Single RF Chip Combines 802.11a with b News & Analysis 8/1/2002 Post a comment The EN303 is a single-chip RF front end that integrates the radio functions for both IEEE 802.11a and 802.11b wireless LANs and complies with the current components of the 802.11g draft standard.
Processor terminates disparate networks News & Analysis 8/1/2002 Post a comment Engineered for OC-12 applications such as add/drop multiplexer, access switches, digital loop carriers and MTUs, the POP-12 path overhead processor integrates VC-3/VC-4 path overhead processing, AU-3/AU-4 pointer processing and retiming, and AU-3/AU-4 cross-connects.
80-Msample/s A/D has 75-dB spurious-free range News & Analysis 8/1/2002 Post a comment Engineered for 2.5- and third-generation wireless basestation designs, the ADS5410 12-bit, 80-Msample/second analog-to-digital converter delivers a 75-dB spurious-free dynamic range at 100 MHz and maintains input signal integrity beyond 200 MHz IF.
What's in a Signature? News & Analysis 8/1/2002 Post a comment A couple of fairly important things happened in recent weeks, almost in parallel. First, WorldCom's woes came to a spectacular head befitting its meteoric rise through the '90s. Second, I rewrote the signature at the bottom of this column.
Class action suit brought against HPL News & Analysis 8/1/2002 Post a comment NEW YORK -- The law firm of Wechsler Harwood Halebian & Feffer LLP, has started a "class action" in the U.S. district court for the Northern District of California on behalf of purchasers of HPL Technologies Inc. securities between July 31, 2001 and July 18, 2002. The action has been brought, against design for manufacture design-services and tools company HPL and certain of its officers.
Tvia acts to reduce costs News & Analysis 8/1/2002 Post a comment SANTA CLARA, Calif. -- Tvia Inc., a developer of semiconductor and software products to present multiple media streams on one or more displays, has decided to implement a "reduction-in-force" of about 15% China and 25% in the U.S. Numbers of staff effected were not given out.
Memscap sales down in transition News & Analysis 8/1/2002 Post a comment GRENOBLE, France -- Sales at Memscap SA, the micro-electromechanical systems developer and manufacturer, in the first half of 2002 more than halved compared with the half-year a year previously. The company is bringing up its first major wafer fab at nearby Bernin and said it expects the second half of 2002 to improve but for the company to remain loss-making.
JDS sells Cronos to French MEMS maker News & Analysis 8/1/2002 Post a comment GRENOBLE, France -- Memscap SA, one of the pioneers of the micro-electromechanical systems (MEMS), has agreed to buy the Cronos business unit from JDS Uniphase Inc. As part of the agreement, JDS Uniphase is committing buy MEMS products exclusively from Memscap for at least three years following the close of the deal.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.