IQE agrees to pay Rockwell over MOCVD lawsuit News & Analysis 9/30/2002 Post a comment CARDIFF, Wales -- IQE plc, a supplier of wafers to chip makers, and Rockwell Automation Inc. have settled their disputes relating to metal-organic chemical vapor deposition (MOCVD) process patents held by Rockwell Automation, which were part of a licensing agreement between the companies, from October 1991 to January 2000, IQE has said. The settlement agreement includes a cash payment by Cardiff-based IQE and the issue of 300,000 shares of IQE shares to Rockwell Automation.
Intel draws the threads of parallelism for chips News & Analysis 9/30/2002 Post a comment Intel is looking to make its processor designs more modular. This will prevent them from drawing
too much power when running on
batteries, without resorting to brute-force power-saving methods such as voltage or clock speed scaling.
Xenpak successors in search for truce News & Analysis 9/30/2002 Post a comment Companies backing the competing Xpak and X2 optical module formats for 10Gbit/s networking are looking for a truce to simplify the process of deciding which standard will succeed Xenpak.
European Commission clears StarCore DSP joint venture News & Analysis 9/30/2002 Post a comment BRUSSELS, Belgium --- The European Commission, the administrative arm of the 15-nation Europrean Union, has given its permission for the formation of a proposed joint venture company, StarCore LLC, between Agere, Infineon and Motorola. StarCore is being set up to develop and license digital signal processing architecture and cores on behalf of the three companies.
Chip sales continue to rise, strength is AsiaPac, says EECA News & Analysis 9/30/2002 Post a comment Semiconductor sales in August stood at $ 11.927 billion, a 14.2% increase above the same month a year ago and up 2.2% on a monthly sequential basis, according to the European Electronic Component Manufacturers Association (EECA) reporting figures from the World Semiconductor Trade Statistics (WSTS) organization. However, the year-to-date figure is still 7.5% below where it was at this time in 2001, EECA reports.
Pace presses on with its twin scart News & Analysis 9/30/2002 Post a comment Pace Micro Technologies has unveiled the latest addition to its range of digital terrestrial TV (DTT) set-top boxes. The £350 Twin Digital TV Recorder includes a 20Gbyte hard drive for personal video recorder (PVR) functions and two decoders with individual scart outputs.
Germany closes Neuer Markt News & Analysis 9/30/2002 Post a comment Germany's answer to Nasdaq, the Neuer Markt, is to be closed, and shares listed on it will move by the end of 2003 in a shakeup at the Frankfurt Stock Exchange.
Doubts grow over DTT's second chance News & Analysis 9/30/2002 Post a comment The future of UK digital terrestrial TV (DTT) is once again in disarray, according to industry insiders, as concerns mount that the platform's potential is being wasted and that its relaunch could be postponed.
Hifn cuts 25 jobs, lowers forecast in Q3 News & Analysis 9/27/2002 Post a comment Security-chip maker Hifn Inc. here today reduced its workforce by 25 jobs and lowered its forecast.
The company also said it acquired certain assets and intellectual property from an undisclosed private company with operations in Framingham, Mass. and Research Triangle Park, N.C. Hifn has retained that company's Storage Business Unit design team and established a Hifn East Coast Design Center in Framingham.
High-definition display uses white OLED, color filters News & Analysis 9/27/2002 Post a comment Eastman Kodak Co. and Sanyo Electric Co. Ltd. have developed an organic light emitting diode (OLED) display that employs a white organic electroluminescent material and color filters that may be applied to large, high-definition displays. Sanyo will demonstrate a 14.7-inch prototype of the display at the CEATEC Japan 2002 conference which begins Tuesday (Oct. 1) in Makuhari, Japan.
Tripath to cut workforce, lowers forecast News & Analysis 9/27/2002 Post a comment SANTA CLARA, Calif.--Chip maker Tripath Technology Inc. here today announced that it has reduced its workforce and lowered its forecast.
The company now expects revenues for the third quarter to be between $2.5-to-$3.0 million, down from its earlier estimate of $6.5 million.
OpenAccess API could link design, manufacturing News & Analysis 9/27/2002 Post a comment A powerful coalition of chip makers, mask makers, equipment providers and EDA vendors will gather in Monterey, Calif. on Monday (Sept. 30) to call for a single design-through-manufacturing data model based on the OpenAccess application programming interface.
