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Content posted in January 2003
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Intergraph files suit against TI
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1/31/2003   Post a comment
Four months after its legal victory over Intel Corp., Intergraph Corp. has filed suit against Texas Instruments Inc., charging that TI's digital signal processors (DSPs) infringed upon its RISC technology for defining key aspects of parallel instruction computing (PIC).
IP users plead for better verification
News & Analysis  
1/31/2003   Post a comment
SoC designers have many reasons to be skeptical about intellectual property that they didn't create themselves, but none causes so much as angst as the thought of buying a core that doesn't work as it's supposed to.
Förstår Messing situationens allvar?
News & Analysis  
1/31/2003   Post a comment
Jag känner mig inte säker på att biträdande näringsministern Ulrika Messing verkligen har förstått innehållet i Vinnovas förslag om vad som behövs för att "väcka liv" i den svenska utbildnings-, forsknings- och utvecklingsverksamheten. Vinnova-förslaget talar om Finlands och Tysklands stora satsningar för att underlätta så att forskning och forskningsresultat så snabbt som möjligt skall kunna leda till konkurrenskraftiga produkter. Ulrika Messing levererar ett "goddagyxskaftssvar" och pekar på d
Transmode utser Walker and Associates till distributör i USA
News & Analysis  
1/31/2003   Post a comment
Transmode Systems AB, svensk leverantör av fiberoptisk transmissionsutrustning, och Walker and Associates, Inc en amerikansk tjänsteleverantör och distributör av telekommunikationsutrustning, har ingått ett avtal, enligt vilket Walker and Associates skall marknadsföra, återförsälja och erbjuda support för Transmodes CWDM-system på den amerikanska marknaden.
Commentary: Novel strained-silicon substrate simplifies SOI fabrication
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1/31/2003   Post a comment
Strained-silicon technology is being touted as a way to extend CMOS performance by enhancing the intrinsic current-drive capability of MOSFETs. And, thanks to performance benefits associated with the reduction of parasitic capacitance, silicon-on-insulator technology has also been adopted by various high-end logic vendors and others are considering deploying products on SOI soon.
Prepping high-V devices for SoC integration
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1/31/2003   Post a comment
System-level integration for computers, network routers and the like may be just a matter of logic functions, memory and a few phase-locked loops. But for industrial and consumer systems, much of the circuitry that remains to be integrated onto a system-on-chip (SoC) is made of nastier stuff: mixed-signal or precision analog circuits and, the nemesis of CMOS logic chips everywhere, high-voltage devices.
Microsoft's Xbox slowdown impacts Focus
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1/31/2003   Post a comment
An apparent slowdown for Microsoft Inc.'s Xbox game machine is beginning to hit the supply chain, as the software giant is pushing out chip orders from various suppliers.
IP users plead for better verification
News & Analysis  
1/30/2003   Post a comment
SoC designers have many reasons to be skeptical about intellectual property that they didn't create themselves, but none causes so much as angst as the thought of buying a core that doesn't work as it's supposed to.
MSL reports profit for last quarter
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1/30/2003   Post a comment
hedline goes here
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1/30/2003   Post a comment
Hitachi sets lofty goals for IT and fab-tools units
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1/30/2003   Post a comment
Attempting to regroup after a period of restructuring, Japan's Hitachi Ltd. today unveiled a new business plan, including an effort to jumpstart its disk drive, fab-tool, fuel cell, and radio-frequency (RF) chip units.
IEEE 802.16 spec could disrupt wireless landscape
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1/30/2003   Post a comment
The IEEE Standards Authority on Wednesday (Jan. 29) approved the 802.16a specification for wireless metropolitan-area networks (MANs) in the 2- to 11-GHz range, giving a seal of approval to technology that one executive said could enable a disruptive change in communications.
Docomo to replace batteries in handsets that risk overheating
News & Analysis  
1/30/2003   Post a comment
NTT Docomo will replace the battery packs in about 840,000 mobile phones manufactured by NEC Corp. that risk overheating due to "a hardware conflict between the battery pack and the handset," the company said Wednesday (Jan. 29).
