Enecsys' single, duo micro-inverters obtain UL 1741 certification Product News 7/12/2011 Post a comment Solar photovoltaic micro-inverter manufacturer Enecsys Ltd. (Cambridge, UK) announced it has obtained the UL 1741 certification for the SMI-S240W-60 and SMI-S240W-72, 240 Watt, single micro-inverters for 60 cell and 72 cell solar modules, and for the SMI-D360W-72, a 360 Watt Duo product for 72 cell solar modules.
Samsung Foundry tapes out 20-nm ARM test chip News & Analysis 7/12/2011 9 comments Samsung Electronics Co. Ltd. has said that is foundry chip making business has taped out an ARM processor test-chip intended for manufacture in a 20-nm process with high-K metal-gate technology.
Globalfoundries engages startup for R&D News & Analysis 7/12/2011 Post a comment Globalfoundries will collaborate with startup Intermolecular on semiconductor process technology R&D under the terms of a multi-year collaborative development program and IP licensing agreement.
Globalfoundries says New York wafer fab is ready for kit News & Analysis 7/12/2011 5 comments Globalfoundries Inc., the foundry that is majority owned by an Abu Dhabi sovereign wealth fund, has said that its newly constructed cleanroom in New York and a cleanroom extension in Dresden have both had the first chip making equipment installed.
Novellus misses Q2 estimates; bookings slip News & Analysis 7/11/2011 Post a comment Chip gear vendor Novellus Systems reported second quarter sales that came in slightly short of consensus analysts' expectations as the firm warned that bookings declined nearly 25 percent during the quarter.
ATMI CEO named chair of SEMI News & Analysis 7/11/2011 Post a comment Doug Neugold, chairman, president and CEO of process technology and materials developer ATMI, was named chairman of the board of directors of the fab tool trade group SEMI, effective later this week.
Synopsys tips 65-nm PDKs for Globalfoundries News & Analysis 7/11/2011 Post a comment EDA and IP vendor Synopsys collaborated with Globalfoundries to develop, validate, support and distribute interoperable process design kits for Globalfoundries' mainstream and advanced process technologies.
Advantest announces NAND flash test solutions Product News 7/11/2011 Post a comment Advantest Corporation announced the availability of two new solutions for next-generation NAND flash memory test: the T5773 for package test and the HA5100CELL, based on the Harmonic architecture, for wafer test.
IMEC exposes wafers on preproduction EUV tool News & Analysis 7/11/2011 5 comments Research institute IMEC (Leuven, Belgium) has said it has exposed its first wafers on the NXE:3100 extreme ultraviolet lithography preproduction tool from ASML Holding NV installed at IMEC's pilot fab.
Japan hit by magnitude 7.0 aftershock News & Analysis 7/11/2011 4 comments Northeastern Japan suffered an earthquake of magnitude 7.0 on Sunday morning. It gave rise to tsunami warnings, subsequently withdrawn, and is described as an aftershock to 9.0 earthquake of March 11, 2011 that devastated the region.
WSTS: Chip market now shrinking year-on-year News & Analysis 7/11/2011 1 comment Thanks to modifications made to April's actual chip market figures by WSTS, May becomes the second month on the bounce in which the global chip market has been smaller than it was in the same month in the year before.
Freescale processors gain on-chip e-reader News & Analysis 7/11/2011 3 comments Freescale's i.MX family of application processors expanded its support of E-Ink by incorporating e-reader drivers into lower-end processors for applications ranging from signage to home/office automation.
Atmel samples SAM3S16 ARM-based MCU with 1MB embedded Flash Product News 7/11/2011 Post a comment Atmel Corporation is sampling its SAM3S16 Cortex-M3 MCU, a 32-bit ARM Cortex -M3-based microcontroller with 1MB embedded Flash and 128KB SRAM. The new MCU's high performance, low power and large memory density suit it for user interfaces requiring capacitive touch, increased data processing, and connectivity.
Broadcom ships FCoE card, finally News & Analysis 7/11/2011 2 comments Broadcom finally entered the market for 10 Gbit/s Fibre Channel over Ethernet, announcing an adapter card using its BCM57712 passed certification testing.
TI unveils sub-1GHz RF at sub-$1 Product News 7/10/2011 Post a comment A two-chip bundle costing less than $1.00 is aimed at enabling long-range wireless connectivity for cost-sensitive, low-power applications such as toys, security systems and more.
Sicily 'fab' PV plant is its own first customer News & Analysis 7/8/2011 2 comments A building in Catania, Sicily, that was originally constructed by STMicroelectronics to be a 300-mm wafer fab, has been inaugurated as a manufacturing site for photovoltaic panels. And the plant is going to be its own first customer with plans to site a 1-megawatt solar energy farm on the roof of the building that was formerly known as M6.
TSMC posts weak June, Q2 sales figures News & Analysis 7/8/2011 3 comments Net sales in June 2011 for foundry Taiwan Semiconductor Manufacturing Co. Ltd. were down on a sequential basis, running against historic trends for the month, which helped produce a weak second quarter net sales figure, although this had been forecast.
MIT, France create joint lab for energy research News & Analysis 7/8/2011 Post a comment At a France-MIT Forum on energy this week in Paris, the Massachusetts Institute of Technology (MIT) and France's national scientific research center signed a memorandum of understanding for the creation of a joint international laboratory on multi-scale materials science for energy and the environment.
Researchers bring contactless power transmission to public transport News & Analysis 7/8/2011 7 comments Electric mobility drives research on inductive power transmission: The Karlsruhe Institute of Technology (KIT) has launched a project that aims at inductive power transmission. The approach of the KIT researchers opens interesting perspectives - it even could be applied during the ride.
ITT cannon KJAYA series Product News 7/7/2011 Post a comment ITT's MIL-DTL 38999 Series III style connector for low-pressure applications uses lightweight aluminum shells that provide a sealed, watertight and airtight solution for pressures up to 15psi.
ARM invests in smart grid startup News & Analysis 7/7/2011 4 comments Processor intellectual property licensor ARM Holdings plc and Moonray Investors have participated in a $7 million Series A round of funding in digital power control startup Amantys Ltd.
Tower sells stake in Chinese foundry News & Analysis 7/7/2011 5 comments Tower Semiconductor Ltd., a Israel-based specialist foundry chipmaker that trades as TowerJazz, has announced it has agreed to sell its 10 percent stake in Hua Hong Semiconductor Ltd. (HHSL) for $32 million in cash.
Tessera warns of sales shortfall News & Analysis 7/7/2011 4 comments Tessera Technologies warned that sales for the second quarter fell short of its previously issued sales target due to lower than expected shipments of DRAM units by customers in the first quarter.