Northern adds Binder portfolio News & Analysis 8/30/2002 Post a comment St Helen's-based Northern Connectors has been appointed a stocking distributor for the Binder range of connectors by UK representative Quiller Electronics.
Recovery delays make Micronic lower 2002 guidance News & Analysis 8/30/2002 Post a comment TABY, Sweden -- Micronic Laser Systems AB, a maker of laser pattern generators used for photolithography masks and in the display industry, has reduced its sales forecast for 2002 so that it will be about the same as 2001, about $75 million.
An earlier forecast from the Swedish company was based on an expected recovery within the semiconductor industry. Recent market research indicates that this recovery has been further delayed, which will affect the technology investments for photo-masks, the
Formats face off for next-gen optical disks Product News 8/29/2002 Post a comment The next-generation optical-disk system may split into two formats. NEC Corp. and Toshiba Corp. on Thursday (Aug. 29) jointly proposed to the DVD Forum a format that uses a 405-nanometer blue-violet laser, but is based on a disk with a 0.6-mm substrate, the same as in today's DVDs. The proposal stands in sharp opposition to the Blu-ray Disc format being promulgated by nine DVD Forum member companies.
Panel asks U.S. to double engineering R&D funds News & Analysis 8/29/2002 Post a comment A federal advisory panel will recommend next week that the Bush administration double federal funding over the next several years to support basic research in the physical sciences and engineering, including electrical engineering.
TSMC takes another step toward China News & Analysis 8/29/2002 Post a comment TSMC has signed a memorandum of understanding (MOU) to build wafer fabs in China, paving the way for Taiwan's foundries to enter the thriving Chinese market from which they had until recently been barred.
X-Fab outlines bold RF foundry expansion plans News & Analysis 8/29/2002 Post a comment SAN JOSE -- Bucking the trend in the semiconductor industry, Germany's X-Fab Semiconductor Foundries AG here this week outlined its fab expansion plans that could double the company's capacity and sales.
X-Fab--which specializes in providing mixed-signal and radio-frequency (RF) foundry services--plans to expand its newly-acquired 6/8-inch, 0.35-micron fab in the United Kingdom, and is also considering a plan to build a new plant near its headquarters in
Antitrust scrutiny takes an uptick News & Analysis 8/29/2002 Post a comment Antitrust authorities in the United States are stepping up their scrutiny of high-technology mergers and business practices. As the recent Federal Trade Commission decision on the merger of EDA vendors Synopsys Inc. and Avanti Corp. shows, the high-tech industry is being closely watched as a new round of consolidation begins.
China's homegrown 3G spec alive but delayed News & Analysis 8/29/2002 Post a comment A senior executive of Siemens AG says that China's 3G standard won't go beyond trials this year, but contradicted recent reports out of China that the government's support is waning for the Chinese-developed technology, known as time-division synchronous code-division multiple access, or TD-SCDMA.
Trikon axes 20% of workforce, cuts pay for employees News & Analysis 8/29/2002 Post a comment NEWPORT, Wales, U.K. -- Hit hard by the IC downturn, Trikon Technologies Inc. here today announced plans to reduce its worldwide headcount by 20%, or 400 employees.
The U.K. chip-equipment maker has also initiated what it calls a "payroll reduction program" that is projected to reduce its quarterly operating expenses by approximately $4 million in a full year.
Advanced fab gear from U.S. heading to China News & Analysis 8/29/2002 Post a comment SAN JOSE -- U.S. export control laws for fab tool shipments into China remains a cloudy issue, but sources believe that Washington has relaxed its regulations--at least to some degree.
Sources indicated that the U.S. government has begun granting "special" licenses to select U.S. chip-equipment makers. This license enables a vendor to ship tools into China, which can reportedly process 0.18-micron chips, according to sources.
Sharp seeks LCD TV edge with seventh-generation fab News & Analysis 8/29/2002 Post a comment Sharp Corp., a leading provider of LCD TVs, expects to increase its share of the world market by leveraging the output of a so-called seventh-generation fabrication facility in Kameyama, Japan, which will being operation in May 2004.
Japan's tool orders up, but book-to-bill down News & Analysis 8/29/2002 Post a comment TOKYO -- According to a report from Dow Jones here today, worldwide orders for Japanese-made semiconductor equipment grew for the fifth straight month in July, rising 42.5% to Y77.43 billion, based on new figures from the Semiconductor Equipment Association of Japan.
But the book-to-bill ratio for Japanese equipment dropped to 1.61 in July, from a revised 1.92 in June, according to the report. A book-to-bill of 1.61 means that Y161 of new orders were received for every Y100 of products
Nominate an environment innovator News & Analysis 8/29/2002 Post a comment The Royal Academy of Engineering is seeking nominations for its Sir Frank Whittle Medal. The award for 2003 will go to a UK engineer who, in the judges' eyes, has made an exceptional and sustained contribution to innovations that have been beneficial to the environment.
Shipley buys assets of fiber-optic component maker News & Analysis 8/29/2002 Post a comment MARLBOROUGH, Mass. -- Shipley Co. LLC here today said it will acquire the assets of Haleos Inc., a Blacksburg, Virginia-based supplier of fiber-optic components, for $3.1 million.
