Embedded Systems Conference
Breaking News
News Analysis
Latest Content
Page 1 / 2   >   >>
Embedded Job Market Expands, But Boomers Feel the Squeeze
News & Analysis  
3/2/2015   Post a comment
By almost any measure, the job market appears to be looking very good right now for embedded engineers. But not for everyone.
NXP, Freescale: Bigger Not Better
News & Analysis  
3/2/2015   4 comments
The proposed merger of NXP and Freescale creates a embedded chip vendor that is significantly bigger than most, but not all, its rivals and not substantially different.
Intel Tablet SoCs Pack LTE
News & Analysis  
3/2/2015   Post a comment
Intel announced a new family of SoCs and modems for mobile devices under its Atom brand, targeting low to premium markets. The chip giant hopes to win a large share of the mobile space with highly integrated processors and excellent graphics.
Asian Share of Global Fab Capacity May Top 69% by 2019
News & Analysis  
3/2/2015   Post a comment
Asia is expected to account for a new record, nearly 70% of the world's fab capacity, by 2019, according to a new report from IC Insights.
Base Stations Go Virtual, Flexible
News & Analysis  
3/2/2015   Post a comment
Several major players in the base station market have are trying to solve the problem of increasing data rates and the need for speed with a variety of configurable small and macro cells. Alcatel-Lucent, Aquantia, and Qualcomm each announced chip sets and software that harness new cellular bands and spectrum.
Imagination Dons Wearable GPU
News & Analysis  
3/2/2015   1 comment
Imagination Technologies announced a suite of video IP cores for the next generation of graphic displays at Mobile World Congress. Alongside a set of video encoder cores, the UK company also announced a new PowerVR GPU for mobile and wearables.
Freescale Unveils Vision SoC for Accident-Free Cars
News & Analysis  
3/2/2015   Post a comment
Freescale has unveiled an automotive vision system-on-chip. Besides advanced vision algorithms and sensor data fusion features, the new SoC provides protection against external wireless attacks, a much needed feature in the era of “Connected Cars.”
NXP, Freescale Plan Mega Merger
News & Analysis  
3/1/2015   8 comments
NXP bid to acquire Freescale to create a $10 billion embedded chip giant that would be a world leader in automotive chips and microcontrollers.
Porsche Rainmaker Advocates Platooning
News & Analysis  
3/1/2015   1 comment
By driving in a platoon -- or platooning -- drivers can help maximize throughput of motorways without high investments into traffic infrastructure, says a Porsche executive.
Samsung Phones Pack 14nm SoC
News & Analysis  
3/1/2015   3 comments
Samsung will pack a handful of new technologies -- including a 14nm Exynos applications processor -- into its new Galaxy S6 and S6 Edge smartphones announced here. The handsets also sport a new fast-charging battery, novel memory stack, simplified user interface, and advanced camera features.
Freescale, Cisco, Ciena Give Nod to FD-SOI
News & Analysis  
3/1/2015   1 comment
Freescale, Cisco and Ciena have defied the general skepticism of fully-depleted silicon-on-insulator by revealing their own experience with the process technology, creating expectations that more companies might follow.
MediaTek Sails Uncharted Waters With CrossMount
News & Analysis  
3/1/2015   Post a comment
MediaTek has revealed a new cross-device sharing technology called “CrossMount.” With the proposal of a new industry standard that’s royalty-free and open to all comers, MediaTek sails uncharted waters.
3D Printing Everywhere from Lab to Factory
News & Analysis  
3/1/2015   Post a comment
3D printers have moved out of the toy store and onto the factory floor, at Local Motors, and into the physic lab, at Princeton University.
MediaTek Wrestles ARM A72 into Tablets
News & Analysis  
3/1/2015   Post a comment
Taiwanese chipmaker MediaTek announced a new tablet SoC based on ARM’s new Cortex-A72 processor. The chipset is designed to be a "workhorse" for media and enterprise.
Graphene Polymer Speeds Electron Transport
News & Analysis  
2/27/2015   Post a comment
Depositing conducting polymers on graphene gives then highly desirable electrical properties, flexibility and strength for future flexible electronics, organic solar cells, protective coatings and other practical applications.
Web Giants Drive Road Maps
News & Analysis  
2/27/2015   1 comment
Big data centers such as Amazon, Google and Facebook are having outsized influence on everything from optical interconnects to the future of hard disk drives and solid-state memory.
IoT Terrain Still Shifting
News & Analysis  
2/27/2015   3 comments
The Internet of Things continues to fragment with competing networks and frameworks from 6LoWPAN to Zigbee, Apple Homekit and Google’s Thread.
Infineon: CAN FD Success Goes at Expense of FlexRay
News & Analysis  
2/27/2015   Post a comment
The faster version of the venerable CAN bus, CAN FD is currently taking off at several carmakers. Infineon's Thomas Böhm, Head of Body / Automotive, believes this could well go at the expense of FlexRay.
Apple's March 9 Event: Is It Time For The Apple Watch?
News & Analysis  
2/26/2015   Post a comment
Apple fans and non-fans alike are waiting to "watch" what happens. Let the speculation begin.
Tessera Buys Smart Sensors for Iris Recognition
News & Analysis  
2/26/2015   Post a comment
FotoNation Limited, a wholly owned subsidiary of chip packaging company Tessera Technologies Inc. (San Jose, Calif.) has acquired Smart Sensors Ltd. (Bath, England), a developer of iris recognition biometric technology.
Hi-Speed Transistors from Liquid Processing
News & Analysis  
2/26/2015   9 comments
A University of Chicago lab has invented a new kind of solder that can electronically join disparate semiconductors that were impossible to solder before plus print crystalline-like high-speed transistors as well as revolutionize 3-D printing.
Radar Can't Spot Mystery Drones over Paris
News & Analysis  
2/26/2015   4 comments
Unidentified drones were spotted in the skies above Paris two nights in a row this week. The French authorities don’t know who is controlling them, the number of drones involved, or even if they were all coordinated.
IoT Starter Kit Connects Developer to Cloud in Moments
News & Analysis  
2/26/2015   1 comment
Seeking to simplify the prospect of creating an IoT prototype that is web connected, ARM has partnered with IBM to provide an end-to-end, out of the box dev kit.
Benchmark Stresses Big Chips
News & Analysis  
2/26/2015   6 comments
The EEMBC consortium rolled out CoreMark-Pro, a benchmark suite for 32- and 64-bit chips, an extension of its six-year old test for MCUs and CPUs.
Mesh Comes to Bluetooth
News & Analysis  
2/25/2015   6 comments
