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Content posted in January 2009
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Fujitsu to shut fabs, shift workers amid losses
News & Analysis  
1/31/2009   Post a comment
Like other chip makers in Japan, Fujitsu Ltd.'s semiconductor unit is in trouble.
ITC to review determination against Tessera
News & Analysis  
1/30/2009   Post a comment
The U.S. International Trade Commission will review an initial determination by an administrative law judge which found that wireless semiconductor manufacturers did not violate patents held by Tessera Technologies, according to a statement issued by Tessera.
MagnaChip scraps IPO bid
News & Analysis  
1/30/2009   Post a comment
South Korea's MagnaChip Semiconductor has dropped its bid for an initial public offering in the U.S., citing unfavorable market conditions.
Cadence CTO moving on
News & Analysis  
1/30/2009   Post a comment
Ted Vucurevich, a longtime executive at Cadence Design Systems and the company's chief technology officer for the past several years, confirmed that he is leaving the EDA vendor.
First 2 TB hard drives from WD
Product News  
1/30/2009   Post a comment
The new WD Caviar Green 2 TB claims to be the largest capacity hard drive on the market today.
Tzero readies mobile UWB chip
Product News  
1/30/2009   2 comments
Startup Tzero Technologies hopes 2009 will be the year ultrawideband establishes a foothold and sketched out plans for a new mobile chip that is the latest part of its two-pronged strategy.
Integrated bi-directional OVP device protects portable electronics
Product News  
1/30/2009   Post a comment
ON Semiconductor has introduced the industry's first integrated bi-directional device, with positive and negative (+/-) overvoltage protection (OVP) for cell phones, MP3/4, PDAs and GPS systems, and overcurrent protection (OCP) for portable accessories such as FM transceiver, load speakers and flash modules.
Environmentally responsible battery chargers enhance internal protection for handsets
Product News  
1/30/2009   Post a comment
Improved smaller-dimension circuit-protection devices have been introduced by STMicroelectronics to enable safer use of universal chargers with the aim of reducing the number of battery chargers discarded along with obsolete portable devices such as cellphone handsets, GPS receivers, and personal media players.
Conexant reports loss, job cuts
News & Analysis  
1/30/2009   Post a comment
Fabless semiconductor vendor Conexant Systems has eliminated approximately 140 jobs--or 11 percent of its work force--as part of a cost-reduction plan expected to save the company about $4 million per quarter.
Maxim cuts jobs, posts loss
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1/30/2009   Post a comment
Analog chip maker Maxim Integrated Products Inc. has cut jobs amid a loss, according to an analyst.
AMCC CEO to step down amid revenue decline
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1/30/2009   Post a comment
Applied Micro Circuits Corp. President and CEO Kambiz Hooshmand will step down on June 1 after the company reported a $274.5 million fiscal third quarter net loss due largely to a $264.1 million non-cash write-down of goodwill.
NEC cuts 20,000 jobs, seeks help for chip unit
News & Analysis  
1/30/2009   Post a comment
As the global slowdown rocks Japanese electronics companies, Toshiba Corp is reportedly in talks to merge part of its chip operations with NEC Corp's semiconductor unit
Hitachi warns of $7.8B loss, to restructure
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1/30/2009   Post a comment
Hitachi Ltd joins a growing list of Japanese technology giants affected by the deepening recession.
R&D outlook positive despite economic turmoil, says poll
News & Analysis  
1/30/2009   Post a comment
The idea that a recession is the right time to invest in R&D is reflected in the findings of an EE Times Europe poll that sees a marginally positive outlook for R&D spending over the next year.
Beyer: Freescale can weather 'pessimistic' industry scenario
News & Analysis  
1/30/2009   1 comment
Ten months into his tenure as chairman and CEO at Freescale Semiconductor Rich Beyer says he is positive about the company's prospects and sees it emerging from the current "miserable" downturn a stronger competitor despite a raft of problems, debts and liquidity concerns.
Updated: ESI, K&S, Ultratech disclose layoffs
News & Analysis  
1/30/2009   Post a comment
It was a horrible week for semiconductor equipment.
New 3-D TV format to be demo'd during Super Bowl
Product News  
1/30/2009   Post a comment
The 3DTV format is set to make a splash in primetime during Sunday's Super Bowl and a broadcast movie.
Renesas CEO retires; firm cuts jobs and shuts fabs
News & Analysis  
1/30/2009   Post a comment
Japanese chip maker Renesas Technology Corp. has replaced its top executive amid losses, layoffs and plans to shutter older fabs.
