Tessera warns of sales shortfall News & Analysis 7/7/2011 4 comments Tessera Technologies warned that sales for the second quarter fell short of its previously issued sales target due to lower than expected shipments of DRAM units by customers in the first quarter.
Baolab creates ultra-low cost 3D digital MEMS compasses in CMOS Product News 7/6/2011 2 comments The BLBC3-D NanoCompass from Baolab Microsystems is the first product that will be made using the company's NanoEMS technology, which enables nanoscale MEMS (Micro Electro Mechanical Systems) to be built using standard high-volume CMOS lines and to be fully integrated monolithically with the analogue and digital electronics.
Valens Semi snags $14 million in funding News & Analysis 7/6/2011 6 comments Israel's Valens Semiconductor, inventor of the HDBaseT connectivity technology for transmitting high-definition content, said it closed $14 million in a second round of funding from a group of investment firms.
HTC to buy graphics chip firm S3 News & Analysis 7/6/2011 12 comments Taiwanese handset vendor HTC agreed to purchase graphics chip vendor S3 Graphics for $300 million from microprocessor vendor VIA Technologies and private investment firm WTI Investment International.
EU project cuts cost of safety-critical embedded systems News & Analysis 7/6/2011 Post a comment The EU-funded INTERESTED (INTERoperable Embedded Systems Tool chain for Enhanced rapid Design, prototyping and code generation) project has achieved its goals in terms of reducing the cost and improving the quality and time-to-market of safety-critical embedded systems in Europe.
Tektronix buys validation tool vendor News & Analysis 7/5/2011 3 comments Test and measurement vendor Tektronix announced the acquisition of ASIC/FPGA prototyping debug software provider Veridae Systems. Terms of the acquisition were not disclosed.
TI, Wi-LAN reach settlement News & Analysis 7/5/2011 6 comments Texas Instruments reached an agreement with Canadian technology licensing firm Wi-LAN to end all litigation between the firms over Bluetooth.
SIA sees mediocre semiconductor sales ahead News & Analysis 7/5/2011 1 comment The Semiconductor Industry Association reported worldwide sales of semiconductors were $25 billion for the month of May, a 1.8 percent increase from the prior month when sales were $24.6 billion and a 1.3 percent growth from May 2010.
Baolab MEMS-in-CMOS heads for the compass market News & Analysis 7/4/2011 2 comments Baolab Microsystems SL (Barcelona, Spain) a startup pioneering the creation of microelectromechancial systems (MEMS) within the back-end-of-line structure of CMOS wafers, has completed its first product design, a magnetic compass sensor.
SIA releases Q1 SICAS fab capacity report News & Analysis 7/4/2011 Post a comment The Semiconductor Industry Association has released wafer manufacturing capacity statistics for the first quarter of 2011 that show that utilization in most areas has remained above 90 percent and that for the total semiconductor industry it averaged 93.7 percent.
MEMC, Suntech terminate wafer supply deal News & Analysis 7/1/2011 3 comments Solar panel provider Suntech Power agreed to pay silicon wafer supplier MEMC Electronic Materials $120 million to terminate a long-term wafer supply agreement between the two companies, MEMC said.
Global wafer fab statistics still missing News & Analysis 7/1/2011 7 comments Global chip manufacturing capacity statistics for the first quarter of 2011 have failed to appear on an industry body website despite an assurance from the Semiconductor Industry Association that they would be posted in June.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.