Nanotech boosting piezoelectrics, thermoelectrics News & Analysis 1/27/2011 2 comments Nanoscaling critical dimensions of advanced piezoelectric and thermoelectric materials is inching them toward commercial energy harvesting applications, according to separate research groups at Northwestern University and Boston College.
Firms hatch landfill electricity plant News & Analysis 1/27/2011 5 comments Is this the next big thing in energy? The Republic Services Vasco Road Landfill will be home to a new 4.3 megawatt landfill gas-to-electricity plant that will be owned and operated by Ameresco Inc.
Icera aims Espresso at smartphones Product News 1/27/2011 4 comments Fabless chip company Icera Inc. has announced it is sampling the latest chip set and software in its Espresso series of platforms targeted at HSPA+ smartphones.
Europe awards contract to assess 450-mm pilot line News & Analysis 1/27/2011 Post a comment Two consultancy firms with expertise in the semiconductor industry – Future Horizons Ltd. and Decision SA – have been awarded a one-year joint contract to assess the benefits of a 450-mm semiconductor prototyping line being located in Europe.
Four-core ARM A9 to run Sony game console News & Analysis 1/27/2011 18 comments Sony Computer Entertainment Inc. (SCE) has announced its next-generation portable entertainment system (codenamed NGP) will be run on a four-core Cortex-A9 processor from ARM and a PowerVR SGX543MP4+ graphics core from Imagination Technologies. NGP will make its debut at the end of the year 2011, Sony said.
EDA firm Calypto names new CEO News & Analysis 1/27/2011 Post a comment Privately held EDA vendor Calypto Design Systems announced that Doug Aitelli, currently the company's current vice president of worldwide sales, would assume the position of CEO.
GE's SBC324 3U OpenVPX rugged SBC features quad core processor operating at up to 2.1GHz Product News 1/26/2011 Post a comment GE Intelligent Platforms has rolled the second in its family of new products that take advantage of the 2nd Generation Intel Core i7 processors – formerly codenamed ‘Sandy Bridge’. The SBC324 3U OpenVPX rugged single board computer features a quad core processor operating at up to 2.1GHz, coupled with up to 8GBytes of DDR3 1,333MHz memory for exceptional performance in size-, weight- and power-constrained applications in harsh environments such as unmanned vehicles.
SIA sends wish list to Obama News & Analysis 1/26/2011 4 comments The U.S. Semiconductor Industry Association (SIA) said that it was encouraged by President Obama’s State of the Union address.
Tech takeaways from Obama's State of the Union News & Analysis 1/26/2011 44 comments Excerpts from U.S. President Barack Obama's third State of the Union address before Congress, in which he emphasized science, technology and engineering more than any State of the Union in recent memory.
Evaluation copy of OKL4 Verified secure microkernel offered by OK Labs Product News 1/26/2011 Post a comment Open Kernel Labs (OK Labs) offers download of OKL4 Verified, a fully verified, bug-free secure microkernel for business-critical and mission-critical applications in mobile/wireless devices. Device manufacturers (OEMs), mobile network operators (MNOs), application developers, researchers, and other interested parties can now download, run, and test OKL4 Verified on embedded ARM11 platforms.
Ramtron's top execs resign News & Analysis 1/26/2011 Post a comment Ramtron International Corp., a supplier of ferroelectric-based low-power memory and integrated semiconductor products, continues to shake up its operations.
ITT Cannon signal connector Product News 1/26/2011 Post a comment ITT Interconnect Solutions has developed a fully sealed (IP69K) RoHS-compliant signal connector, which it says is the first of its kind to withstand temperatures up to 150°C.
UMC raises profit, sees Q1 slowdown News & Analysis 1/26/2011 Post a comment Foundry chipmaker United Microelectronics Corp. posted steady results in the fourth quarter, but the foundry vendor sees a slowdown in the first quarter of 2011 with both wafer shipments and average selling price per wafer falling.
CSR signs A5, A9 multicore deals with ARM News & Analysis 1/26/2011 Post a comment Wireless and audio chip vendor CSR plc has signed a deal with ARM Holdings plc under which it has licensed both the Cortex-A5 and the high-end Cortex-A9 cores in multiprocessing form. CSR says it wants to use the cores in automotive navigation and location-aware consumer equipment, especially in Brazil, Russia, India and China.
Engineer jailed for spying News & Analysis 1/26/2011 8 comments Noshir S. Gowadia of Maui, Hawaii was sentenced this week to 32 years in prison for communicating classified national defense information to the People’s Republic of China (PRC), according to the FBI.
GaN depo process said to make brighter LEDs News & Analysis 1/26/2011 5 comments Researchers from North Carolina State University have developed a gallium nitride deposition process said to result in 1,000 times fewer defects, thereby boosting the output of light-emitting diodes as well as other GaN devices such as power transistors.
KKR unloads 10.9 million shares of Avago News & Analysis 1/26/2011 Post a comment Private equity firm Kohlberg Kravis Roberts & Co. (KKR) unloaded 10.9 million shares of Avago Technologies last week reducing its stake in the analog chip vendor to 16 percent from 21 percent, according to a Dow Jones report.
Update: AMEC claims legal win over Lam News & Analysis 1/26/2011 Post a comment China fab tool firm Advanced Micro-Fabrication Equipment Inc. (AMEC) claims that it has prevailed for the second time in a patent infringement suit filed against AMEC subsidiaries by Lam Research Corp. in the Intellectual Property Court of Taiwan.
Update: Altera beats estimates News & Analysis 1/26/2011 1 comment Altera Corp. announced fourth quarter sales of $555.4 million, up 5 percent from the third quarter of 2010 and up 52 percent from the fourth quarter of 2009.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.