Intel's Barrett blogs Davos, rejects economic isolationism
News & Analysis  
1/30/2009   Post a comment
Intel Corp. Chairman Craig Barrett is attending the World Economic Forum in Davos, Switzerland, and has put his cards on the table--or rather his words in a blog.
ST, Qimonda, Intel lead weekly story ranking
News & Analysis  
1/30/2009   Post a comment
Here are the top five online stories for the week beginning Sunday, Jan. 25, as ranked by EE Times Europe readers, up to and including Friday, Jan. 30. The ranking is based on the number of reader "views" or "hits" on a particular article.
Trowbridge set to become chairman of Renesas Europe
News & Analysis  
1/30/2009   Post a comment
Renesas Technology Europe, subsidiary of Japanese semiconductor company Renesas Technology Corp., has announced that Tsutomu Miki has been appointed to become chief executive officer of Renesas Technology Europe Ltd. on April 1, 2009. Current CEO Matthew Trowbridge is due to take up the position of chairman of Renesas Technology Europe from that date and remain a director of the company.
Insolvenzverwalter will Qimonda am Stück verkaufen
News & Analysis  
1/30/2009   Post a comment
Für den insolventen DRAM-Hersteller tickt die Uhr: Der Insolvenzverwalter sucht eine Gesamtlösung für das Unternehmen — aber die Zeit ist knapp.
STM garde la confiance des brokers
News & Analysis  
1/30/2009   Post a comment
La société de courtage Nomura Securities a réduit ses estimations et ses objectifs de cours pour STMicroelectronics NV, mais reste confiant sur le long terme malgré un diminution estimée du chiffre d'affaire de 25 à 30 pourcent pour 2009.
Analog among key business units for Renesas realignment
Product News  
1/30/2009   Post a comment
Renesas has announced a major restructuring plan, prompted by a projected sharp drop in 2008 sales and income loss.
Low cost, small chip integrates GPS, Bluetooth and FM transceiver
News & Analysis  
1/30/2009   Post a comment
CSR has launched BlueCore BC7830, which claims to be the smallest GPS combination device designed for mobile handsets. Measuring a mere 11mm² in silicon size, the BC7830 includes GPS, Bluetooth v2.1+EDR, FM transmit and receive technologies and support for Bluetooth low energy all on a single chip.
GaN HEMT transistors target W-CDMA, LTE and WiMAX telecommunications applications
News & Analysis  
1/30/2009   Post a comment
Cree has released two 120W, highly efficient GaN HEMT microwave transistors in sample quantities for telecommunication applications such as W-CDMA, LTE and WiMAX, designated CGH21120F and CGH25120F.
Evatronix enhances its 8051 microcontroller core
News & Analysis  
1/30/2009   Post a comment
Intellectual property licensor Evatronix SA (Bielsko-Biala, Poland) has produced an enhanced version of its configurable 8051 8-bit microcontroller core.
Administrator wants to avoid breaking up Qimonda, but time is short
News & Analysis  
1/30/2009   Post a comment
For insolvent DRAM manufacturer Qimonda, the clock is ticking. While the insolvency administrator reports first contacts with potential suitors, the time line is tight.
Jobs go at RS as distributor reorganizes
News & Analysis  
1/30/2009   Post a comment
Global distribution group Electrocomponents plc, which trades in the U.K and most of Europe as RS Components, is laying off 340 permanent staff, releasing 90 temporary agency staff but is also creating 150 positions as it reorganizes the way it does business.
Exec calls for laser diode foundry
News & Analysis  
1/30/2009   Post a comment
The photonics component business needs to adopt a foundry model to deal with an over capacity in laser diode manufacturing, according to a panel of senior executives from laser component makers at Photonics West here.
Army boosts flexible display research
Product News  
1/30/2009   Post a comment
Researchers at Arizona State University developing display technology have renewed an R&D contract with the U.S. Army for an additional five years at ASU's Flexible Display Center.
Freescale finds no buyer; to sell wireless IC unit piecemeal
News & Analysis  
1/30/2009   Post a comment
Freescale Semiconductor said it may have to break up and sell pieces of its wireless IC business to different buyers because it could not find a single purchaser for the division.
Chartered cuts 600 jobs, posts loss
News & Analysis  
1/29/2009   Post a comment
Amid a loss, a reduction in capital spending and a poor outlook, Singapore's Chartered Semiconductor Manufacturing Pte. Ltd. is reducing its worldwide workforce by approximately 600 people, or about 8 percent of its total employment.
