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Content posted in June 2010
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Infineon aims to beat 30% annual growth, says report
News & Analysis  
6/25/2010   Post a comment
German chip vendor Infineon Technologies AG is predicting revenue growth for its 2010 financial year in the "high 30 percent range" compared with the previous fiscal year that ended on Sept. 30, 2009, according to a Bloomberg report.
NXP opens RF design center in Massachusetts
News & Analysis  
6/25/2010   1 comment
Dutch chip company NXP BV has opened a radio frequency product creation center in Billerica, Massachusetts.
Mercedes-Benz cars use SMSC's wireless audio technology
Product News  
6/25/2010   Post a comment
SMSC, New York-based developer of smart mixed-signal connectivity solutions, announced that Daimler AG will implement its wireless audio products in the rear seat entertainment system of Mercedes-Benz E-Class and S-Class models.
Atmel completes sale of fab in France
News & Analysis  
6/24/2010   Post a comment
Germany's LFoundry GmbH, an analog and mixed-signal foundry, has completed its previously-announced acquisition of Atmel Corp.’s wafer fabrication operation in Rousset, France.
Can Nikon regain its focus?
News & Analysis  
6/24/2010   Post a comment
Can Nikon Corp. regain its focus?
IBM 'fab club' aligns 28-nm process, jabs rival
News & Analysis  
6/24/2010   1 comment
IBM, Samsung, GlobalFoundries and STMicroelectronics said that they are in collaboration to ''synchronize’’ the production of chips, based on its previously-announced, 28-nm low-power process.
DRAM makers to pay $173M in price-fixing case
News & Analysis  
6/24/2010   Post a comment
Some 32 states in the United States announced a $173 million settlement with six DRAM manufacturers who "conspired in an illegal global scheme to fix prices."
5 kV digital isolators replace traditional optocouplers in harsh application environments
Product News  
6/24/2010   Post a comment
Silicon Laboratories introduced a line of 5 kV digital isolators designed to replace traditional optocouplers in harsh application environments and systems powered from universal mains supplies.
First look inside iPhone 4
Teardown  
6/24/2010   6 comments
You could call the new Apple iPhone 4 an iPad Nano because it uses at least six chips from the popular Apple tablet, according to analysts from UBM TechInsights that have done a teardown of the new smartphone, revealing it uses a MEMS gyro from STMicroelectronics.
Compact COM module combines low power, high processing
Product News  
6/24/2010   Post a comment
MEN Micro Inc. has expanded its ESMini family to include the MM50 that incorporates the high processing capabilities and power dissipation of PowerPC into a flexible, compact COM (computer-on module) board.
Aeroflex rolls single-box multi-RAT tester
Product News  
6/24/2010   Post a comment
Aeroflex's 7100 tester now supports multiple Radio Access Technologies (RAT) including CDMA EV-DO and eHRPD as well as LTE to accelerate multi-mode cellular terminal device development for new LTE deployments.
QorIQ processors power COM Express computing modules
Product News  
6/24/2010   Post a comment
Emerson Network Power is offering modular single board computers (SBCs) based on the COM Express small form factor powered by Freescale Semiconductor's multicore QorIQ processors.
SerDes provides real-time bidirectional control for driver-assist cameras
Product News  
6/24/2010   Post a comment
National Semiconductor unveiled its FPD-Link III family of automotive-grade serializer and deserializer (SerDes) chipsets featuring the industry's first real-time, bidirectional control channel for driver-assist video cameras.
Q1 smartphone market was 55 million units, says ABI
News & Analysis  
6/24/2010   2 comments
More than 55 million smartphones shipped during the first quarter of 2010, according to market researcher ABI Research.
China's $25 billion to boost domestic production, says analyst
News & Analysis  
6/24/2010   2 comments
LONDON — The Chinese government is preparing to spend $25 billion on wafer fabs to boost domestic chip manufacturing over the next five years, according to market research company The Information Network. This is set to boost the proportion of local demand met by domestic wafer fabs and diminish Chinese chip imports, the analysis firm said
Premo rolls closed-loop effect sensor
Product News  
6/24/2010   Post a comment
The Spanish inductive component maker Premo Group has introduced the HCT-1000-SH series, a high current Closed Loop Hall Effect Sensor that is claimed to test and measure accurately current levels up to 1000 Amps.
