Wide-Bandgap Boosts EVs News & Analysis 9/22/2016 Post a comment North Carolina State University (NC State) has invented a power inverter for electric vehicles that almost meets the Department of Energy's (DoE's) 2020 mandate by using wide-bandgap silicon-carbide components.
Amazon Echo & How It Resonates News & Analysis 9/22/2016 4 comments Amazon’s Echo-like smart speakers are on the rise. The voice interface is emerging as one of the most natural interface to control IoT devices. Analysts expect the voice interface in home automation hubs, TVs, set-top boxes, HVAC/environmental control hubs and more.
Robo-Car's Safety Challenges DoT News & Analysis 9/21/2016 23 comments The federal policy places self-driving cars directly under the purview of federal regulators. Stripped from the privilege of “self-certifying” their vehicles, carmakers will need “pre-market approval” from the DoT. The key question, however, is testing of AI cars’ safety.
Persistent Memory Needs Apps News & Analysis 9/20/2016 6 comments A researcher from Hewlett Packard Enterprise called for apps that use persistent memory on servers although the chips are still more than a year away.
Peratech 'Print' Smart Buttons on Any Surface News & Analysis 9/20/2016 2 comments Peratech, which invented quantum tunneling composites (QTC) materials, is now allowing its clients to print a smart button, which people can push with force, on any surface of any materials – including laminated wood.
Emerging Memories: Ship First, Perfect Later News & Analysis 9/20/2016 1 comment MRAM maker Everspin sees perfection as a barrier to getting traction; Everspin sees putting its technology into production as a way to improve processes and lower costs--the keys to adoption.
ARM Raises Bar for Safety, Determinism News & Analysis 9/19/2016 3 comments ARM is rolling out what the company describes as its “most advanced processor for safety.” The new processor, dubbed Cortex-R52, is aimed at automotive, industrial and healthcare applications that demand functional safety.
iPhone 7 Sports Intel, TSMC News & Analysis 9/16/2016 4 comments Apple put Intel inside its iPhone 7 for a baseband processors and used TSMC for at least some of the work making its A10 Fusion SoCs, a teardown said.
5G Cellular 'Still in Early Stages' News & Analysis 9/16/2016 1 comment Despite talks of early trials and even commercial systems, the work on a 5G standard at the 3GPP is still in an early phase, said a Qorvo engineer attending the meetings.
Transistor Trick Beats Moore News & Analysis 9/14/2016 Post a comment Zeno Semiconductor, a Zvi-OrBach startup, claims it has discovered a More-that-Moore architecture that can instantly convert any MOSFET to a high-power bipolar-junction transistor (BJT), or even FinFETs.
Intersil Deal: Renesas' Survival Bid News & Analysis 9/13/2016 Post a comment In an exclusive telephone interview with EE Times, Renesas CEO said the Intersil deal won't be the last big M&A for Renesas. Intersil CEO will stay with the new company in a senior management position.
Chip Process War Heats Up News & Analysis 9/12/2016 Post a comment Fully-depleted silicon-on-insulator is on the rise but FinFETs are strong and planar will be the big winner, says veteran chip watcher Handel Jones.
Web Giants Drive Optical Nets News & Analysis 9/12/2016 Post a comment Microsoft and Facebook are driving separate efforts for a new generation of simplified 400G coherent optical transceivers and optical transport systems.
FCC: Get an App for that Video News & Analysis 9/9/2016 2 comments Pay-TV services would be required to provide free apps to access and search their video content under an FCC proposal aimed to open competition in digital media.
SGI Supercomputes Ireland News & Analysis 9/8/2016 Post a comment SGI and Irish Centre for High-End Computing (ICHEC) collaborate on the world's most accurate climate modeling aiming to provide accurate weather forecasts.
Apple Heralds Dawn of Dual Lens Camera News & Analysis 9/8/2016 1 comment Apple’s iPhone 7 Plus comes with a dual-lens camera, providing both telephoto-zoom and depth of field features. Corephotonics, who pioneered the computational dual camera for smartphones, is enabling Apple’s competitors to develop similar dual camera smartphones.
Globalfoundries Preps 12nm FDSOI Process News & Analysis 9/8/2016 5 comments Globalfoundries has announced a next-generation FDSOI process, called12FDX, to follow on from the 22FDX process that is nearing production. The new process nominally at 12nm minimum geometry is intended for mobile computing, 5G, artificial intelligence and autonomous vehicles.
IC Insights Trims IoT Chip Market Forecast News & Analysis 9/8/2016 1 comment IC Insights reduced the IoT semiconductor market’s projected compound annual growth rate (CAGR) -- between 2014 and 2019 -- from originally projected 21.1 percent to 19.9 percent.
IBM Bests Intel's HPCs News & Analysis 9/8/2016 Post a comment IBM+Nvidia claim to have produced supercomputers in a single rack slot that are faster and cheaper than equivalent Intel-based configurations.
LTE IoT: Sequans Claims 'Big Lead' over Rivals News & Analysis 9/6/2016 3 comments With the recent ratification of the Cat M1 and Cat NB1 standards, Cellular IoT is getting hot. Sequans claims it’s the first to sample CAT M1/NB1 chips, 9 months ahead of its rivals including Qualcomm, Intel and Altair.
Intel Buys Movidius: Automotive Vision in Play? News & Analysis 9/6/2016 Post a comment The Movidius deal is a big win for Intel. Where analysts’ opinions diverge is whether Intel has a long-term ambition to extend Movidius’ technology to autonomous cars, and if Movidius is equally hungry for the automotive market.
TSMC, Renesas Partner in 28nm for Robotic Cars News & Analysis 9/5/2016 14 comments Renesas will combine its Metal-Oxide-Nitride-Oxide-Silicon (MONOS) eFlash technology with TSMC’s 28nm high-K metal gate process to make MCUs for applications such as autonomous vehicle sensor control, coordination of ECUs, fuel-efficient engine management and motor inverter control for EVs.
2016 IC Industry: Who Grabbed What...So Far News & Analysis 9/2/2016 11 comments Among M&A deals thus far in 2016, we find more transactions that are not an outright “whole” company acquisition. As deals get granular, who owns what becomes more of a tangled web. EE Times attempts to untangle it.
Renesas, Maxim In Duel for Intersil News & Analysis 8/31/2016 Post a comment The courtship of Intersil Corp. is turning into a duel between Japan’s Renesas Electronics and San Jose, Calif.-based Maxim Integrated Products Inc. Intersil may announce a sale to Renesas as early as next week, Reuters reported.
Sunic System Promises 2,250ppi OLEDs for VR News & Analysis 8/31/2016 Post a comment At the 16th International Meeting on Information Display (IMID 2016) held in South Korea, OLED deposition equipment manufacturer Sunic System unveiled its technical solution for the production of 11K (2,250 ppi) AMOLEDs.
IC Industry M&A: Who's Left to Buy? News & Analysis 8/31/2016 4 comments Only eight months in, 2016 is already looking like another blockbuster year for M&A in the global chip industry. As valuations keep going up, the questions are who’s left to buy and what’s a good buy?
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.