate manufacturing processing you need to add to a CMOS device to build viable MEMS-based SoCs.
Clocking Strategies for QDRII, DDRII Designs
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6/4/2002   Post a comment
To meet the high-speed requirements of designers, second-generation QDR and DDR memories are on the way. In addition to delivering wider bus widths, these memory schemes provide a host of clocking options.
PowerPC mezzanine card
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6/4/2002   Post a comment
The Palomar DFX mezzanine board sports two IBM 750FX PowerPC RISC processors, each delivering 1 GHz performance capabilities.
10-Gb IP transport core kit
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6/4/2002   Post a comment
An intellectual property (IP) core kit has been unleashed for 10-Gb transport system designs employed in Sonet, SDH, OTN, ATM, and Ethernet applications.
Multilayer optical test platform
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6/4/2002   Post a comment
The CMA5000 test platform has been released for design engineers building optical networking equipment.
Cadence releases database to OpenAccess coalition
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6/4/2002   Post a comment
Meeting a timetable set in February, Cadence Design Systems Inc. this week will announce the release of OpenAccess version 2 database source code to the OpenAccess Coalition. While not a final, production release, it will allow coalition members to start building EDA applications based on the database, according to Cadence and the Silicon Integration Initiative (Si2).
Chinese suppliers active in passives market
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6/4/2002   Post a comment
China's budding electronic components base is challenging the industry's old guard by offering more competitive products and landing coveted positions on the approved-vendor lists of OEMs and EMS providers operating on the mainland.
RTL-to-GDSII flow shows signs of maturity
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6/3/2002   Post a comment
The RTL-to-GDSII design flow will take center stage at next week's Design Automation Conference in New Orleans, as several vendors show new technologies intended to solidify an all-in-one flow.
Public division belies private cooperation of PCI rivals
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6/3/2002   Post a comment
The split between developers over the future of the PCI bus was readily apparent in contrasting keynotes by representatives from Intel Corp. and IBM Corp. at the PCI Developers Conference here Monday (June 3). But behind the scenes, engineering teams from the conflicting PCI Express and PCI X 2.0 camps have started to hammer out a path to interoperabilty between the two approaches.
Mitsubishi, Sony, Toshiba, GSI and ISSI begun sampling SigmaRAM chip products
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6/3/2002   Post a comment
SAN JOSE -- The SigmaRAM Consortium today announced that five chip suppliers are sampling SRAM products, based on the JEDEC-standard, 18-megabit SigmaRAM standard. GSI Technology, Integrated Silicon Solution Inc., Mitsubishi Electric Corp., Sony Electronics Inc., and Toshiba Corp. are all shipping SRAMs that conform to the consortium's single-data-rate, pipelined-read specification. All five suppliers expect to be in volume production for this product by the third quarter of 2002.
Rambus appeal hinges on disclosure rules
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6/3/2002   Post a comment
Rambus Inc. told a federal appeals panel on Monday (June 3) that it had no duty to disclose its synchronous DRAM patent claims to an industry standards group.
Creditors take majority stake in Hynix
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6/3/2002   Post a comment
Creditor of Hynix Semiconductor Inc. have exercised their option to take a majority stake in the troubled DRAM maker.
Intelligent testbench begins to coalesce
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6/3/2002   Post a comment
Significant steps toward an "intelligent testbench" — a fully automated verification solution — will unfold at next week's Design Automation Conference here, where vendors including Synopsys, Co-Design Automation, TransEDA and Cadence Design Systems will offer new functionality.
Appeals court hears Rambus-Infineon case
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6/3/2002   Post a comment
A federal appellate court panel on Monday heard Rambus Inc.'s appeal of a fraud verdict rendered in a case involving the memory company and Infineon Technologies.
Dataquest sees slow silicon wafer market; downturn changes vendor rankings
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6/3/2002   Post a comment
TOKYO -- The worldwide blank silicon wafer market is expected to rebound after a horrific year in 2001, but the business is not projected to grow as fast as vendors would like in 2002, according to a new report from Dataquest Inc. here today. Worldwide silicon wafer revenues totaled $5.4 billion in 2001, a 31% decline from $7.8 billion in 2000, according to Dataquest, based in San Jose.
Optical, broadband access offerings unveiled at Supercomm
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6/3/2002   Post a comment
Infineon Technologies AG will unveil a slew of broadband access and 10-Gbit optical ICs at Supercomm2002 in Atlanta this week to demonstrate its line-card and access device capabilities.