Future auto safety system seen using passive, active sensors
News & Analysis  
6/24/2010   Post a comment
The next generation of car automation will combine passive MEMS sensors with active actuators that will increasingly "drive" cars in hazardous situations to avoid accidents.
MIPS to restructure, align with Android
News & Analysis  
6/24/2010   Post a comment
Processor IP licensor MIPS Technologies Inc. has announced a restructuring plan that will see it reduce headcount and incur a $1 million restructuring charge. The changes are expected to save company between $2 million and $2.4 million in annual expense, including the current financial year.
May chip sales show World Cup effect, says analyst
News & Analysis  
6/24/2010   Post a comment
The three-month average of global chip sales for May is set to be called at $24.5 billion, compared with $23.3 billion in April and an all time record, according to Bruce Diesen, an analyst at Carnegie Group.
Serial RapidIO Gen2 switches double embedded interconnect performance
Product News  
6/24/2010   Post a comment
Designed for use in the wireless infrastructure, defense, medical and industrial imaging, and professional video markets, IDT's Serial RapidIO Generation 2 (Gen2) switches double the data rate up to 20-Gbps, while reducing power by 40 percent and improving latency to 100 nanoseconds in cut-through mode.
Vishay extends power capacitors with capacitance values up to 2235µF
Product News  
6/24/2010   Post a comment
Vishay Intertechnology Inc. is extending its heavy-duty Vishay ESTA HDMKP capacitors for power electronics with new capacitance and packaging options.
Micro USB connector is 60% smaller than mini-USB devices
Product News  
6/24/2010   Post a comment
Aimed at mobile phones, MP3 players, PDAs and digital cameras, FCI's latest connector complies with the physical, electrical and environmental requirements of USB 2.0 standard.
PCI Express 3.0 delayed until 2011
News & Analysis  
6/24/2010   3 comments
The PCI SIG has released an interim 0.71 version of the PCI Express 3.0 specification that supports up to 8 GigaTransfers/second and aims to start testing products for compliance in early 2011, about a year later than originally anticipated.
AMD x86 cores at Hot Chips
News & Analysis  
6/24/2010   Post a comment
AMD is expected to steal the limelight at the annual Hot Chips conference when it describes two new x86 cores that mark the first major architectural advance for the company in several years.
ITC finds for Monolithic Power over O2 Micro
News & Analysis  
6/23/2010   Post a comment
The U.S. International Trade Commission has issued a final determination finding no violation by Monolithic Power Systems or its customers in an action brought by O2 Micro International in 2008.
Mentor Graphics Linux Freescale
Product News  
6/23/2010   Post a comment
Mentor Graphics has brought out its Linux platform supporting Freescale Semiconductor, which enables applications for Freescale’s QorIQ and PowerQUICC processors.
Group forms another 3-D chip alliance
News & Analysis  
6/23/2010   Post a comment
Another three-dimensional (3-D) chip alliance has been hatched.
VLSI ups fab tool outlook in hot market
News & Analysis  
6/23/2010   Post a comment
The fab tool and materials industries are hot.
Will Spansion succeed or fail again?
News & Analysis  
6/23/2010   Post a comment
Spansion Inc. is looking to make a big comeback.
Nikon's 'stagnant' EUV litho is a risk, says analyst
News & Analysis  
6/23/2010   3 comments
Nikon is continuing to conduct basic research into extreme ultraviolet lithography but is falling behind its rival ASML, according to an analyst's note from Nomura. The author considers that Nikon might be worthy of Japanese government support.
EV battery subsystem taps Maxim
News & Analysis  
6/23/2010   2 comments
A team competing for $2.5 million in the Automotive X Prize is in the final stages of developing a battery management system for their entry that they hope someday will power a range of commercial electric vehicles.
Europe funds ARM-based server research
News & Analysis  
6/23/2010   2 comments
The European Commission is part-funding a collaborative research project investigating the use of the ARM processor architecture in data centers
Internet radio comes to cars
Product News  
6/23/2010   Post a comment
Livio Radio (Ferndale, Mich.) has unveiled a portable car audio player that takes Internet programming from the computer to the car stereo.
ISuppli: IC inventories still below average
News & Analysis  
6/22/2010   Post a comment
Semiconductor vendors' chip inventory levels remain at low levels despite a small increase in the first quarter of the year, according to market research firm iSuppli.
