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Content posted in November 2001
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Heard on the Beat (Nov. 30)
News & Analysis  
11/30/2001   Post a comment
Heard on the Beat, Nov. 30
IBOC digital radio gets industry nod
News & Analysis  
11/30/2001   Post a comment
The National Radio Systems Committee endorsed a digital FM radio broadcast technology Thursday (Nov. 29) and recommended that it be approved as an upgrade to current U.S. analog FM broadcasts.
Sanyo system-in-board package eliminates substrate
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11/30/2001   Post a comment
Sanyo Electric Co. Ltd. has moved one step ahead in system-in-package technology with its Integrated System in Board (ISB) packaging approach.
TEL enhances prober to handle mix of 200- and 300-mm wafers
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11/30/2001   Post a comment
TOKYO -- In a move to increase flexibility and throughput in wafer-test operations, Tokyo Electron Ltd. today announced an enhanced version of its P-12XL prober, which adds a new sort loader, semi-automatic probe card changer, and an improved wide area probe polish feature.
Tellabs to acquire Ocular for $355 million
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11/30/2001   Post a comment
Core-switch vendor Tellabs Inc. said Friday (Nov. 30) that it planned to acquire Ocular Networks Inc., a move that would give Tellabs an infusion of next-generation technology and expand its market into smaller installations.
Japan's SEH shuts down 6-in. wafer lines in U.S., cuts 350 jobs in Vancouver
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11/30/2001   Post a comment
VANCOUVER, Wash. -- Japanese silicon wafer giant Shin-Etsu Handotai Group (SEH) announced plans to shift its 6-inch production lines from the United States to Malaysia--a move that impacts 25.9% of its workforce, or 350 jobs, in its U.S. subsidiary here. In an apparent move to cut costs, SEH America Inc.--the U.S. subsidiary of SEH--on Thursday here announced plans to shift its older-generation, 6-inch wafer polishing lines from its U.S. headquarters in Vancouver, to a sister plant in Kuala Lu
Semiconductor Alert! (Nov. 26-30)
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11/30/2001   Post a comment
Commentary & analysis of week's chip news, Nov. 26-30
MPEG-4 tapped for set-tops, home networks
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MPEG-4 compression technology is gathering steam, earning keen interest from set-top-box vendors and semiconductor companies hungry to add features to current designs, and from service providers eyeing it for home networking and for set-tops integrated with personal video recorders.
Tessera says ITC won't review finding against Sharp in patent case
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SAN JOSE -- Tessera Technologies Inc. today said the U.S. International Trade Commission (ITC) has denied a request from Sharp Corp. for a review of an initial determination by an administrative law judge, who found Sharp in violation of chip-scale packaging patents held by Tessera (see Sept. 26 story).
Customs calls for tighter U.S. borders
News & Analysis  
11/30/2001   Post a comment
implications of tighter trade measures could be felt in the high-tech sector, The U.S. Customs Service is asking traders -- including those within the electronics industry -- to help devise tighter security measures in the wake of the Sept. 11 terrorist attacks on the United States.which will likely have to pass along more information about goods and packages moving through its supply chain.
Alcatel fields PON to deliver triple play of services
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11/30/2001   Post a comment
As cable operators beef up delivery of voice and data services, their networks are increasingly intertwining with optical ones to give a new look to cable's infrastructure. Capitalizing on that new look, Alcatel has developed a passive optical network (PON) scheme, which it demonstrated at the cable industry's Western Show this past week.
Latest missile defense test scheduled
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The Pentagon said Thursday (Nov. 29) that it will conduct its seventh flight test of the missile defense system on Saturday (Dec. 1) over the Pacific Ocean.
Nassda avoids injunction sought by Synopsys
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11/30/2001   Post a comment
Dodging a possibly crippling bullet, Nassda Corp. has avoided a preliminary injunction sought against its flagship product by Synopsys Inc.