Expect Bluetooth to add mesh networking technology later this year. The Bluetooth SIG’s fast-track effort is a testament to the groundswell of interest in the technology. But it can also be viewed as a pre-emptive strike against the Thread Group.
5G Horizon Seen at ISSCC
News & Analysis  
2/25/2015   3 comments
Research on 5G is coming to a head as companies prepare to make proposals next year that will shape the next-generation cellular standards, said experts at an ISSCC panel.
Flex Logix Introduces FPGA IP Cores for SoC Designs
News & Analysis  
2/25/2015   1 comment
The EFLX FPGA fabric allows things like I/O protocols, encryption algorithms, radio filters, and other "fixed" functions to be upgraded on-the-fly.
Flash for Even Commodity Servers
News & Analysis  
2/25/2015   Post a comment
SolidFire claims to be the leading vendor of flash hardware systems for high-performance systems and servers, but now its marketing its software-only to marry your own hardware to your own flash making it affordable even by the smallest-servers.
LTE IoT Specs Anticipated in Chips
News & Analysis  
2/25/2015   1 comment
Altair Semiconductor hopes to drive the machine to machine market toward 4G LTE with two chip sets based on early 3GPP standards. Whether the Internet of Things needs cellular remains to be seen.
5 Trends to Watch at Mobile World Congress
News & Analysis  
2/25/2015   4 comments
Anything and everything in the world that demands wireless connectivity – cars, phones, homes, retail transactions, factories, buildings, wearables, public transportation systems, you name it – is descending upon the Mobile World Congress next week in Barcelona.
Xilinx Unveils 16nm Ultrascale+ FPGAs, MPSoCs & 3D ICs
News & Analysis  
2/24/2015   1 comment
Applications for Xilinx's new UltraScale+ FPGAs, MPSoCs, and 3D ICs include LTE Advanced and early 5G wireless, terabit wired communications, automotive ADAS, and industrial IoT.
MediaTek Push into Global LTE Not Likely Until 2016, Analyst Says
News & Analysis  
2/24/2015   Post a comment
With U.S. certification still pending, MediaTek’s ramp in developed markets may take until next year to have some traction, says Credit Suisse analyst.
Silicon Seeks to Outsmart Brain
News & Analysis  
2/24/2015   Post a comment
Researchers are engaging many challenges that stand in the way of silicon implants with interfaces that can listen and respond to the brain for a wide variety of uses.
Silicon Labs' First Salvo in IoT SoCs: Blue Gecko
News & Analysis  
2/24/2015   2 comments
Silicon Labs unveiled its first Bluetooth Low Energy wireless SoC, Blue Gecko. Integrating Silicon Labs’ EFM32 Gecko MCU with 2.4GHz radio, it’s the first in a series of IoT SoCs Silicon Labs has promised to deliver in coming months.
TSMC to Start 10nm in 2017, Closing Gap with Intel
News & Analysis  
2/24/2015   4 comments
TSMC expects to start 10nm production in 2017, when it will have process technology matching that of industry leader Intel Corp.
Organic Solar Cells Au Naturel
News & Analysis  
2/24/2015   Post a comment
Researchers search for naturally occurring carbon-based materials to enable ultra-cheap solar cells.
16nm FPGAs Pack More Memory and Hard IP, Save Power
News & Analysis  
2/24/2015   Post a comment
Xilinx's announces its UltraScale+ family of FPGAs, billed as 3D-on-3D multi-processing SoCs (MPSoC).
AMD Describes Notebook Processor
News & Analysis  
2/23/2015   1 comment
AMD’s next-gen notebook processor, Carrizo, packs a south bridge and HEVC decoder in the same space as its previous Kaveri chip, it said at ISSCC.
Marvell Shakes Up SoCs, DRAMs
News & Analysis  
2/23/2015   8 comments
Marvell CEO Sehat Sutardja announced a new SoC interconnect and virtual-memory initiatives aimed to make next-generation chips and systems cheaper.
Violin Doubles Down on Flash Fabric Architecture
News & Analysis  
2/23/2015   Post a comment
Veteran all-flash array maker is targeting a wider market for its platform with enterprise-grade data services and aims to be cost-competitive with traditional storage vendors
Parrot Spins Positive on FAA Drone Draft
News & Analysis  
2/23/2015   2 comments
We talked with Yannick Levy, vice president of Parrot (Paris), to find out how the FAA’s draft drone rules are viewed in Europe, and where the focus of the drone debate will move next.
8-bit MCUs Stake New Claim in IoT
News & Analysis  
2/23/2015   Post a comment
Far from being down and out in the IoT era, 8-bit MCUs are staking a claim with these new products from Silicon Labs.
Chip Packs 100, 64-bit ARM Cores
News & Analysis  
2/23/2015   4 comments
EZchip announced it will sample next year a 28nm network processor using 100 ARM 64-bit A53 cores, gunning for sockets with Broadcom and Cavium.
3D E-Beam Enables 3D NAND Flash
News & Analysis  
2/23/2015   2 comments
Applied Materials claims to have solved the last remaining problems around enabling mass production of 3D NAND flash memory cubes. The company says it has leveled the playing field so any semiconductor maker can make 3-D FinFETs as well as Intel already does.
Intel Carves Tiny SRAMs at 14nm
News & Analysis  
2/22/2015   17 comments
Intel will describe at ISSCC advances based on its 14nm process technology including what it calls the world’s smallest SRAM cell and PCI Express circuit.
Self-Driving Cars in Real-World Traffic With Real Customers
News & Analysis  
2/20/2015   Post a comment
Volvo has provided details of its plan to carry out a project with 100 self-driving cars in Gothenburg's real-world traffic. The project reveals which problems autonomous driving will be confronted with.
Molex to Acquire SDP Telecom and Expand RF Solutions
News & Analysis  
2/19/2015   1 comment
Global interconnect and cable assembly provider Molex Incorporated is acquiring Canadian company SDP Telecom, a designer and manufacturer of RF/microwave solutions for the wireless communications industry.
Quantum Transistor Harnesses New Effect
News & Analysis  
2/19/2015   2 comments
Scientists at the Massachusetts Institute of Technology (MIT) have discovered a new phenomenon--the quantum spin Hall effect--and have used it to create the world's first spintronic topological field effect transistor (TFET), in simulation at the Texas Advanced Computer Center (TACC) at Texas A&M University.
Ultra-Low Power System for Wearable Devices
News & Analysis  
2/19/2015   Post a comment
When an ultra-low power optimized MCU and ultra-low power optimized DC/DC converter come together, the result is a well-running, well-oiled machine fit for wearable applications.
Will Energy-Harvesting 3D Printed Trees Charge Your Smartphone?
News & Analysis  
2/18/2015   1 comment
Scientists at the Technical Research Centre of Finland (VTT) have developed a prototype of a 3D printed tree that harvests solar energy using organic solar cells and kinetic energy from vibrations in its surrounding environment.
Page 1 / 2   >   >>