Mysticom sets watermark for 10-Gbit Ethernet over copper News & Analysis 9/27/2002 Post a comment Mysticom Inc. demonstrated a transceiver that set a new watermark for high-end Ethernet signaling over copper wires at the Communications Design Conference this week, sending 10-Gbit/second signals over 25 meter copper using Infiniband cables, and over 10 meters using Category 5 unshielded twisted pair.
Kemet loses tantalum dispute with Cabot News & Analysis 9/27/2002 Post a comment Capacitor supplier Kemet Corp., Greenville, S.C., lost its court case against Cabot Corp., the Boston-based tantalum powder supplier who filed suit against Kemet in April for not honoring the terms of its long-term tantalum supply agreement negotiated several years ago during the component shortages.
AT&T exec says 3G nets cost less than 802.11 WLANs News & Analysis 9/27/2002 Post a comment Despite the industry slowdown and an unprecedented combination of new technologies, 3G cellular still holds great promise and will deliver wireless data more be a more cost-effectively than 802.11 wireless LANs, said Umesh Amin, director of new technologies and planning for AT&T Wireless, in a keynote speech at the Communications Design Conference here Wednesday (Sept. 25).
PACT, QuickLogic join forces on processor cores News & Analysis 9/27/2002 Post a comment The ability in software to instantly change a hardware configuration-from Bluetooth to Wi-Fi, for instance-came closer to being realized this week when PACT XPP Technologies Inc. and QuickLogic Corp. formally agreed to combine their technologies.
Passives vendors diversify to avert commodity status News & Analysis 9/27/2002 Post a comment
Fixed on capturing a larger share of key end markets and padding sagging profit margins, several passives suppliers are pouring more R&D dollars into developing integrated devices that some say will be priced too high to compete with discrete components.
Firms warned to brace for environmental fallout News & Analysis 9/27/2002 Post a comment As more green laws are enacted across the globe, environmental experts are urging supply chain and procurement managers to learn how legislation will affect their day-to-day and strategic responsibilities.
Besides the lead-free initiatives under way in Europe and Japan, legislative bodies in the United States and abroad are crafting regulations that deal with recycling, product take-back, design for the environment, and other hazardous-substance restrictions that in most cases will hold the OE
Russia's chip industry faces long climb News & Analysis 9/27/2002 Post a comment Despite its position as one the world's highest-growth regions in terms of gross domestic product, Russia has made scant headway in semiconductors, an analyst told the 10th annual SEMI ExpoCIS 2002.
Chip makers mull SOI for RF, other mainstream apps News & Analysis 9/27/2002 Post a comment Silicon-on-insulator technology has gained a toehold in the semiconductor industry, as microprocessor vendors first IBM and Motorola, and this year AMD tap into SOI for performance gains. The question now is whether this nascent process technology will make the leap into ASICs and systems-on-chip, to RF and power devices, even to silicon-on-glass displays integrated with on-panel logic.
Ziatech sale puts CompactPCI under the scope News & Analysis 9/27/2002 Post a comment Intel Corp.'s impending sale of its Ziatech unit for less than one-fiftieth of the unit's purchase price has sent jaws dropping as industry players and analysts divine whether the move signals a telecom migration away from the CompactPCI platform Ziatech pioneered.
Two-stage WLAN PA News & Analysis 9/27/2002 Post a comment The LX5503E two-stage power amplifier covers the 4.8- to 5.85-GHz band, making it a nice solution for emerging 5-GHz wireless LAN (WLAN) designs.
Sharp display shows 3-D images News & Analysis 9/27/2002 Post a comment Sharp Corp. has developed an LCD that can display images in 3-D, and is forming an industry consortium to promote the inclusion of 3-D effects in videogames, PDAs, TVs and other applications.
SoCs optimized for power yield better performance News & Analysis 9/27/2002 Post a comment Academic researchers suggested novel strategies for system-level power reduction in presentations at the 15th IEEE International ASIC/SoC Conference here this week, which showed that optimizing a system-on-chip (SoC) design for energy is starting to resemble optimizing for performance.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.