ASML pushes out delivery of SVG's 157-nm tool by a year, sources say
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SANTA CLARA, Calif. -- After dropping its 193-nm scanner line earlier this week, the Silicon Valley Group Inc. (SVG) unit of ASM Lithography has reportedly pushed out the delivery of its 157-nm tool to late-2002--or about a year later than previously expected, according to sources. The delay could be another setback for ASML of the Veldhoven, the Netherlands. Plagued by chronic delays, SVG's Micrascan V 193-nm lithography system is being discontinued by ASML, which on Tuesday said it will conve
Light video codec from Asia eyes cell phones, PDAs
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A proprietary video compression scheme with backing from Japan, South Korea and China is looking to give MPEG-4 a run for its money in handheld devices.
Packet voice spurs debate on fate of circuit switches
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Some of the biggest backers of circuit-switched architectures are acknowledging that packetized voice will overtake their analog world soon, but exactly how remains a bone of contention.
ATE, IC-packaging gear, and other tool segments hit hard in Q3, says SEMI
News & Analysis  
11/30/2001   Post a comment
SAN JOSE -- It's safe to say that the chip-equipment market was terrible in the third quarter of 2001, especially for suppliers of back-end gear, according to statistics from the Semiconductor Equipment & Materials International (SEMI) trade group here. Shipments and bookings for all chip-equipment segments were depressed in the third quarter of 2001, but the back-end segments like testers and IC-packaging tools were especially hit hard. In some cases, shipments of automatic-test equipment (A
Slump doesn't ease ASIC time-to-market pressures
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11/30/2001   Post a comment
The economic slump that saw a large number of ASIC designs canceled has not lightened the burden for suppliers when it comes to delivering complex chips on tight schedules.
EBN 100 Stock Index
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Electronics industry may finally have hit bottom
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The long-awaited bottom of the industry downturn may finally have been reached, if recent financial statements issued by key companies are any indication. A host of companies, including Dell, Flextronics, and Intel, have confirmed their earlier forecasts for the current quarter, a refreshing change from previous quarters, when revenue and earnings projections were routinely downgraded as the market continued to deteriorate.
Shift to 450-mm wafers pushed out to 2013, says ITRS roadmap
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11/30/2001   Post a comment
SANTA CLARA, Calif. -- While IC technology is expected to accelerate over the next several years, the shift to 450-mm wafers in chip processing appears to have been pushed out by about four years, from 2008 to 2013, according to the new 2001 International Technology Roadmap for Semiconductors (ITRS). In 1999, an executive from International Sematech predicated that chip makers would move from 300- to 450-mm wafers in IC production sometime in the 2008 time frame. Now, it appears that the shif
Exec sees home nets as future cornerstone of cable services
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11/30/2001   Post a comment
In stronger terms than most leaders in the cable industry usually dare, AOL Time Warner co-chief operating officer Robert Pittman used the Western Show Thursday (Nov. 29) to herald home networking as the key platform to extend the reach of cable beyond the set-top box, beyond cable modems, and beyond the transmission of TV shows to couch potatoes.
Dc/dc line handles heat
Product News  
11/30/2001   Post a comment
C&D Technologies' WPN20R series of dc/dc converters operates over -40 degrees to +105 degrees C with no output power derating, making it ideal for use in environments that require flexibility and robust performance.
Ethernet card hot-swaps
Product News  
11/30/2001   Post a comment
SBS Technologies' CP3-Quad100TX is a hot-swap-capable, 64-bit, 66-MHz Ethernet card for 3U CompactPCI computing applications in telecommunications, medical imaging and industrial automation.
Dainippon Screen teams with IMEC to develop ultra-clean processes for fabs
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11/30/2001   Post a comment
LEUVEN, Belgium -- Dainippon Screen Mfg. Co. Ltd. of Japan and the IMEC research group here announced plans to collaborate in the development of ultra-clean processes for wafer fabrication. The goal is to create new single-wafer cleaning steps that will be four-to-five years ahead of process requirements in the chip industry.
