Sensors Build Case Against Cold News & Analysis 9/29/2014 Post a comment As some predict that New York’s easy summer may turn into a hellish winter, a local startup aims to fix the freeze. Heat Seek, grand prize winner of this year’s NYC BigApps competition in the live and connected device categories, wants to keep tenants warm with inexpensive temperature sensors.
HP Ships First ARM Servers News & Analysis 9/29/2014 15 comments Hewlett-Packard is shipping its first mainstream commercial servers using the 64-bit X-Gene ARM-based SoCs from Applied Micro and TI’s 32-bit Keystone II with PayPal among its users.
Fairchild Reinvents Itself News & Analysis 9/26/2014 8 comments Fairchild is transforming itself from a discrete component supplier for everyone into a smart-module provider to just the fastest-growing industries, says president and chief operating officer Vijay Ullal.
Smartphone Shifts Automotive Processor Demand News & Analysis 9/26/2014 6 comments As the most disruptive trend in the automotive infotainment industry has market researcher HIS identified the use of smartphones in cars. The reason: Since smartphones are as ubiquitous as they are in today's vehicles, consequences for the design of head units and telematics portals in the vehicles are necessary, leading to a shift in microprocessor demand in these components.
4 Reasons for Intel's $1.5 Billion Bet in China News & Analysis 9/26/2014 18 comments China's quest to expand its domestic semiconductor industry suddenly looks more realistic and even winnable now that Intel, the world's largest semiconductor company, plans to invest up to $1.5 billion in Tsinghua Unigroup.
MEMS Pioneer Raises $25M, Including Debt News & Analysis 9/26/2014 4 comments SiTime Corp., a pioneer of MEMS resonator devices as replacements for quartz timing devices, has closed a $25 million round of financing that includes a $15 million debt facility provided by Capital IP Investments Partners.
Radios Tune Up for 5G News & Analysis 9/26/2014 3 comments 5G cellular is expected to drive work in a couple new air interfaces, massive MIMO antennas, millimeter-wave frequencies, and Gbit-class LTE, but many hurdles lie ahead, say wireless experts.
Intel May Invest in Spreadtrum, Report Says News & Analysis 9/25/2014 8 comments Rumors surrounding Intel’s possible investment in Chinese-government affiliated mobile chipmakers Spreadtrum Communications and RDA Microelectronics may bear weight, but also beg many questions.
IBM Water Cooling Enables a Super Solar Dish News & Analysis 9/25/2014 12 comments A solar disk cuts costs by using fiber-reinforced concrete, supporting polymer-backed aluminum foil mirrors concentrated on four-spectrum InGaAs photovoltaic cells cooled by water in IBM-fabricated micro-channels.
PZT Making Waves in MEMS News & Analysis 9/25/2014 Post a comment ST's announcement that it is offering a piezo-MEMS manufacturing process catapults the company to the front of a wave of uptake for the technology.
Smart Clothes Seek Slim Electronics News & Analysis 9/25/2014 4 comments Smart shirt makers such as Hexoskin are getting traction, especially with athletes, but they need lower-power chips and better manufacturing processes for integrating sensors.
Broadcom Beefs Up Switch for SDN News & Analysis 9/24/2014 3 comments Broadcom will pack 7 billion transistors and 480 Mbits memory into its next generation Ethernet switch chip, the Strata XGS Tomahawk, targeting software-defined networks for rapidly expanding data centers.
NXP Beats Qualcomm, Gets First V2V Design Win News & Analysis 9/23/2014 4 comments The future of car-to-car communication in the United States is getting more real, now that Delphi Automotive has become the first Tier 1 to supply car-to-car communications modules to General Motors' 2017 Cadillac models.
ARM Pumps Up MCU for IoT News & Analysis 9/23/2014 17 comments ARM announced its next generation 28mnm process 32-bit Cortex-M7 processor for embedded applications in the industrial, infrastructure, and home automation markets. ARM bills the M7 as its most powerful MCU with double the compute and digital signal processing capability.
3D Printers Pursue High Fashion News & Analysis 9/23/2014 11 comments Advances in 3D printers hold promise for a clothing and fashion industry stuck in 100-year-old processes, but they still have years of evolution ahead, a Designers of Things event speaker said.
Securing Trustworthy & Resilient Chips News & Analysis 9/23/2014 2 comments The National Science Foundation and the Semiconductor Research Corp. are funding a $10 million three-year project to make chips secure, trustworthy, assured, and resilient against hackers.
Cars Made to Order at Retail News & Analysis 9/19/2014 11 comments Local Motors’sporty 3D printed car looks like licorice on wheels and cruised around a rocket playground while eager adults looked on. The vehicle innovation company – not car manufacturing, not motorcycle manufacturing – bills itself as a necessary alternative for consumers who want more choice.
Elastomeric Camouflage Switches Texture & Color News & Analysis 9/18/2014 1 comment Inspired by nature's most skillful camouflage artists, MIT researchers harness elastomers' ability to change surface texture when voltage is applied to a make a flexible material that simultaneously changes its color and texture on demand.
Makers, Engineers Mix at NY Event News & Analysis 9/18/2014 2 comments Educators and engineers from across the country attended New York’s Maker Conference, held at the New York Hall of Science, to discuss the intersection of making and engineering.
Asia-Pacific IC Usage Domination Growing News & Analysis 9/17/2014 7 comments Asia-Pacific is the dominant market for ICs for most products categories. The exceptions are Europe, leading in the automotive sector, and the Americas region, leading in government and military, according to IC Insights.
Consumers Expect Full In-Car Connectivity News & Analysis 9/17/2014 20 comments Drivers worldwide increasingly expect their cars to be “the next connected space,” a seamless extension to their already connected homes and offices, according to a global consumer study conducted by GfK.
iPhone 6 Future Revealed News & Analysis 9/17/2014 7 comments Apple's new bigger iPhone 6 and 6 Plus are not just bigger, but have opened up the software door for interoperability among cooperating apps.
Android One Rides Mediatek News & Analysis 9/16/2014 5 comments Taiwan’s leading mobile chip vendor will power Google’s Android One-branded, low-cost “high-quality” smartphones targeted at emerging markets. The initiative aims to put feature-rich handsets in a largely smartphone-less arena, which MediaTek dubs the “super-mid market.”
7nm EUV Could Ease 10nm Squeeze News & Analysis 9/16/2014 18 comments After a cost-squeezed 10 nm node using mainly immersion steppers, EUV will be ready for production on 7 nm chips, says ASML’s latest lithography road map.
HGST Fires Up Flash Fabric News & Analysis 9/16/2014 Post a comment The Western Digital-owned enterprise storage company is leveraging recently acquisitions to turn Flash into a platform with clustering of PCIe storage devices.
7 Most Audacious Medtech Predictions News & Analysis 9/16/2014 9 comments Making the blind see and the crippled walk sounds like something from a book of miracles; instead they're predictions that medical devices may make come true.
ZF Swallows TRW Automotive News & Analysis 9/16/2014 Post a comment US-based TRW Automotive has been acquired by automotive parts company ZF Friedrichshafen, creating the second largest automotive suppliers after Robert Bosch GmbH.
Cavium Attacks B'com in Switches News & Analysis 9/16/2014 3 comments Cavium aims to leapfrog networking giant Broadcom with new Ethernet switches from its acquisition of Xpliant, which has both a novel chip and approach to semiconductor startups.