24-bit audio DAC delivers longer music playback Product News 1/30/2008 Post a comment Aimed at mobile music applications, ST's single-chip STw5210, a 24-bit audio DAC with playback time extender technology, reduces system power consumption for longer music playback, and incorporates on-chip power management, enabling direct connection to a battery.
Omron absorbs chip subsidiary News & Analysis 1/30/2008 Post a comment In the latest restructuring in Japan's IC industry, Omron Corp. plans to combine and absorb its separate chip subsidiary, Omron Semiconductors Co. Ltd.
Rim Semi buys Broadband Distance News & Analysis 1/30/2008 Post a comment Rim Semiconductor Co., a company that develops technology for telecommunications service providers, has acquired Broadband Distance Systems Inc., a subsidiary of Utek Inc., in a stock transaction.
Automotive, applications dominate DATE 08 News & Analysis 1/30/2008 Post a comment The most prominent topics for the DATE 08 EDA software conference and exhibition will be automotive designs and embedded application development. The focus shift mirrors the increasingly 'European' character of the event.
NXP powers ahead with programmable LTE modem Product News 1/30/2008 Post a comment NXP Semiconductors (Eindhoven, the Netherlands) is set to demonstrate at next month's Mobile World Congress in Barcelona a multi-mode, programmable LTE modem that will be the basis of a software defined radio system from the company.
HP leads TI in top 30 MEMS ranking for 2007 News & Analysis 1/30/2008 Post a comment Hewlett Packard Co. was the largest MEMS maker in 2007 with more than $850 million of trade driven by its inkjet print-head based on its scalable printing technology, according to market research organization Yole Developpment (Lyon, France). The top 30 vendors are estimated to have MEMS sales of $5.6 billion, representing about 80 percent of the global market.
Qimonda bets on DRAM demand beyond PC News & Analysis 1/30/2008 Post a comment Memory maker Qimonda saw its sales precipitate during the past quarter. At the company's shareholders annual meeting in Munich, Qimonda CEO Kin Wah Loh gave a cautiously optimistic forecast, betting on consumer electronics to replace the PC market as main demand driver.
UMC's Q4 profits drop, capex down News & Analysis 1/30/2008 Post a comment Amid capital spending cuts for 2008, Taiwan's United Microelectronics Corp. (UMC) posted lackluster results for Q4 of 2007. On the bright side, UMC began to process wafers at the 45-nm node.
DesignCon probes high-speed signaling issues News & Analysis 1/30/2008 Post a comment As signals move deeper into multi-gigabit territory, engineers are calling for more attention to the rising problems of modeling the interrelated affects of power, signaling and timing, issues that will be debated at next week's DesignCon event.
8-bit MCUs deliver 1.8-3.3-V operation Product News 1/29/2008 Post a comment Freescale Semiconductor is extending its popular low-end, 8-bit HCS08 microcontroller (MCU) family with the introduction of two high-performance devices, aimed at consumer and industrial applications.
IBM, Cabot to devise CMP technology News & Analysis 1/29/2008 Post a comment Cabot Microelectronics Corp. has entered into an agreement with IBM Corp. to jointly develop chemical mechanical planarization (CMP) technology for next-generation chips.
IMF cuts global growth forecast on U.S. weakness News & Analysis 1/29/2008 Post a comment World economic growth in 2008 is forecast to decline in 2008, shaved down by growing consumer, financial and manufacturing weakness in the United States and other developed nations that are also battling inflation concerns.
Chinese analog IC maker tips $75 million IPO plan News & Analysis 1/29/2008 Post a comment BCD Semiconductor Manufacturing Ltd. (Shanghai, China), an analog integrated device manufacturer (IDM) based in Greater China, said Monday (Jan. 28) that is has filed a registration statement with the United States Securities and Exchange Commission for a proposed initial public offering of American Depository Shares.
SMIC to build more 200-, 300-mm fabs News & Analysis 1/29/2008 Post a comment China's Semiconductor Manufacturing International Corp. (SMIC) has struck a deal with the Shenzhen municipal government under which the foundry provider will build new and separate 200- and 300-mm fabs in that region.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.