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Anadigics enters new wireless net arena, invests in Embedded Wireless
News & Analysis  
8/30/2000   Post a comment
Warren, N.J. -- Anadigics Inc. here entered the emerging personal area networking market, announcing that it has made an undisclosed equity investment in Embedded Wireless Devices Inc. of Pleasanton, Calif. Anadigics and Embedded Wireless plan to co-develop a range of chips, based on several new-but-incompatible 2.4-GHz wireless standards, such as Bluetooth, 802.11, and others.
High demand means 'open season' for designers
News & Analysis  
8/30/2000   Post a comment
High demand has bumped salaries up handsomely for design engineers. With five to 10 years of experience, one can easily command $80,000 in most parts of the country, and well more in hotbeds like Silicon Valley, Austin and Boston.
MasterCard leads coalition to spur U.S. smart card use
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8/30/2000   Post a comment
U.S. bank-issued smart cards for mobile/e-commerce applications are one step closer to reality thanks to an initiative by MasterCard International (Purchase, N.Y.).
Varian Semiconductor Equipment gears up production in Korea
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8/30/2000   Post a comment
GLOUCESTER, Mass.-- A year and a half after spinning off as an independent company, Varian Semiconductor Equipment Associates Inc. today announced a new initiative to rebuild its manufacturing presence in Korea.
TSMC foundry capacity sold out for 2000 and 2001
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8/30/2000   Post a comment
Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) disclosed Tuesday (Aug. 29) that it is already sold out of its worldwide wafer-foundry capacity for both 2000 and 2001, and expects demand to remain robust at least until 2003.
Venture with Toshiba gives Amkor foothold in Japan
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8/30/2000   Post a comment
Test and assembly company Amkor Technology Inc. has signed an agreement with Toshiba Corp. to establish a joint venture in Japan.
Tower and Alliance Semi Announce $75 Million Agreement
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8/30/2000   Post a comment
Migdal Haemek, Israel and Santa Clara, CA - August 30, 2000 - Tower Semiconductor Ltd. and Alliance Semiconductor Corp. announced today that they have entered into a definitive ...
Terawave details its passive optical network system
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8/30/2000   Post a comment
Terawave Communications Inc., a supplier of passive optical networking equipment, gave an expanded description of its ASICs at the National Fiber Optics Engineers Conference this week, and demonstrated a unified software suite called PON Navigator that integrates an element-management system and a planning tool for working with passive optical networks (PONs).
Corning increases efforts in glass for EUV lithography
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8/30/2000   Post a comment
CORNING, N.Y.--Corning Inc. today said it was increasing its emphasis on ultra-low expansion glass for next-generation lithography applications. The company believes its ULE glass substrate material will enable extreme ultraviolet (EUV) technology to become a viable replacement for optical lithography in wafer fabs.
Intel accuses Broadcom of building business on its patents
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8/30/2000   Post a comment
SANTA CLARA, Calif. -- Intel Corp. today expanded its legal assault against Broadcom Corp., charging the Irvine, Calif.-based company with patent infringement and misappropriation of trade secrets. The suit, filed in the U.S. District Court of Delaware, also alleges that Broadcom is involved in a "carefully crafted plan" to base its business around Intel's communications-chip technology.
Intel processor integrates North Bridge components
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8/30/2000   Post a comment
Intel Corp. is focusing its engineering skills on a highly integrated device that incorporates both a graphics engine and a Rambus memory controller into a single processor chip aimed at the low-cost PC segment.
Gel-Pak to acquire supplier of prototype plastic packages
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8/30/2000   Post a comment
SUNNYVALE, Calif.--Gel-Pak LCC today announced plans to acquire Silicon Packaging Technology Inc., a San Diego supplier of prototype plastic packages for integrated circuits. The acquired company will be renamed Quik-Pak and will continue to offer plastic packages for new IC designs that have the same mechanical and electrical performance as chips housed in production packages, Gel-Pak said.
Sony plans 300-mm-wafer fab
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8/30/2000   Post a comment
Compaq, Intel, Microsoft, and others develop new power management spec
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8/30/2000   Post a comment
SAN JOSE -- A group of 29 companies led by Compaq, Intel, Microsoft, Phoenix, and Toshiba here today banded together to publish a new power management specification for notebook PCs, desktops, and servers.
Optical pipes get thinner, smarter as demand rises
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8/30/2000   Post a comment
The era of the dumb, fat optical pipe is over, according to keynote speakers at the plenary sessions of the National Fiber Optic Engineers Conference this week.
China prepares timetable for HDTV rollout
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8/30/2000   Post a comment
China is drafting a timetable and standard for the rollout of digital TV as part of a five-year plan of the country's broadcast agency.
Sony to build 300-mm wafer fab for LCDs, CCDs
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8/30/2000   Post a comment
In another sign that Japanese electronics companies are loosening their purse strings for capital expenditures, Sony Corp. said it will spend about $943 million to build its first 300-mm wafer fabrication facility.
Alliance to invest $75M in planned Tower fab
News & Analysis  
8/30/2000   Post a comment
Alliance Semiconductor Corp. today announced it will invest $75 million in an 8-inch wafer fab that silicon foundry Tower Semiconductor Ltd. plans to build. Alliance (Santa Clara, Calif.) joins SanDisk Corp. as an investment partner in the fab, which will be Tower's second.