Adapters provide 1394 links via PCI, CardBus
Product News  
11/30/2001   Post a comment
Quatech Inc.'s two IEEE-1394 adapters provide Firewire ports to any desktop or laptop computer via a PCI slot or CardBus drive.
Flextronics lays off 254 workers in New Hampshire
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Flextronics International Ltd. today has laid off 254 New Hampshire workers as part of the company's ongoing restructuring efforts.
Host bus adapters attack storage-net bottlenecks
Product News  
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A family of dual-port, PCI-X host bus adapters (HBAs) from Agilent Technologies Inc. is said to eliminate the performance bottlenecks and interoperability issues typically associated with such devices in 2-Gbit/second Fibre Channel storage-area networks (SANs).
EBX-compliant board totes fast CPU for high reliability
Product News  
11/30/2001   Post a comment
VersaLogic Corp. has equipped its VSBC-8 EBX-compliant single-board computer with a fast CPU, suiting it for applications in medical, military and semiconductor-manufacturing equipment, or other embedded applications requiring high reliability and low downtime.
Mezzanine card makes fast 1394 link
Product News  
11/30/2001   Post a comment
Designed for digital video and audio-processing systems, MEN Micro Inc.'s PC MIP mezzanine card provides 400-Mbit/second performance across an IEEE 1394 connection.
Magnetic modules reduce board space
Product News  
11/30/2001   Post a comment
ulse has launched a line of dual Gigabit Ethernet magnetic modules for networking applications. Designed for Category 5 cable, the modules are said to provide electrical isolation and low common-mode emissions in Ethernet switches.
Sematech warns of bottleneck for 157-nm lithography
News & Analysis  
11/30/2001   Post a comment
While semiconductor industry officials in California upped the ante for advanced IC production technology with the rollout of the 2001 International Technology Roadmap for Semiconductors on Thursday (Nov. 29), a gathering of mostly U.S.-based researchers warned a group of Taiwanese chip manufacturers that numerous obstacles jeopardize a smooth transition to implementing 157-nanometer lithography.
Micrel's EL lamp drivers aim at cell phones, PDAs
Product News  
11/30/2001   Post a comment
Micrel has entered the electroluminescent lamp driver IC market with two chips that convert a 1.8- to 5.5-volt input voltage to a high-voltage ac signal capable of driving an EL lamp in a cell phone, PDA, remote controller or other device.
Frame grabber works with fast cameras
Product News  
11/30/2001   Post a comment
Data Translation Inc.'s DT3162 is a variable-scan monochrome frame grabber that offers higher-speed data acquisition for newer, faster cameras.
Low-power 16-bit A/D includes gain amp
Product News  
11/30/2001   Post a comment
Asahi Kasei Microsystems (AKM) Semiconductor Inc. is offering a low-power, 16-bit audio analog-to-digital (A/D) converter with a built-in 15-dB gain amplifier for portable video and audio equipment and digital video recorders.
ISP flash supports ADI DSP
Product News  
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Analog Devices says digital audio IC removes analog processing from stereo players
News & Analysis  
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NORWOOD, Mass. -- Analog Devices Inc. today announced a new integrated audio IC aimed at replacing low-cost analog systems designs with new digital processing capability that increases sound quality in consumer automotive and home stereo players.
Chip suits time-code apps
Product News  
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FIFO queuing parts boost nets
Product News  
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Data link first between satellites for Silex system
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The first ever data link between satellites has been established using a laser beam as the signal carrier (pictured).
ICs mate optical transceivers
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Video chips eye low-cost apps
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Pcb pin headers look to cut cost
Product News  
11/30/2001   Post a comment
Weidmuller Inc. has added a 5.08-mm-pitch version, available in two- to 24-pole versions, to its line of liquid-crystal polymer SL-SMT printed-circuit-board pin headers.
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