Hynix says loss widened in fourth quarter
News & Analysis  
1/30/2003   Post a comment
Hynix Semiconductor Inc. on Thursday reported a net loss of $1.66 billion for 2002, down from a net loss of $4.34 billion for the previous year.
IXYS in the red despite revenue growth
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1/30/2003   Post a comment
IXYS Corp. recorded a net loss of $1.1 million, or 3 cents per share, on sales of $35.5 million in its third 2003 fiscal quarter ended December 31.
FCC allocates spectrum for 3G services
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1/30/2003   Post a comment
The Federal Communications Commission moved on Thursday (Jan. 30) to free up 30 MHz of spectrum for new wireless services.
Tvia names advisor to seek 'strategic alternatives'
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1/30/2003   Post a comment
Chip maker Tvia Inc. today said it has appointed Alliant Partners as its financial advisor "in accordance with its commitment to increase shareholder value."
Amkor has loss in fourth quarter
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1/30/2003   Post a comment
UMC, Faraday prep 90-nm IP cores and libraries
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1/30/2003   Post a comment
Preparing for a wave of next-generation chips, Taiwan's Faraday Technology Corp. here today announced the development of test chips and design libraries--based on United Microelectronics Corp.'s 90-nm process technology.
FCC allocates spectrum for 3G
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1/30/2003   Post a comment
The Federal Communications Commission moved on Thursday (Jan. 30) to free up 30 MHz of spectrum for new wireless services.
ChipPAC's Q4 losses widen on declining sales
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1/30/2003   Post a comment
ChipPAC Inc. today reported sales of $92.7 million for the fourth quarter ended Dec. 31, up 20.7% from $76.8 million in the same quarter a year ago, but a 2.1% decline from the previous quarter.
Xilinx reicht 300-mm-Preisvorteil an Kunden weiter
News & Analysis  
1/30/2003   Post a comment
Preissenkungen um bis zu 50 Prozent plant Xilinx für seine Field Programmable Gate Arrays (FPGA) 'Virtex 2 Pro'. Grund für die freudige Nachricht: Die Fertigung wird auf 300-mm-Wafer umgestellt.
Processor makers jump on security bandwagon
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1/30/2003   Post a comment
Microprocessor makers are rushing to add encryption and data security features to their chips as the technology rapidly becomes a must-have item for PCs and wireless devices.
testing ebn ....
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1/30/2003   Post a comment
test
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1/30/2003   Post a comment
Irish research awards honour international talent
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1/30/2003   Post a comment
Fourteen international scientists have been awarded 1.7m in research funds to continue their work in Ireland. The E.T.S Walton Visitor Awards, named after Ireland's 1951 Nobel prize-winning physicist, aim to bring researchers to Ireland following their nomination by Irish research institutions.
Canon's litho group driven into loss by difficult 2002
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1/30/2003   Post a comment
TOKYO -- Semiconductor equipment sales by Canon Inc., a top three supplier of lithography systems behind and ASML and Nikon, suffered in 2002 with the division posting a 24.6% decline in sales compared with 2001 and making a loss.
Anadigics sales slide, posts loss for quarter and year
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1/30/2003   Post a comment
WARREN, New Jersey -- Gallium-arsenide RF IC provider Anadigics Inc. reported a net loss of $7.0 million on sales of $18.7 million in its fourth quarter. This compares with net sales of $21.0 million and a net loss of $24.7 million in the fourth quarter of the prior year. The sales were down sequentially, for the second quarter running, from $21.3 million in the third quarter although losses were also trimmed.
MPLS Forum, Frame Relay Forum to merge
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1/30/2003   Post a comment
The Frame Relay Forum and Multi-Protocol Label Switching Forum finalized plans Wednesday (Jan. 29) to merge their two organizations, creating the MPLS and Frame Relay Alliance.
Faraday launches configurable DSP core
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1/30/2003   Post a comment
ASIC design services firm Faraday Technology Corp. is rolling out the next generation of its embedded DSP core featuring parallel execution, user-configurable memory and a caching scheme to increase instruction set execution.