Alliance to invest $75 million in Tower's new foundry fab in Israel
News & Analysis  
8/30/2000   Post a comment
MIGDAL HAEMEK, Israel -- U.S. memory supplier Alliance Semiconductor Corp. today announced it will invest $75 million in a planned 8-inch wafer fab planned by silicon foundry supplier Tower Semiconductor Ltd. here. Alliance, based in Santa Clara, Calif., joins SanDisk Corp. in nearby Sunnyvale as investment partners in Tower's planned second fab. Tower expects to start construction on the long-planned fab this year after securing government funding.
Dense-Pac applies chip-stacking packaging to DSPs
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8/30/2000   Post a comment
GARDEN GROVE, Calif.--Dense-Pac Microsystems Inc. here today introduced a new three-dimensional chip packaging technology for digital signal processors--enabling up to four DSP chips to be stacked on top of each other in a single package.
AMD aims 32-Mbit simultaneous read/write flash at portable systems
News & Analysis  
8/30/2000   Post a comment
SUNNYVALE, Calif.--Advanced Micro Devices Inc. today launched a new 32-megabit flash memory chip, which combines low-voltage technology with a simultaneous read/write architecture for portable systems applications. The 1.8-volt flash is capable of read-access times as fast as 110 nanoseconds with up to 60% less power consumption, compared to 3-V devices, said AMD.
Lucent, Intel reveal Infiniband product plans
News & Analysis  
8/29/2000   Post a comment
With a final spec still being drawn, Intel and Lucent have unveiled product plans for the high-speed Infiniband I/O technology.
TSMC says it's sold out of foundry capacity for 2000 and 2001
News & Analysis  
8/29/2000   Post a comment
SANTA CLARA, Calif. -- During an industry meeting here, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) disclosed that the company is already sold out of its worldwide wafer-foundry capacity for both 2000 and 2001, with demand remaining robust at least until 2003.
inSilicon licenses Arm's system-on-chip peripherals
News & Analysis  
8/29/2000   Post a comment
SAN JOSE -- inSilicon Corp. today announced it has licensed Arm Ltd.'s MicroPack design kit and PrimeCell peripherals for use in system-on-chip (SoC) development. The San Jose company plans to offer Arm's peripheral functions in sub-licensing agreements with customers, who are designing SoC chips using inSilicon's communications intellectual property.
DSP Group taps Tality as SoC design center
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8/29/2000   Post a comment
DSP Group Inc. has approved Tality Corp., the electronic design services spin-off of Cadence Design Systems Inc., as a system-on-chip (SoC) design center for its customers.
'Odd Couple' blends freestyle with fixed arts
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8/29/2000   Post a comment
The designers who run engineering at Tachyon Inc. are an odd couple, but somehow their mismatched traits blend to the benefit of a company at the forefront of the communications revolution.
Calient shows 1,000-port all-optical switch
News & Analysis  
8/29/2000   Post a comment
While a number of companies have announced their intent to create all-optical switches, Calient Networks claims to be on the verge of producing such switches in 1,000 x 1,000-port sizes.
Emperative sets up test lab for open provisioning
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8/29/2000   Post a comment
Emperative Inc., a developer of service-provisioning software based on an open Java state machine architecture, is opening a broadband-provisioning lab in Boulder, Colo. next month.
Xilinx Joins Wind River's Windlink Program
News & Analysis  
8/29/2000   Post a comment
San Jose, CA - August 28, 2000--Xilinx, Inc. announced that it will become a partner in the Wind RiverWindlink Partners program, bringing together Real Time OperatingSystem ...
Capacity glut could lead to industry slowdown, forecast says
News & Analysis  
8/29/2000   Post a comment
Semiconductor revenue growth will continue strong for a couple of years, but unprecedented spending on new wafer-processing capacity will most likely cause a dramatic slowdown in late 2002, if not sooner, said chip analyst Grant Johnson of Cahners In-Stat Group.
A/D mezzanine module flies for Heron DSP system
Product News  
8/29/2000   Post a comment
Strategic partners Traquair Data Systems, Inc. and Hunt Engineering (UK) Ltd. are fielding a 2.5-MHz analog-to-digital mezzanine module for the Heron multiprocessing DSP systems.
Philips aims analog frontend ICs at range of CCD camera segments
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8/29/2000   Post a comment
EINDHOVEN, the Netherlands -- Philips Semiconductors today announced a new family of analog frontend (AFE) chips that provide 10- and 12-bit resolution for digital still cameras and camcorders. The new integrated analog chips are aimed at a range of professional and consumer camera market segments, supporting charge-couple device (CCD) applications with speeds of 18-to-40 million samples per second (MSPS).
PC/104 CPU board touts data acquisition features
Product News  
8/29/2000   Post a comment
The SOB-104 computer board from Diamond Systems Corp. offers 10 Base T Ethernet along with comprehensive analog and digital I/O circuitry for embedded applications.
Frame grabber board takes digital input
Product News  
8/29/2000   Post a comment
Imagenation Corp. has introduced a digital frame grabber for the PCI bus that enables the use of digital cameras in vision systems.
Quatech rolls out wireless data acquisition system
Product News  
8/29/2000   Post a comment
At the recent ISA 2000 conference, Quatech Inc. introduced what it's billing as "a reliable, easily-configured, low-cost wireless data acquisition solution for industrial monitoring and control applications."
PC processor upgrades extend life of equipment
Product News  
8/29/2000   Post a comment
Evergreen Technologies Inc. has extended its family of processor upgrades for PCs based on older Pentium II, Celeron and Pentium Pro processors.
Optical transceivers take small format
Product News  
8/29/2000   Post a comment
Stratos Lightwave LLC has introduced a family of optical transceiver modules for ATM OC-48 applications in metropolitan and wide-area networking.
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