Via rolls out 1-GHz processor and consumer chips in major product launch
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6/3/2002   Post a comment
TAIPEI, Taiwan -- During the Computex trade show here today, Taiwan's Via Technologies Inc. announced a plethora of new products, including a 1-GHz, x86-based microprocessor for PCs. The Taipei-based company also rolled out a line of graphics chips, DVD ICs, and audio devices. Via introduced its fastest processor to date--the VIA C3 series of 1-GHz chips for use in "value" PCs and other products. With a typical power consumption of 5.7 Watts, the VIA C3 processor includes 128-KB of Level 1 cach
Palm, Converge broaden supply chain relationship
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6/3/2002   Post a comment
Palm Inc. is expected to announce today that it has selected Converge Inc. to help manage its surplus components and procurement operations, cementing a relationship nurtured over the last six months as Palm worked to reduce excess inventory.
Tools for Test and Debug
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6/3/2002   Post a comment
Embedded designers face a myriad of multiprocessor challenges
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6/3/2002   Post a comment
In the present design environment for embedded systems and the small footprint iAppliances, engineers are faced with multiple challenges in what used to be a relatively straightforward process.
Saying goodbye to Mary
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6/3/2002   Post a comment
I first met Mary 20 or so years ago when she was a media director in a Silicon Valley advertising agency. I liked her immediately.
Measuring the diversity push
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6/3/2002   Post a comment
Diversity was a buzzword about seven or eight years ago. I remember when organizations instituted the first mandatory diversity-training programs.
Popping rivets
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6/3/2002   Post a comment
The Valley these days is a place of dichotomies.
Gary Smith's prediction
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6/3/2002   Post a comment
I remember at DAC two years ago when Gary Smith of Dataquest first mentioned the "importance" of virtual silicon prototyping.
Is it time for CAMs?
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6/3/2002   Post a comment
Several times in the past few years, analysts have predicted that content-addressable memories were poised for wild growth that never quite occurred. So with some restraint, I am cautiously optimistic about CAMs.
Not out of the woods yet
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6/3/2002   Post a comment
The long-awaited semiconductor market recovery is now in full swing, both on a year-on-year and month-on-month basis.
Packet radio seeks voice
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6/3/2002   Post a comment
In researching a new study on packet voice markets for DSP, we contacted the major cell phone and cellular infrastructure manufacturers, the major DSP chip suppliers and several operators to ask whether voice was being packetized on 2.5G and "3G lite" systems now being deployed.
USB Joins the Mobile iAppliance Connectivity Repertoire
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6/3/2002   Post a comment
Standards efforts are underway which will move the the Universal Serial Bus its position as a PC-centric connectivity option to playing a major role in building net-centric distributed iAppliance designs.
AMD processors get chipset support from Taiwan
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6/3/2002   Post a comment
TAIPEI, TAIWAN -- Taiwan's chipset players have rolled out products that support the latest processors of Advanced Micro Devices Inc. for workstation and server applications as well as for desktop PCs.
Inphi obtains $24 million in funding to develop 10- and 40-Gbps devices
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6/3/2002   Post a comment
WESTLAKE VILLAGE, Calif .-- Inphi Corp. today announced it has received an additional $24 million in its second round of equity funding. This round brings the total investment to $36 million for the supplier of chips for 10- and 40-gigabit-per-second applications. The lead investor for the Series B funding is Walden International. Other participants in the round include Dali-Hook Partners, Tallwood Venture Capital and Mayfield.
Unisphere routing system adds service-creation capabilities
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6/3/2002   Post a comment
Unisphere Networks Inc. is augmenting the service-creation capabilities of its edge-routing system by putting a Sun Netra server to work in what it calls a Service Deployment System. The SDX-300B allows service levels and data flows to be changed dynamically via a gateway that invokes services in the ERX router.
Startups look to supersize the switch fabric
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6/3/2002   Post a comment
The next pack of startups for networking silicon is targeting the switch fabric, as vendors look for ways to increase size and speed without creating new bottlenecks inside a switch.
Intel wants top-level execs to say 'Yes'
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6/3/2002   Post a comment
Having laid out a comprehensive microprocessor strategy, Intel Corp. will attempt to string its diverse product portfolio together with a single marketing message tailored for senior enterprise executives.Called simply "Yes," the multimillion-dollar campaign reflects Intel's desire to penetrate the market for higher-performance, higher-dollar-value systems, purchasing decisions that usually require "C Suite" approval.
Tough climate tests Japan's Mettle
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6/3/2002   Post a comment
Blair commits to science
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6/3/2002   Post a comment
Prime minister Tony Blair believes a greater commitment to technology is vital for the continued economic prosperity of the UK. But in a keynote speech to the Royal Society, he also argued that the sector needs to marry science with moral responsibility.
Siemens cuts non-core jobs
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6/3/2002   Post a comment
Siemens is shedding 2000 jobs from its Industrial Solutions and Services Group (I&S) and is looking to sell off other non-core assets.
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