AMCC exec see major roadblocks for developing 80-Gbps devices News & Analysis 1/31/2002 Post a comment SANTA CLARA, Calif. -- Carriers are not expected to deploy next-generation, 80-gigabits-per-second networks for some time, but chip makers are already hitting some major roadblocks with the technology.
The problem is that there are no viable chip-level or process-technology solutions for 80-Gbps applications--at least for now, warned Greg Winner, senior vice president of engineering and quality for Applied Micro Circuits Corp. (AMCC) of San Diego.
Teradyne rolls out new capabilities to lower LAN-chip testing costs News & Analysis 1/31/2002 Post a comment BOSTON -- Teradyne Inc. today introduced a new capability for its VLSI logic testers that promises to lower the cost of test for local-area networking (LAN) devices.
Teradyne has added an arbitrary waveform generator (AWG) instrument on its Tiger and Catalyst line of automatic test equipment (ATE).
Linux comes out of the geek closet News & Analysis 1/31/2002 Post a comment Linux enthusiasts are going mainstream, judging by this week's LinuxWorld conference, where proponents said the open-source operating system is ready to make its mark on the telecom carrier and data center worlds.
Singapore beats out Taiwan and China to land AMD/UMC fab News & Analysis 1/31/2002 Post a comment Advanced Micro Devices and UMC late Thursday announced they will form a joint venture to build and operate a 300mm wafer fab in Singapore to make PC processors and other logic products.
UMC will also become a foundry to make AMD processors to augment output from the chip firm's own fab in Dresden, Germany.
The joint venture, called AU Pte Ltd., will start production in 2005 at the 0.065-micron processing node
AMD, UMC form 300-mm foundry venture in Singapore News & Analysis 1/31/2002 Post a comment SUNNYVALE, Calif.-- Advanced Micro Devices Inc. and United Microelectronics Corp. (UMC) today announced an alliance under which the two companies will establish a joint 300-mm silicon foundry venture in Singapore for high-volume production of PC processors and other logic products.
The announcement confirms what sources told SBN two weeks ago after AMD president Hector de J. Ruiz disclosed plans to strike a foundry agreement for PC processors
ChipPAC's Q4 sales increases 3% over Q3, projects flat sales for Q1 News & Analysis 1/31/2002 Post a comment FREMONT, Calif. -- ChipPAC Inc. here today reported sales of $76.8 million for its fourth quarter ended Dec. 31, a 41.9% decline from $132.2 million in the period a year ago but up 3% from $79.1 million in the previous quarter.
The company also posted a loss of $60.1 million, or minus $0.87 a share, in the quarter, compared to a profit of $2.7 million, or $0.04 a share, a year ago.
Via introduces integrated Ethernet controller for networking systems and PCs News & Analysis 1/31/2002 Post a comment TAIPEI, Taiwan -- In a move to expand its communications-chip business, Taiwan's Via Technologies Inc. today announced an integrated controller for Fast Ethernet networks.
The VIA Rhine III VT6105 is said to be "3-in-1 chip solution" for use in networking and PC motherboard applications. Combining the physical-layer, media-access controller and management layers on a single chip, the VIA VT6105 is designed for both 10- and 100-megabits-per-second networks.
Solectron and Lucent negotiating EMS deal News & Analysis 1/31/2002 Post a comment Solectron Corp. said today it is negotiating toward an agreement to purchase specialized equipment and usable inventory from Lucent Technologies for between $250 million and $290 million in cash.
Connect One rolls out chip for Internet-enabled applications News & Analysis 1/31/2002 Post a comment PHOENIX -- Connect One Semiconductors Inc. here today announced what the company claims is the world's first chip that enables Internet access between dial-up or wireless modems and Ethernet-based local-area networks (LANs).
The device--dubbed the iChip Plus--can be connected to a LAN, phone line or wireless modem for Internet connectivity. The chip requires no host processor and works with any operating system.
Belden makes profit but cuts more jobs News & Analysis 1/31/2002 Post a comment Belden Inc. reported net income in its fourth fiscal quarter ended December 31 of $6.4 million or 26 cents per diluted share, on revenues of $204.8 million. In the year-ago quarter, Belden earned $16.2 million or 66 cents per share on sales of $309.9 million.
