Motorola puts Shlapak in No. 2 post News & Analysis 1/5/1999 Post a comment Motorola Inc.'s Semiconductor Products Sector has beefed up its top management ranks by creating a new No.2 position, assistant to the president, and naming Fred Shlapak, a 28-year company veteran, to the post.
Conexant begins independent operations News & Analysis 1/5/1999 Post a comment Conexant Systems Inc., the $1.2 billion semiconductor spin-off of Rockwell International Corp., began operations Monday (Jan. 4) as the largest independent company focused exclusively on providing semiconductor products for communications electronics. The company's stock, which has been trading on a "when issued" basis since Dec. 9, began regular trading Monday on the NASDAQ system.
Intel reveals low-end strategy for 1999 News & Analysis 1/4/1999 Post a comment Intel Corp. executive vice president Paul Otellini opened the 1999 business year today with a new assault on the retail low end of the personal computer CPU market. New Celeron CPU speed grades and prices, further reliance on less expensive plastic PGA packaging in place of the ill-accepted single-edge Slot-1 card format, and promised new core logic chip sets will be Intel's weapons of choice.
EEs take EV for a ride News & Analysis 1/4/1999 1 comment Greg Hanssen bounces around with youthful energy showing a visitor the sleek, Buck Rogers lines of his electric car at, of all places, a gas station in the smoggy heart of Southern California.
Microtec to address system-on-a-chip designs News & Analysis 1/4/1999 Post a comment Mentor Graphics' Microtec division, a real-time operating system (RTOS) and tools vendor, is launching a strategy to drive into deeply embedded applications in 1999. To that end, Microtec today (Jan. 4) will name Michael Kaskowitz its general manager.
Cadence extends layout tools to 0.18-micron designs News & Analysis 1/4/1999 Post a comment Promising a next-generation placement-and-routing solution for 0.18-micron design, Cadence Design Systems Inc. this week will announce Silicon Ensemble ultra, a high-end product that complements the company's Silicon Ensemble DSM tool. The major enhancements to the ultra offering are concurrent placement and optimization, the integration of "quasi-3D" extraction and nine-layer metal routing.
Enhanced security characterizes new HomeRF spec News & Analysis 1/4/1999 Post a comment The HomeRF Consortium will uncloak details of its specification for wireless home networking at the Consumer Electronics Show this week. The Shared Wireless Access Protocol packs a surprising wallop in the security arena, with an optional 56-bit encryption capability. But that may not be enough to knock out a competing home network technology, based on phone lines, to be shown at CES that hits lower prices in products that are ready to roll out to market.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.