TV dynamics to drive STB sales News & Analysis 8/25/2009 Post a comment According to market researcher iSuppli, vendors for set top boxes (STBs) are heading for a bright future. Paradigm shift in TV reception will drive STB sales and trigger solid growth for the industry.
Daetwyler Cables sees no recovery News & Analysis 8/25/2009 Post a comment In contrast to other companies active in the field of industrial electronics, parts and equipment, Swiss technology group Daetwyler Holding AG has no upturn on its radar. The company thus announced to continue its cost control tactic.
Market researcher: Bosch bought Akustica for its MEMS integration approach News & Analysis 8/24/2009 Post a comment When recently automotive electronics giant Bosch toke over tiny MEMS microphone company Akustica, the reason was the latter one's expertise in integrating MEMS on standard chips, presumes market researcher The Information Network. The move is not intended to help Bosch to enter the electro-acoustic devices market, but strengthen its leading position in the automotive MEMS scene.
Comment: Intel's counsel of complacency on energy efficiency News & Analysis 8/24/2009 Post a comment Intel and Microsoft funded a Stanford University professor, to produce a series of research papers that assess the energy and environmental impacts of information technology. Peter Clarke argues that many of the benefits that have been quantified in this research are already factored in to our apprecation and that more needs to be done than we are inheriting from Moore's Law.
PerkinElmer licenses silicon photomultiplier technology News & Analysis 8/24/2009 Post a comment Medical technology provider PerkinElmer has taken a license to use the solid-sate photomultiplier technology developed the Max Planck Institute for Physics in Munich. The technology can be used to improve nuclear diagnostic processes and design highly sensitive laboratory equipment.
Silicon circuit board seeks to replace ASICs News & Analysis 8/24/2009 Post a comment You may be able to kiss that printed-circuit board good-bye soon, instead mounting bare die on a wafer-scale silicon circuit board that essentially eliminates the power-hungry soldered interconnections between packages.
PTC Heater does away with complex cabling Product News 8/24/2009 Post a comment Eberspaecher catem GmbH (Esslingen, Germany) will introduce an optimized PTC heater for electric supplementary heating systems at the IAA trade fair in September. The device does it without external relay control box and the associated cabling.
Bosch verlängert Kurzarbeit News & Analysis 8/24/2009 Post a comment Der Autozulieferer Bosch ist noch nicht aus der Krise: Das Unternehmen hat beantragt, die Kurzarbeit für sein Werk Feuerbach zu verlängern. Die Maßnahme zeigt, dass nicht die gesamte Autoindustrie von der Abwrackprämie profitiert hat.
Solarflare integrates 10GBase-T on a single chip News & Analysis 8/24/2009 Post a comment Solarflare Communications debuts two chips that mark a significant milestone on the road to the long delayed transition to 10 Gbit/second Ethernet, but the industry still faces a host of challenges eking out mainstream markets for 10 Gbit Ethernet over copper.
TSMC makes SRAMs in three 28-nm processes News & Analysis 8/24/2009 Post a comment Foundry chipmaker Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan) has claimed it has achieved a functionally yielding 64-Mbit SRAMs across all three versions of its upcoming 28-nm manufacturing process technology. These are 28-LP, with an oxynitride dielectric, and 28-HP and 28-HLP which both uses a high-K metal gate process.
Researchers report progress on parallel path News & Analysis 8/24/2009 4 comments At Hot Chips, labs from Berkeley, Stanford and Illinois will deliver what amounts to their first report cards on their efforts to beat a path to programming tomorrow's many-core microprocessors, a task many have characterized as the most ambitious in the history of computer science.
IBM's Power7 heats up server competition at Hot Chips News & Analysis 8/24/2009 Post a comment IBM Corp. may walk away from this week's Hot Chips conference with bragging rights to having the most muscular microprocessor with its Power7, an eight-core, 45nm chip expected to set new watermarks in parallelism and cache that could translate into leading-edge performance for servers using it.
Good project management keeps remote MindTree, TI teams in sync News & Analysis 8/24/2009 1 comment India-based MindTree was heavily involved in software development for TI's wireless solutions involving OMAP and mobile connectivity. Keeping the project in line depended as much on good technical expertise as it did upon good trans-global, cross-cultural project-management skills.
C-to-FPGA compiler supports Virtex-6, Spartan-6 Product News 8/24/2009 Post a comment The CoDeveloper C-to-FPGA compiler from Impulse Accelerated Technologies has been updated to support the latest devices and software from Xilinx, including the Virtex-6 and Spartan-6 FPGAs and Version 11.2 of Xilinx ISE design suite, Impulse said.
Intel-sponsored research says Moore's Law makes IT green News & Analysis 8/21/2009 1 comment Downloading music can be twice as eco-friendly as buying the CD in a store and the information technology industry is halving the consumption of energy per computation every 1.6 years, according to research sponsored by Intel and Microsoft.
Daimler plans volume production for e-Smart News & Analysis 8/21/2009 Post a comment Daimler plans to sell an electric version of its Smart sub-compact by 2012. The production of second generation e-smart will start as early as November 2009 albeit for the nonce only for selected users.
BP Solar under fire after PV installation blaze News & Analysis 8/21/2009 1 comment Solar power plants on building roofs are not only a source of energy and income for the operators. They also can catch fire. In the case of a photovoltaics installation in Bürrstadt (Germany), the operator made this experience. Now he battles for the reason of the fire with solar cell manufacturer BP Solar.
Mentor tops expectations News & Analysis 8/20/2009 Post a comment EDA vendor Mentor Graphics reported revenue of $182.6 million for the quarter ended July 31, besting consensus analyst expectations by a wide margin.
Verigy sales jump, posts loss News & Analysis 8/20/2009 Post a comment ATE vendor Verigy Ltd. said revenue for the third quarter was $87 million, an increase of 23 percent from the prior quarter, and a decrease of 51 percent from the prior year period.
EU backs LTE Advanced research projects News & Analysis 8/20/2009 Post a comment Communications industry executives have welcomed the EU's commitment to fund research work on LTE Advanced , the follow-on technology from LTE that many mobile network operators have only just started embracing, but also cautioned on the timescales involved in deploying the next generation technology.
Industrial-grade 30-V MOSFETs offer low gate charge solution Product News 8/20/2009 Post a comment International Rectifier has introduced a series of industrial-qualified 30 V TO-220 HEXFET power MOSFETs with low gate charge (Qg) for applications including Uninterruptable Power Supply (UPS) inverters, low voltage power tools, ORing applications and netcom and server power supplies.
Nissan connects navigation system and accelerator pedal Product News 8/20/2009 1 comment A driver assistance systems implemented in the latest Nissan vehicles feeds forward navigation data into the accelerator pedal: If a vehicle approaches a curve with excessive speed, the system sends a haptic signal to the pedal, urging the driver reduce speed.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.