Korea’ s MagnaChip may revisit IPO News & Analysis 10/26/2010 2 comments After recently scrapping its plan for an initial public offering (IPO) in the U.S., South Korean chip maker MagnaChip Semiconductor Ltd. said it may revisit the IPO again in the future.
STMicro hits Q3 target, names new COO News & Analysis 10/26/2010 Post a comment STMicroelectronics reported revenue for the third quarter in line with consensus analyst expectations and said it expects further growth in sales in the fourth quarter despite softening of demand in some market applications.
Cadence sketches out tools vision News & Analysis 10/26/2010 5 comments Cadence Design Systems, Inc. rolled out a strategy to provide an end-to-end flow silicon and software design tools as part of a new EDA360 campaign.
Four ways to propel U.S. green jobs News & Analysis 10/26/2010 22 comments
SAN JOSE, Calif. - The U.S. needs immediate, decisive investments in the green manufacturing sector, according to Stephanie Burns, chairman, president and CEO of Dow Corning Corp.
Veeco's Q3 sales up big News & Analysis 10/26/2010 Post a comment Chip equipment vendor Veeco its third quarter sales more than tripled compared with the third quarter of 2009, beating consensus analyst expectations for the period.
Qimonda settles with U.S. subsidiaries News & Analysis 10/26/2010 1 comment German chip maker Qimonda said its insolvency administrator has reached a settlement with Qimonda's U.S. subsidiaries, giving the parent company the right to over 800 patents and patent applications, according to a Dow Jones report.
TI posts big Q3 but sees slowdown News & Analysis 10/25/2010 9 comments Texas Instruments Inc. beat Wall Street's estimates for the third quarter, but the chip maker issued a warning about a slowdown in the fourth quarter.
Group takes over GlobalFoundries tech park News & Analysis 10/25/2010 3 comments Amid concerns over infrastructure delays, a New York state agency plans to take over a technology park that houses the new 300-mm fab owned by U.S. silicon foundry upstart GlobalFoundries Inc.
Rohm's BD8381EFV-M LED driver Product News 10/25/2010 Post a comment ROHM Semiconductor has developed LED driver for automotive forward illumination applications that allows designers to specify the same driver for use in high-beam, low-beam and daytime running light circuits.
Modest growth projected for ICs in 2011 News & Analysis 10/25/2010 5 comments Semiconductor industry revenue is projected to grow 5.1 percent in 2011, according to market research firm iSuppli, which predicts the industry will enjoy a "soft landing" after a booming 2010.
Korean analog startup emerges News & Analysis 10/25/2010 12 comments One of the newer players is Silicon Mitus Inc., a supplier of analog and mixed-signal devices that is reportedly causing some headaches for the multinationals, such as Maxim, ST, TI and others.
Scenes from USA tech fest News & Analysis 10/25/2010 8 comments Photos from the USA Science & Engineering Festival, a two-day event held on the National Mall that drew tens of thousands of participants.
Atrenta, TSMC team on soft IP qualification flow News & Analysis 10/25/2010 Post a comment Atrenta Inc., a provider of early design closure solutions, and Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) announced they have joined forces to enhance the quality of delivered synthesizable IP using Atrenta's SpyGlass platform.
Intel's embedded Xeon tackles avionics News & Analysis 10/25/2010 6 comments Mercury Computer systems claims first dibs on ruggedizing Intel's high-performance Xeon server processors to for avionics, space, surveillance and military pattern recognition.
CEA-Leti develops infrared-active 3D imaging matrix Product News 10/25/2010 Post a comment CEA-Leti has unveiled what it claims is the first single-impulse active 3D imaging matrix operating at infrared frequency capable of returning a three-dimensional image of a distant object with a spatial resolution of 30cm from a single-laser flash.
Sigma chips drive home nets three ways News & Analysis 10/25/2010 6 comments Sigma Designs hopes to leapfrog separate coax, telephone or power line home networking chips with a new chip set that supports a mix of new and existing standards over all three wires.
CEL’s MeshConnect EM357 Module delivers best-in-class ZigBee performance Product News 10/22/2010 1 comment California Eastern Laboratories (CEL) is now shipping its new MeshConnect EM357 module, built on the EM357 integrated circuit (IC) for ZigBee from Ember Corp. Designed for ZigBee Pro applications, the module runs the full ZigBee Pro software stack and Smart Energy profile, enabling applications such as smart meters, smart grid, building automation, remote control, and HVAC.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.