Penn keeps predicting chip market growth News & Analysis 1/23/2013 2 comments The chip market will grow by 8 percent in 2013, according to market analyst Malcolm Penn but it depends on how the global economy plays out in 2013. Right now the signs are not good.
ST plans for Dresden FDSOI production News & Analysis 1/20/2013 11 comments ST wants to get volume production of its fully depleted silicon on insulator process up and running as soon as possible and has produced a video outlining the technical advantages of the process.
Facebook covets core-heavy ARM SoCs News & Analysis 1/18/2013 8 comments Vendors need to design simpler server SoCs and lower cost flash if they want to fill the many sockets emerging in data centers for the social networking giant.
Imprint litho firm claims 450-mm first News & Analysis 1/18/2013 8 comments An imprint lithography machine from Texas-based Molecular Imprints has been used for full patterning of 450-mm diameter wafers. The company claims the machine could shorten the transition to 450-mm wafer processing by two years.
ASML sees tough start to 2013 News & Analysis 1/17/2013 2 comments Despite increasing profits in its 4Q12 financial results, slowing orders and engineering challenges dimmed the outlook for chip making equipment vendor ASML Lithography.
TSMC gives brighter outlook as profit rises News & Analysis 1/17/2013 2 comments Leading chip foundry saw strong demand for its wafers driving above-guidance revenue and profit margins in 4Q12 financial results. The company said that because of this it has raised its expectations for 1Q13.
MediaTek, MStar merger delayed News & Analysis 1/16/2013 Post a comment A lack of anti-trust clearances has prompted MediaTek to withdraw a plan to issue additional shares with which to buy rival fabless chip company MStar, according to local reports.
ARM friends Facebook at summit News & Analysis 1/15/2013 2 comments ARM SoC vendors Applied Micro and Calxeda will take part in the Facebook-led Open Compute Summit this week, a sign the social networking giant is poised to move beyond the x86.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.