TI names DSP expert as principal fellow News & Analysis 1/31/2002 Post a comment Recognizing his contributions to the semiconductor industry, Texas Instruments Inc. has elected Gene Frantz, a foremost authority on digital signal processing, as a TI principal fellow, joining an elite group of four innovators who have reached the highest rung on TI's technical ladder.
Canon's IC-equipment sales falls 29% in Q4, but reports banner year in litho business News & Analysis 1/31/2002 Post a comment TOKYO -- Canon Inc.'s semiconductor-equipment unit posted sales of $472 million in the fourth quarter ended Dec. 31, down 24.6% from the like period a year ago and a 29.4% decline from the previous period.
The company's chip-equipment unit also posted an operating loss of $37.6 million in the quarter, compared to a profit of $54 million in the like period a year ago.
Vishay acquires Sensortronics units News & Analysis 1/31/2002 Post a comment Vishay Intertechnology Inc. is back on the acquisition trail with an announcement today that it has added the transducer and strain gage businesses of Sensortronics Inc. to its operation.
AMD taps UMC as foundry partner to build processors News & Analysis 1/31/2002 Post a comment Advanced Micro Devices late Thursday will hold a press briefing to announce it has selected United Microelectronics Corp. of Taiwan as its long-awaited foundry partner to make microprocessor chips.
The announcement ends weeks of speculation after AMD President Hector Ruiz two weeks ago said a foundry would be named this quarter.
AMD so far provided no details of what the foundry agreement will include or what chips UMC may make for the processor firm. Because Ruiz two weeks ago highlighted th
Anger greets MPEG-4 licensing scheme News & Analysis 1/31/2002 Post a comment MPEG LA, an independent agency designed to provide one-stop technology standards licensing, will disclose the terms and conditions of its licensing structure for MPEG-4 video on Thursday (Jan. 31), EE Times has learned. Some service providers and content owners of are reportedly unhappy with the new licensing structure.
ATMI sees pick-up at end of Q4 to push sales 4% higher News & Analysis 1/31/2002 Post a comment DANBURY, Conn.--Semiconductor materials and services supplier ATMI Inc. reported a 4% sequential increase in revenues to $41.4 million in the fourth quarter compared to $39.7 million in Q3. ATMI's sales were 52% lower than $86.8 million in Q4 of 2000.
Quarter-brick powers comms News & Analysis 1/31/2002 Post a comment Celestica's QHS40 series, a quarter-brick converter (2.28 x 1.45 x 0.4 inch) that can deliver 40 A, is suited for Internet infrastructure gear.
Single-chip codec includes S/PDIF audio transceiver News & Analysis 1/31/2002 Post a comment A single-chip audio codec from Asahi Kasei Microsystems Semiconductor Inc. (AKM) features a 192-kHz digital-to-analog converter; a 24-bit, 96-kHz analog-to-digital converter; and a 192-kHz Sony/Philips Digital Interface (S/PDIF) audio transceiver.
Distribution panel for 8 breakers Product News 1/31/2002 Post a comment Unipower Telecom's DPAC1U Series ac circuit breakers, only 1U high (1.75 inches) for 19- or 23-inch relay racks, provide ac distribution and overload protection for two to eight circuits.
TI gate drivers rev motor apps News & Analysis 1/31/2002 Post a comment Texas Instruments Inc. said its UCC37323/4/5 dual-MOSFET gate drivers, intended for a variety of switch-mode supply, low-voltage synchronous rectifier dc/dc converters and fractional-horsepower motor-control applications, feature a peak current output that's two to three times that of their closest competitor.
HEXFETs up current capacity News & Analysis 1/31/2002 Post a comment International Rectifier's 100-volt IRFB4710 and IRFS4710 HEXFET power MOSFETs will increase power density in 48-V input, half- or full-bridge topologies used in higher-performance dc/dcs geared for telecommunication and data-communication applications.
3-phase dc/dc chip set said to meet Intel specs News & Analysis 1/31/2002 Post a comment Analog Devices Inc. says that its ADP3204 dc/dc controller chip, when combined with the the recently launched ADP3415 dual MOSFET driver, forms a three-phase controller/driver chip set that complies with Intel's Mobile Voltage Positioning (IMVP-III) specification.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.