Freescale CEO: 'Connected intelligence' beating recession
News & Analysis  
6/22/2010   Post a comment
Freescale Semiconductor revealed its vision of the future of semiconductor technology at the Freescale Technology Forum, where CEO Richard Beyer predicted that the recession will continue to fade by virtue of the commercial success of what he called "connected intelligence."
IAR Systems supports new Freescale MCU families
Product News  
6/22/2010   1 comment
Freescale's newest Kinetis, ColfFire and i.MX microcontrollers can now all use a common software development environment from IAR Systems, the company announced.
Slideshow: Nuts, bolts of green energy
News & Analysis  
6/22/2010   Post a comment
The steady transition away from fossil fuels to renewable energy technologies was again on display at the Midwest energy fair.
Intel, FTC in settlement talks
News & Analysis  
6/22/2010   2 comments
The U.S. Federal Trade Commission (FTC) and Intel Corp. have filed a joint motion to ''suspend administrative trial proceedings.''
Tilera, Quanta roll low power server
News & Analysis  
6/22/2010   3 comments
Multicore processor designer Tilera Corp. announced it plans to ship a 200-core device in 2013 and demonstrated a 512-core server made by partner Quanta Computer Inc. using Tilera's current 64-core chip.
Astronaut Glenn: Extend U.S. space shuttle flights
News & Analysis  
6/22/2010   5 comments
Pressure is growing to extend U.S. space shuttle flights beyond the planned mothballing of the orbiter fleet as early as the end of 2010.
Sensors integrate ColdFire processor, MEMS accelerometer
Product News  
6/22/2010   1 comment
Freescale Semiconductor new Xtrinsic family of smart MEMS sensors combine a 32-bit ColdFire microcontroller with on-chip algorithms for all the common operations like tap, touch, tilt and orientation, thereby streamlining designs and offloading the application processor, the company said.
Freescale ARM-based microcontroller
Product News  
6/22/2010   4 comments
Freescale Semiconductor introduced a new ARM-based microcontroller family, Kinetis, expanding its push into consumer and industrial markets with a 32-bit reduced instruction set computer architecture licensed from ARM Holdings.
Class-D amps with AGC, DRC advance portable audio
Product News  
6/22/2010   Post a comment
Two Class-D amplifiers from Texas Instruments featuring automatic gain control and programmable dynamic range compression allow designers to compress the dynamic range of the audio to match the dynamic range of the speaker in portable applications.
Buffers boost penetration depth, sensitivity of medical ultrasound probes
Product News  
6/22/2010   Post a comment
Maxim has unveiled a pair of octal buffers designed to improve SNR in PZT- and CMUT-based probes.
Video filters support move to higher definition
Product News  
6/22/2010   Post a comment
Fairchild Semiconductor is offering designers video filter products that support the move to higher video definition, mobile video and new output requirements, while optimizing system power consumption.
Freescale's 64-bit Power core
News & Analysis  
6/22/2010   2 comments
Freescale Semiconductor has designed its first 64-bit Power core and two integrated communications processors using it, likely outrunning Mips-based competitors such as Cavium and NetLogic, but still slightly behind in raw performance Intel's Xeon which is gaining market momentum.
Motorola Droid Design
News & Analysis  
6/22/2010   Post a comment
The smartphone is the platform for embedded computing and the PC is no longer the center of gravity. Designing the Droid helped Motorola address this shift in the marketplace.
Cyclone provides single-chip solution for HD surveillance cameras
Product News  
6/22/2010   Post a comment
A high-definition (HD), surveillance internet protocol (IP) camera reference design on a single FPGA has been developed by Altera Inc. and features Cyclone III or Cyclone IV FPGAs and intellectual property from Eyelytics and Apical.
SmartFusion tool eases power management design
Product News  
6/22/2010   Post a comment
Actel Corp. has added a power management design kit for its SmartFusion intelligent mixed signal FPGAs which includes a complete reference design with graphical configurator to enter power sequencing and trimming requirements.
IP Cores adds high-speed lossless compression core
Product News  
6/22/2010   Post a comment
IP Cores Inc. (Palo Alto, Calif.) has shipped another version of its high-speed lossless data compression IP core.
<<   <   Page 2 / 9   >   >>


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