Trango's virtualization tool for TI OMAP receives certification Product News 9/30/2008 Post a comment Trango Virtual Processors, French provider of embedded processor virtualization IP, announced its HyperVisor embedded virtualization technology, dedicated to Texas Instruments' OMAP 2430 system-on-chip (SoC), complies with the CSPN (First level security certification) criteria, defined by the French National Security Agency.
ASML tips next gen EUV lithography system News & Analysis 9/30/2008 Post a comment Lithography gear provider ASML (Veldhoven, the Netherlands) has unveiled a production version of its upcoming NXE range of EUV machines that, the company says, is part of a roadmap that supports cost-effective chip manufacturing to at least 11 nanometres (nm).
Cloud computing hard to harness, experts say News & Analysis 9/30/2008 Post a comment The vision of cloud computing is simple, but making it a reality will require years of work in areas such as parallel programming primitives, authentication standards and application programming interfaces, said panelists at an annual research event at the headquarters of Internet auctioneer eBay Inc.
Firms launch mobile broadband awareness campaign News & Analysis 9/29/2008 Post a comment An initiative led by the GSM Association has united 16 IT and wireless service providers--including Microsoft , Dell, Toshiba, Qualcomm and T-Mobile--to drive the adoption of notebook computers with mobile broadband capability.
Fotowatio buys four solar plants Product News 9/29/2008 Post a comment Fotowatio, one of Spain's largest solar companies, has acquired four solar photovoltaic power plants that produce 32 megawatts (MW) of energy in Murcia, Spain.
Apple offers unlocked iPhone in Hong Kong News & Analysis 9/29/2008 Post a comment In an apparent break from the marketing strategy it has employed in the rest of the world, Apple is offering in Hong Kong a carrier-independent, "unlocked" iPhone that can be used with each customer's wireless operator of choice.
Creditors to sell Hynix stake News & Analysis 9/29/2008 Post a comment The Korea Exchange Bank (KEB), the single largest shareholder of Hynix Semiconductor Inc., plans to sell its combined 36 percent stake that it holds with eight other companies in the chip maker.
DS2 demos 280-Mbps powerline communications News & Analysis 9/29/2008 Post a comment Diseno de Sistemas en Silicio SA (Valencia, Spain), also known as DS2, has demonstrated technology being developed for 400-Mbit per second powerline communications, at the Broadband World Forum, which opened in Brussels, Monday (Sept. 29).
Underwater helicopter surfaces News & Analysis 9/29/2008 1 comment Undersea robots have until now operated like fixed-wing aircraft, requiring motion to maneuver. Massachusetts Institute of Technology researchers now say they have created the helicopter-of-the-sea, the Odyssey IV.
Surface mount gate drive transformer is highly resistant to EMI Product News 9/29/2008 Post a comment With a small surface mount package featuring rugged housing materials that are highly resistant to the effects of EMI, the SM580 gate drive transformer from Datatronic Distribution Inc. provides efficient pulse control in gate drive circuits used in MOSFETs and IGBTs for switch mode power supplies and other electronic equipment.
Buck-boost LED driver offers wide input voltage range Product News 9/29/2008 Post a comment Designed to drive high current LEDs, Linear Technology's 100V, high-side current sense DC/DC converter features a 6V to 100V input voltage range that makes it well-suited for a wide variety of applications, including automotive, industrial and architectural lighting.
Nokia, Huawei sign cross licensing accord News & Analysis 9/29/2008 Post a comment Finnish communications group Nokia and its wireless infrastructure joint venture Nokia Siemens Networks (NSN) have sealed a cross-licensing agreement with China's Huawei covering essential patents for wireless standards.
ARM to develop SoC platform for IBM chip alliance at 28-nm News & Analysis 9/29/2008 Post a comment ARM Holdings plc (Cambridge, England) has agreed to develop a system-on-chip design platform of physical intellectual property at the 32-nm and 28-nm nodes for the Common Platform technology alliance of International Business Machines Corp., Chartered Semiconductor Manufacturing Ltd. and Samsung Electronics Co. Ltd. for distribution to their customers.
Sarnoff expands electrostatic discharge IP portfolio News & Analysis 9/29/2008 Post a comment Soon after joining the TSMC Design Center Alliance, Sarnoff Europe SA (Gistel, Belgium) announced it has expanded its TakeCharge Electrostatic Discharge IP portfolio with silicon-proven solutions for the TSMC 40-nm G process technology.
Cooperation to innovate humanoid robotics and medical-care robots News & Analysis 9/29/2008 Post a comment STMicroelectronics and the Waseda University Humanoid Robotics Institute (HRI) announced the development of a high-performance two-wheel inverted pendulum robot, called WV-1 (Waseda wheeled Vehicle-No.1), which is the first result of an ongoing cooperation for the research and development of technology and solutions for innovative humanoid robots and medical-care robot systems.
Bluetooth headset turns to SUN and goes green Teardown 9/29/2008 Post a comment Last year, I purchased a hands-free Bluetooth car kit as a Christmas gift for a family member who, as a sales rep, spends significant time talking in her car. Worried for her safety as she drives with one hand on the wheel and the other around a cell phone, I initially felt a sense of pride as she unwrapped a gift that demonstrated concern for her well-being. Sometimes, however, a buzz can be short-lived. After a quick explanation of what the gift was, I could see a bit of uneasiness creep in as
On the hot seat News & Analysis 9/29/2008 Post a comment There's trouble brewing in chip-making paradise. Manufacturers are rolling out 45-nm ICs, with 32-nm designs in the works; 22 nm and even smaller devices are in R&D. But delivery of chips at 32 nm and beyond won't be a cool breeze.
In multicore SOC architectures buses are a last resort News & Analysis 9/29/2008 Post a comment The one-processor system model that has dominated electronic system design since 1971 is now thoroughly obsolete. Today's SOC designers readily accept the idea of using multiple processors in their complex systems to achieve design goals and use the terms "control plane" and "data plane" to describe how these various on-chip processors are used on the chip. These terms appeared during the Internet and networking boom. At first, these terms referred to the design of multiple-board networking syst
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.