Microsemi assesses penalties against CEO
News & Analysis  
1/29/2009   Post a comment
Microsemi Corp. has assessed financial penalties against its CEO for misrepresenting his academic credentials.
Video: Christensen on disruption in health care
News & Analysis  
1/29/2009   Post a comment
Health care will follow the model of the computer industry, creating waves of disruption with increasingly de-centralized systems and services, according to business guru Clayton Christensen who is spending time lobbying lawmakers to help make it come true.
Freescale posts $4B loss in Q4, $8B loss in '08
News & Analysis  
1/29/2009   Post a comment
Freescale Semiconductor Inc. continues to spill red ink. It lost nearly $8 billion in 2008, but real question is clear: How long can this go on?
Tiny blue lasers for micro-projectors, red and green coming soon
Product News  
1/29/2009   Post a comment
OSRAM's new blue laser diode has all the important attributes required for micro-projectors.
High performance GaN RF power amplifier targets wireless applications
Product News  
1/29/2009   Post a comment
IXYS Corporation's Microwave Technology, Inc. (MWT) division has introduced a family of three high linearity and high efficiency RF power amplifier products with output power up to 10 W based on advanced high quality GaN device technology.
U.K. foundry ceases supply to Zarlink
News & Analysis  
1/29/2009   Post a comment
Zarlink Semiconductor Inc. has taken proactive measures to protect wafer supply, following MHS Electronics UK Ltd.'s advice that it is likely to cease wafer supply to Zarlink from the analog foundry in Swindon, U.K.
Putin's verbal judo throws Michael Dell
Product News  
1/29/2009   Post a comment
Russian Prime Minister Vladimir Putin had a sharp exchange with Michael Dell, CEO of Dell Computers, at the World Economic Forum in Davos, Switzerland.
VLSI cuts fab-tool outlook to minus 49%
News & Analysis  
1/29/2009   Post a comment
VLSI Research Inc. has reduced its IC-equipment forecast--again.
NEC shuts fab line, post loss
News & Analysis  
1/29/2009   Post a comment
NEC Electronics Inc.'s U.S. unit will close its 6-inch wafer fab line at its manufacturing facility in Roseville, Calif. by the end of March 2010.
Toshiba delays fabs, cuts capex and jobs
News & Analysis  
1/29/2009   Post a comment
Hit hard by the IC downturn, Japan's Toshiba Corp. outlined several cost-cutting moves, including plans to delay two NAND flash fabs.
Toshiba, SanDisk revamp fab venture
News & Analysis  
1/29/2009   Post a comment
SanDisk Corp. has once again restructured its fab venture with Toshiba Corp.
Analysis: Intel could kill two birds with one R&D stone
News & Analysis  
1/29/2009   Post a comment
If you look at the selection of Intel- and Europe-oriented headlines over the last few days it is clear how Intel could be well-served by the recently announced formation of Intel Labs Europe.
Intel forms Intel Labs Europe with hubs in Dublin, Munich
News & Analysis  
1/29/2009   1 comment
The world's largest chip company, Intel Corp. (Santa Clara, Calif.), has announced the formation of Intel Labs Europe with "open labs" being formed in Leixlip, Ireland and Munich, Germany.
Czech Republic sees FDI drop off
News & Analysis  
1/29/2009   Post a comment
FDI in the Czech Republic fell dramatically in 2008 as the country received more investment into R&D projects than manufacturing for the first time
Finland poured $677M into R&D last year
News & Analysis  
1/29/2009   Post a comment
The Finnish Funding Agency for Technology and Innovation invested a total of 516M euros ($677M) in research, development and innovation projects last year.
Analysis: Broker, EC keep faith with STMicroelectronics
News & Analysis  
1/29/2009   Post a comment
Brokerage firm Nomura Securities has sharply reduced its estimates and share price targets for STMicroelectronics NV, but remains upbeat about the long term outlook for the chipmaker despite the hefty decline expected in Q1 and 25-30 year-on-year decline for all of 2009.
3S Photonics diversifie son activité hors des télécoms
News & Analysis  
1/29/2009   Post a comment
Le spécialiste français de l’optoélectronique, leader mondial en matière de composants pour réseaux télécoms, lance son premier produit pour applications non-télécoms avec le module laser de pompe monomode à 1064 nm, baptisé 1064 CHP
Page 1 / 16   >   >>


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