Intel to Exit Mobile SoC Business News & Analysis 4/29/2016 2 comments As it proceeds with a massive restructuring plan announced earlier this month, Intel will exit the smartphone and tablet mobile SoC business by ending its struggling Atom chip product line. Intel is likely to keep its modem team.
MediaTek Expects Increase in Smartphone Shipments News & Analysis 4/29/2016 1 comment MediaTek, Qualcomm’s largest competitor in the smartphone silicon business, said it expects to increase shipments during the second quarter this year from the first quarter even as global growth in the segment has stalled for the first time.
JEDEC Adds UFS Card Spec News & Analysis 4/28/2016 Post a comment The Universal Flash Storage (UFS) family of standards have been updated along with the introduction of a new removable memory card option for the mobile device market
Auto & Cloud Companies' Alliances Untangled News & Analysis 4/28/2016 2 comments In the era of the Internet of Everything, big data has thrown together a roster of once-strange bedfellows, including Rolls-Royce with Microsoft, Hyundai with Cisco, Toyota with Microsoft, Amazon with the U.S. Dept. of Transportation, and BMW with Microsoft.
UMC: Business to Bounce Back This Year News & Analysis 4/27/2016 Post a comment United Microelectronics Corp. (UMC), the world’s third-largest foundry, said that by the second half of 2016, it expects business to recover from a slump that impacted demand for communications chips starting last year.
Apple iPhone Sales Slide 16% News & Analysis 4/26/2016 5 comments Apple’s quarterly iPhone sales declined for the first time but the company said it remains bullish on the outlook for its smartphone.
IoT Security Spending to Skyrocket News & Analysis 4/25/2016 6 comments The amount that enterprises and consumers will spend on security around the Internet of Things is projected to grow rapidly after 2020, according to Gartner.
IoT Sparks Clash of Carriers News & Analysis 4/25/2016 2 comments The Internet of Things is pitting cellular carriers against each other and new classes of low power wide area network providers.
Roll-to-Roll Flexible Electronics to Hit 100GHZ? News & Analysis 4/25/2016 Post a comment Researchers from the University of Wisconsin Madison have leveraged the high carrier mobility of flexible silicon nanomembranes (NM) with the scalability of nanoimprinting lithography (NIL) to produce thin-film flexible RF transistors capable of operating at 38GHz.
Paying, Building 5G for Autos News & Analysis 4/22/2016 Post a comment Industry experts at the Brooklyn 5G Summit expect, unsurprisingly, that 5G will play a major role in the future of automotive communications. Just how next-generation cellular systems will help form autonomous or automated driver assistance is still being constructed.
Fab Tool Book-to-Bill Rises News & Analysis 4/22/2016 1 comment North American manufacturers of semiconductor capital equipment posted a book-to-bill ratio above parity for the fourth consecutive month in March, according to the SEMI trade group.
Samsung Details Foundry Roadmap News & Analysis 4/22/2016 4 comments Officials from Samsung Semiconductor Inc. detailed the company’s foundry roadmap, which includes expanding FD-SOI production and offering low-cost alternatives to existing FinFET technologies.
IDT Backs WiGig Chip Vendor News & Analysis 4/22/2016 1 comment Funding round worth $20 million marks second time in two weeks that venture capital has smiled on the semiconductor industry.
Mie Fujitsu, CSEM to Combine DDC, Low Voltage for IOT Chips News & Analysis 4/22/2016 Post a comment Japanese chip manufacturer Mie Fujitsu Semiconductor Ltd. and Swiss research institute CSEM SA have agreed to collaborate on Deeply Depleted Channel (DDC) technology and near/sub-threshold voltage technology for integrated circuits aimed at the Internet of Things and wearables markets.
NI's mmW Radio Speeds 5G Research News & Analysis 4/21/2016 1 comment National Instruments announced a software defined radio for the millimeter wave spectrum. The transceiver system that can transmit and/or receive wide-bandwidth signals at 2 GHz real-time bandwidth, covering the 71-76 GHz spectrum. The system comes with accompanying software.
Mie Fujitsu, CSEM to Combine DDC, Low Voltage for IoT Chips News & Analysis 4/21/2016 Post a comment Japanese chip manufacturer Mie Fujitsu Semiconductor and Swiss research institute CSEM have agreed to collaborate on Deeply Depleted Channel technology and near/sub-threshold voltage technology for integrated circuits aimed at the Internet of Things and wearables markets.
Cutting Antenna Design Time News & Analysis 4/21/2016 5 comments A time-saving algorithm may help designers of the multiple-input multiple-output (MIMO) antennas, which have become necessary for all the different frequencies a worldwide 4G (and 5G) mobile phone must receive.
Ams Breaks Ground on N.Y. Fab News & Analysis 4/20/2016 1 comment AMS AG broke ground on a wafer fab in upstate New York today, joining the ranks of advanced manufacturers in the region. The Austrian company aims to start volume ramp of high-performance analog wafers by the second half of 2018.
Intel Reorg Shows Clouds Ahead News & Analysis 4/20/2016 12 comments Intel's $1.2 billion plan to cut 12,000 employees amid an accelerating PC decline got a mixed reception from market watchers noting issues in memory, IoT and data center markets.
Intel Cuts 12,000, 11% of Staff News & Analysis 4/19/2016 6 comments Intel Corp. officially cut its PC business loose today announcing a cut of 12,000 employees, 11% of its staff amid a sequential decline in quarterly revenues and profits.
Apple iPhone Shipments May Fall News & Analysis 4/19/2016 4 comments Shipments of the Apple iPhone may have fallen for the first time since the iconic smartphone went on the market in 2007, analysts are saying.
Russia, U.S. Get Closer to Universal Memory News & Analysis 4/18/2016 4 comments Researchers have collaborated to grow an ultra-thin ferroelectric film on silicon, which they believe could become the favored "universal" non-volatile memory material of the future as well as for memristors in brain-line cognitive neuromorphic computers.
Quakes Hit Japan's IC & Auto Makers Hard News & Analysis 4/18/2016 3 comments Japanese electronics and automotive manufacturers are struggling to assess damages to their manufacturing facilities after a series of earthquakes--as high as 7.3 magnitude on the Richter scale--struck Kyushu, Japan’s southern island.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.