Shipley was the successful bidder for Haleos' assets in a bankruptcy court hearing yesterday, said David Schram,
President of Shipley's Electronic and Industrial Finishing (EIF) group. Marlborough-based Shipley is a subsidiary of Rohm and Haas Co.
W.L. Core to sell fiber-optic components business News & Analysis 8/29/2002 Post a comment ELKTON, Md. -- W. L. Gore & Associates Inc. here today announced its decision to sell its fiber optic business, in an effort to focus on its fast-growing electrical interconnects products.
"We are refocusing Gore's electronic components business on high-performance electrical interconnects and materials, our core technology," said Russell Shaller, general manager of Gore Photonics, in a statement.
Loddo steps down as CEO of Malaysian foundry News & Analysis 8/29/2002 Post a comment KUCHING, Sarawak, Malaysia -- Claudio Loddo has stepped down as chief executive officer of 1st Silicon (Malaysia) Sdn. Bhd., a Malaysian wafer foundry.
A statement issued by the company simply said that Loddo had completed his contract with the company.
PCB sales looking up News & Analysis 8/29/2002 Post a comment Global sales of PCBs improved in July after two stalled months and an eight-month low in April. According to figures from Illinois-based trade association IPC, the PCB book to bill ratio rose to 0.99 last month, up from 0.96 in May and June and 0.94 in April.
U-Nav draws down $10 million for GPS location chips News & Analysis 8/29/2002 Post a comment IRVINE, Calif. -- U-Nav Microelectronics Corp., a developer of global positioning by satellite (GPS) chips which has its origins in Finland, has received $10 million in its second round of financing.
U-Nav is a spin-off from VLSI Solution Oy, based in Finland, where research on GPS and location technologies were conducted for eight years prior to the formation of u-Nav in 2001.
Leakage, EMI specs set medical supplies apart News & Analysis 8/29/2002 Post a comment Power supplies for medical applications emphasize maximum safety for both patient-contact and -noncontact applications while lowering radiated emissions to minimize medical-system malfunction in polluted electromagnetic environments.
802.11b chip sets tap DSP News & Analysis 8/29/2002 Post a comment An 802.11b wireless LAN solution from Marvell consists of the Libertas 88W8300 baseband/ MAC processor or the Libertas 88W8500 single-chip access point and Libertas 88W8000 RF transceiver chip for two-chip client and access point applications, respectively.
Illumination sensor ICs conserve power News & Analysis 8/29/2002 Post a comment The TPS850 and TPS851 photo illumination sensor ICs from Toshiba America Electronic Components Inc. a`re designed to help reduce power consumption and increase battery life in mobile phones, PDAs, digital cameras and other portable products.
Opto chip set hits 10 Gbits/s News & Analysis 8/29/2002 Post a comment OEpic Inc. has a 10-Gbit/second front-end optoelectronic receiver chip set (PT1030-TO) for 1,310-nm intermediate and long-haul 10-Gbit Ethernet and Fibre Channel applications in local-, metro- and storage-area networks.
CDMA receiver fits in 3 mm2 News & Analysis 8/29/2002 Post a comment The RF2870 single-band, front-end receiver from RF Micro Devices Inc., manufactured in silicon germanium and available in a 3-mm2 leadless plastic package, integrates a transmit local-oscillator buffer amplifier to cut component count in code-division multiple-access (CDMA) cell phone applications.
Zilog processor packs TCP/IP, IrDA Product News 8/29/2002 Post a comment Webserver-i (eZ80-L92), the second product in Zilog Inc.'s eZ80 microprocessor series, features TCP/IP and IrDA software for applications that can be managed remotely from an Internet browser on a handheld device, cell phone or PC.
Voice echo cancellers offer high density, low power News & Analysis 8/29/2002 Post a comment Zarlink Semiconductor has introduced 288- and 256-channel voice echo cancellation (VEC) ICs for use in voice-over-Internet Protocol (VoIP) gateways; voice-over-frame-relay (VoFR), voice-over-ATM (VoA) and VoDSL access equipment; T1/E1 echo cancellation pools; and wireless basestations.
GSM/GPRS transceiver chip set eliminates oscillator-module bulk News & Analysis 8/29/2002 Post a comment Silicon Laboratories Inc. has introduced a CMOS transceiver, the Aero+, that integrates a digitally controlled crystal oscillator (DCXO) and enables the use of low-cost crystal resonators in lieu of costly, bulky voltage-controlled temperature-compensated crystal oscillator (VC-TCXO) modules in multiband GSM digital cellular handsets and in GPRS voice and data terminals.
Connectors fit 10/100/1,000 Base-TX News & Analysis 8/29/2002 Post a comment Pulse says that its PulseJack Gigjack T12 integrated-magnetics connector module (ICM) platform offers high electromagnetic-interference suppression and a savings in board space for 10/100/1,000 Base-TX applications.
Cambridge Display to work with Hong Kong's GDesign News & Analysis 8/29/2002 Post a comment CAMBRIDGE, England --- Cambridge Display Technology Ltd. (CDT) has made an agreement with GDesign Technology, a fabless chip design house in Hong Kong, to transfer light emitting polymer (LEP) device circuit models and relevant know-how, and help GDesign develop drivers for LEP displays.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.