Tektronix présente les analyseurs pour les conceptions 2.5/3G
News & Analysis  
1/30/2003   Post a comment
Tektronix développe une nouvelle série d'analyseurs de communication, la nouvelle série WCA200A, pour les applications sans fil 2.5G émergentes et de troisième génération (3G) utilisables pour les tests de production et de R&D.
Infineon's Schumacher to advise VC, report says
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1/30/2003   Post a comment
LONDON -- Ulrich Schumacher, president and chief executive of German chipmaker Infineon Technologies AG is to join the venture advisory board of U.S.-based private equity firm The Carlyle Group, according to a Dow Jones Business News report.
Infineon, lien Nazomi pour le kit Java accéléré TriCore
News & Analysis  
1/30/2003   Post a comment
Infineon Technologies est en train de développer une plate-forme de référence TriCore Java accéléré suivant un accord conclut avec Nazomi Communications.
Les résultats mitigés de TSMC reflètent une perspective incertaine
News & Analysis  
1/30/2003   Post a comment
Leader des fonderies, la Société 'Taiwan Semiconductor Manufacturing Co.', a clos l'exercice de 2002 bénéficiaire, avec augmentation de profit annuel de 49 %. La société envisage cependant le début de 2003 avec une certaine prudence vu la marginalité de l'augmentation des ventes au quatrième trimestre et le resserrement du profit trimestriel.
Japan's fab-tool book-to-bill hits 1.09
News & Analysis  
1/30/2003   Post a comment
Japanese semiconductor equipment makers realized a book-to-bill of 1.09 for the month of December, top the parity figure for the first time in four months, according to a report from the Dow Jones news service, which cited the Semiconductor Equipment Association of Japan (SEAJ).
Les fabricants japonais tournent le dos aux systèmes d'exploitation exclusifs constructeur
News & Analysis  
1/30/2003   Post a comment
Les fabricants japonais d'électronique grand public rejettent les efforts visant à élargir l'utilisation des systèmes d'exploitation exclusifs constructeur pour s'orienter vers les systèmes d'exploitation libres, tout particulièrement Linux.
La carte MIPS permet d'utiliser des instructions définies par l'utilisateur pour les noyaux de proce
News & Analysis  
1/30/2003   Post a comment
MIPS Technologies Inc. est entré dans la course pour la fourniture de noyaux de microprocesseurs qui acceptent les instructions personnalisées, en déclarant que cette innovation donne aux concepteurs une solution de rechange à la logique et aux coprocesseurs câblés.
Une start-up de la technologie reconfigurable s'associe à Toshiba pour pousser l'architecture SoC
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1/30/2003   Post a comment
Elixent Ltd., un développeur de technologie matricielle reconfigurable destinée à doter d'une capacité de programmation dynamique les architectures ASICs et System-on-Chip (toutes intégrées), a accepté de travailler avec Toshiba au développement d'une plate-forme SoC pour l'électronique grand public sur la base de son architecture.
Nortel to supply long-haul optical switches to China Netcom
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1/30/2003   Post a comment
The rush to deploy optical backbones in metro regions of China is now extending to long-haul networks.
Emulation's BGA socket adapter does double duty
News & Analysis  
1/30/2003   Post a comment
Emulation Technology's ball grid array socket emulator adapter converts a BGA production socket into an emulator adapter.
Adapters support ICs from Atmel
News & Analysis  
1/30/2003   Post a comment
Two Atmel T89C51CC02 device-programming adapters are available from Logical Systems Corp.
LeCroy unveils general-purpose DSOs
News & Analysis  
1/30/2003   Post a comment
LeCroy Corp.'s WavePro 7100 (1-GHz) and WavePro 7300 (3-GHz) digital oscilloscopes (DSOs) feature the company's X-Stream Technology and WaveShape Analysis capability at a price point that LeCroy says should have broader appeal than the top-of-the-line WaveMaster oscilloscopes, which have bandwidths up to 6 GHz.
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