Most Recent Comments
Top Comments of the Week
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Martin Rowe

Leonard Nimoy, We'll Miss you
Martin Rowe
2 comments
Like many of you, I was saddened to hear the news of Leonard Nimoy's death. His Star Trek character Mr. Spock was an inspiration to many of us who entered technical fields.

Max Maxfield

Awesome 3D Electronic Sculptures
Max Maxfield
12 comments
I recently received an email from someone we'll call Martin (because that's his name). Martin's message was short and sweet. In its entirety it read: "You need to see this!"

Rajaram Regupathy, Cypress Semiconductor

Add USB Battery Charging Protocols to an Android-Based Design
Rajaram Regupathy, Cypress Semiconductor
Post a comment
Editorial Note: Excerpted from Unboxing Android: A hands on approach with real world examples, by Rajaram Regupathy, the author takes you through the process incorporating effective power ...

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
16 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Special Video Section
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
10:29
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...
Why culture makes Linear Tech a winner.
Recently formed Architects of Modern Power consortium ...
Specially modified Corvette C7 Stingray responds to ex Indy ...
Avago’s ACPL-K30T is the first solid-state driver qualified ...
NXP launches its line of multi-gate, multifunction, ...
Doug Bailey, VP of marketing at Power Integrations, gives a ...
See how to ease software bring-up with DesignWare IP ...
DesignWare IP Prototyping Kits enable fast software ...
This video explores the LT3086, a new member of our LDO+ ...
In today’s modern electronic systems, the need for power ...
Radio
LATEST ARCHIVED BROADCAST
EE Times Senior Technical Editor Martin Rowe will interview EMC engineer Kenneth Wyatt.
Flash Poll