Global chip sales rise in August, says ESIA News & Analysis 10/3/2010 Post a comment The three-month average of global sales of semiconductors for August was $25.69 billion, up 1.8 percent compared with the previous month and up 32.6 percent compared with the same month a year before, according to the European Semiconductor Industry Association (ESIA).
Chemical firms merge News & Analysis 10/1/2010 Post a comment Momentive Performance Materials Holdings Inc., the parent company of Momentive Performance Materials Inc., and Hexion LLC, the parent company of Hexion Specialty Chemicals Inc., have completed the previously announced merger of Hexion and Momentive.
Slow growth forecast for home energy nets News & Analysis 10/1/2010 4 comments Consumers are interested in more energy-efficient homes, but utilities are moving slowly into home energy networks, opening a door for independent services, according to Parks Associates
Open-source multicore processor project begins News & Analysis 10/1/2010 53 comments ORSoC AB, a Swedish design house that took over responsibility for maintaining the OpenCores website in 2007, has announced that work has begun on OpenRISC 2000 (OR2K), an upgrade to the open-source OpenRISC 1000 32-bit processor.
Tessera sues Sony, Renesas over stacked ICs News & Analysis 10/1/2010 39 comments Tessera Technologies has said that its semiconductor packaging subsidiary has filed a law suit against Sony and Renesas Electronics alleging the Japanese companies are infringing Tessera's U.S. Patent No. 6,885,106.
Get on board: 20-nm MPW run for SOI scheduled News & Analysis 10/1/2010 Post a comment Research institutes CEA-Leti and Circuits Multi Projets, both based in Grenoble, France, have announced that a 20-nanometer fully-depleted silicon-on-insulator (FDSOI) process will be used on a 300-mm multiproject wafer scheduled to go in September 2011.
Atmel closes sale of smartcard business News & Analysis 10/1/2010 17 comments Atmel Corp. has said it has completed the previously announced sale of its Smart Card (SMS) business based in Rousset, France and East Kilbride, Scotland, to Inside Contactless SA.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.